SIST EN IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden

Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application

IEC 61760-2:2021 est disponible sous forme de IEC 61760-2:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L'IEC 61760-2:2021 spécifie les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en œuvre sans problème des composants pour montage en surface (CMS), tant actifs que passifs. (Les conditions pour les cartes à circuits imprimés ne sont pas prises en compte.) L’objet du présent document est de s’assurer que l’utilisateur de composants pour montage en surface reçoit et emmagasine des produits qui pourront être utilisés (par exemple placés, brasés) sans problème de qualité et de fiabilité. Des conditions de transport et de stockage impropres peuvent provoquer une détérioration des CMS et il en résulte des problèmes d’assemblage tels qu’une mauvaise brasabilité, la séparation des couches métallisées des terminaisons et l’effet "pop-corn". Les références croisées donnant les équivalences entre la présente édition 3 et l’édition 2 du présent document sont énumérées à l’Annexe X du présent document.

Tehnologija površinske montaže - 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) - Vodilo za uporabo

General Information

• Status: Published
• Publication Date: 26-Sep-2021
• ICS: 31.020 - Electronic components in general
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 14-Sep-2021
• Due Date: 19-Nov-2021
• Completion Date: 27-Sep-2021
• Ref Project: EN IEC 61760-2:2021 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Relations

• Revised: SIST EN 61760-2:2007 - Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
• Effective Date: 24-Dec-2019
• Replaces: SIST EN 61760-2:2007 - Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
• Effective Date: 07-Sep-2021

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61760-2:2021
01-november-2021
Nadomešča:
SIST EN 61760-2:2007
Tehnologija površinske montaže - 2. del: Pogoji pri prevažanju in shranjevanju
sestavov za površinsko montažo (SMD) - Vodilo za uporabo

Surface mounting technology - Part 2: Transportation and storage conditions of surface

mounting devices (SMD) - Application guide
Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von
oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden

Technique du montage en surface - Partie 2: Conditions de transport et de stockage des

composants pour montage en surface (CMS) - Guide d'application
Ta slovenski standard je istoveten z: EN IEC 61760-2:2021
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN IEC 61760-2:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61760-2:2021
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SIST EN IEC 61760-2:2021
EUROPEAN STANDARD EN IEC 61760-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2021
ICS 31.240 Supersedes EN 61760-2:2007 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 2: Transportation and
storage conditions of surface mounting devices (SMD) -
Application guide
(IEC 61760-2:2021)

Technique du montage en surface - Partie 2: Conditions de Oberflächenmontagetechnik - Teil 2: Transport- und

transport et de stockage des composants pour montage en Lagerungsbedingungen von oberflächenmontierbaren

surface (CMS) - Guide d'application Bauelementen (SMD) - Anwendungsleitfaden
(IEC 61760-2:2021) (IEC 61760-2:2021)

This European Standard was approved by CENELEC on 2021-08-20. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 61760-2:2021 E
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SIST EN IEC 61760-2:2021
EN IEC 61760-2:2021 (E)
European foreword

The text of document 91/1666/CDV, future edition 3 of IEC 61760-2, prepared by IEC/TC 91

“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 61760-2:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022–05–20

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024–08–20

document have to be withdrawn

This document supersedes EN 61760-2:2007 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 61760-2:2021 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 60286-3 NOTE Harmonized as EN IEC 60286-3
IEC 60286-4 NOTE Harmonized as EN 60286-4
IEC 60286-5 NOTE Harmonized as EN IEC 60286-5
IEC 60286-6 NOTE Harmonized as EN 60286-6
IEC 60749 (series) NOTE Harmonized as EN 60749 (series)
IEC 60749-20-1:2019 NOTE Harmonized as EN IEC 60749-20-1:— (not modified)
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1
IEC 61760-4:2015 NOTE Harmonized as EN 61760-4:2015 (not modified)
IEC 62435 (series) NOTE Harmonized as EN IEC 62435 (series)
To be published. Stage at the time of publication: prEN IEC 60749-20-1:2019.
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SIST EN IEC 61760-2:2021
EN IEC 61760-2:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 60721-3-1 2018 Classification of environmental conditions - EN IEC 60721-3-1 2018

Part 3–1: Classification of groups of
environmental parameters and their
severities - Storage

IEC 60721-3-2 2018 Classification of environmental conditions - EN IEC 60721-3-2 2018

Part 3–2: Classification of groups of
environmental parameters and their
severities - Transportation and handling
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SIST EN IEC 61760-2:2021
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SIST EN IEC 61760-2:2021
IEC 61760-2
Edition 3.0 2021-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
Technique du montage en surface –
Partie 2: Conditions de transport et de stockage des composants pour montage
en surface (CMS) – Guide d’application
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-1002-8

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 61760-2:2021
– 2 – IEC 61760-2:2021 © IEC 2021
CONTENTS

FOREWORD ......................................................................................................................... 3

1 Scope ............................................................................................................................ 5

2 Normative references..................................................................................................... 5

3 Terms and definitions .................................................................................................... 5

4 General conditions ......................................................................................................... 5

5 Transportation conditions ............................................................................................... 6

5.1 General transportation conditions .......................................................................... 6

5.2 Special transportation conditions ........................................................................... 6

5.2.1 General ......................................................................................................... 6

5.2.2 Category 1 (advised for all products) .............................................................. 6

5.2.3 Category 2 ..................................................................................................... 7

6 Storage conditions ......................................................................................................... 7

7 Related issues ............................................................................................................... 8

Annex A (informative) Transportation and storage conditions ................................................ 9

Annex X (informative) Cross-references for references to the previous edition of this

document ........................................................................................................................... 14

Bibliography ....................................................................................................................... 15

Figure A.1 – Consolidation of mechanical conditions ........................................................... 12

Table A.1 – Classification of climatic conditions according to IEC 60721-3-2:2018,

Table 1 ............................................................................................................................... 10

Table A.2 – Classification of mechanical conditions according to IEC 60721-3-2:2018,

Table 5 ............................................................................................................................... 11

Table A.3 – Storage conditions according to IEC 60721-3-1:2018, Table 1 ........................... 13

Table X.1 – Cross-references .............................................................................................. 14

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SIST EN IEC 61760-2:2021
IEC 61760-2:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61760-2 has been prepared by IEC technical committee 91: Electronics assembly

technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1666/CDV 91/1708/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

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SIST EN IEC 61760-2:2021
– 4 – IEC 61760-2:2021 © IEC 2021

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

Cross-references for references from this edition 3 to the previous edition 2 of this document

are listed in Annex X of this document.

A list of all parts in the IEC 61760 series, published under the general title Surface mounting

technology, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 61760-2:2021
IEC 61760-2:2021 © IEC 2021 – 5 –
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
1 Scope

This International Standard specifies the transportation and storage conditions for surface

mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface

mounting devices, both active and passive. (Conditions for printed boards are not taken into

consideration.)

The object of this document is to ensure that users of SMDs receive and store products that

can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.

Improper transportation and storage of SMDs can cause deterioration and result in assembly

problems such as p
...