ITIV - Electronics assembly technology and Environmental standardization

This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads
themselves. Soldering tests for surface mounting devices (SMD) are described in
IEC 60068‑2‑58.
This document provides procedures for determining the solderability and resistance to soldering
heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead
(Pb), or lead-free alloys.
The procedures in this document include the solder bath method and soldering iron method.
The objective of this document is to ensure that component lead or termination solderability
meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition,
test methods are provided to ensure that the component body can be resistant to the heat load
to which it is exposed during soldering.
NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.
IEC 60068-2-69 (solder bath and solder globule method) can be consulted.

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using
fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7
specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed
circuit boards which are used in electronic or communication equipment and such, equipping
fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Test methods for the characteristics of solder paste in this document are considering the effect
of surface activation force due to the fine sized solder particles which could affect the test result
by existing test methods.

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface
insulation resistance (SIR) in the presence of moisture.
Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized
test coupon are used for the evaluation. Coupons are conditioned and measurements taken at
a high temperature and humidity. The electrodes are electrically biased during conditioning to
facilitate electrochemical reactions, as shown in Figure 1 and Figure 3.
Reference can be made to IEC TR 61189-5-506, which examines different geometry comb
patterns: 400 μm x 500 μm; 400 μm x 200 μm; and 318 μm x 318 μm.
Specifically, this method is designed to simultaneously assess:
• leakage current caused by ionized water films and electrochemical degradation of test
vehicle, (corrosion, dendritic growth);
• provide metrics that can appropriately be used for binary classification (e.g. go/no go;
pass/fail);
• compare, rank or characterize materials and processes.
This test is carried out at high humidity and heat conditions.

IEC 62430:2019 describes principles, specifies requirements and provides guidance for organizations intending to integrate environmental aspects into the design and development in order to minimize the adverse environmental impacts of their products.
This document applies to processes on how ECD (environmentally conscious design) are integrated into the design and development. This document applies to any organization, regardless of its size, type or sector.
This document does not provide requirements for assessing the conformity of individual products.
This horizontal standard is primarily intended for use by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 108.
One of the responsibilities of a technical committee is, wherever applicable, to make use of horizontal standards in the preparation of its publications. The contents of this horizontal standard will not apply unless specifically referred to or included in the relevant publications.
IEC 62430:2019 cancels and replaces the first edition published in 2009. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Scope is extended from electrotechnical product and systems to all products including services.
b) As a consequence of the scope expansion, non-electrotechnical products, services in particular, are taken into account to modify requirements.
c) Clause 6 is added as a guidance.

This part of IEC 61760 gives a reference set of requirements, process conditions and related
test conditions to be used when compiling specifications of electronic components that are
intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole
reflow and surface mounting components can be subjected to the same placement and
mounting processes. Hereto, this document defines test and requirements that need to be part
of any component generic, sectional or detail specification, when through-hole reflow soldering
is intended.
Furthermore, this document provides component users and manufacturers with a reference set
of typical process conditions used in through-hole reflow soldering technology.

This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance
of a pre-selected material set on a representative test coupon and quantifies the deleterious
effects of improperly used materials and processes that can lead to decreases in electrical
resistance.
An assembly process involves a number of different process materials including solder flux,
solder paste, solder wire, underfill materials, adhesives, staking compounds, temporary
masking materials, cleaning solvents, conformal coatings and more. The test employs two
different test conditions of 85 °C and 85 % relative humidity (RH), preferred for a process that
includes cleaning, or 40 °C and 90 % relative humidity (RH), preferred for processes where no
cleaning is involved.
NOTE 40 °C and 93 % RH can be used as an alternative to 40 °C and 90 % RH. Additional information is provided
in 5.4 and A.5.2.
Testing is material (set) and process / equipment specific. Qualifications are to be performed
using the production intent equipment, processes and materials.

This part of IEC 61189 specifies the reflow soldering ability test method for components
mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid
printed boards, and the reflow soldering ability test method for the lands of organic rigid printed
boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or
lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass
laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the
lands of the printed boards. In addition, test methods are provided to ensure that the printed
boards can resist the heat load to which they are exposed during soldering.
This document covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 listed in Table 1:

This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.

This document defines product category rules (PCR) for electronic and electrical products and systems (EEPS).
It specifies the process and requirements on how to conduct life cycle assessment in the context of
environmental declarations.
PCR is complemented by additional product-specific rules (PSR), which further define e.g. functional units and
default scenarios in the product-specific context. Therefore, it also provides guidance on how to develop PSR
in corresponding technical committees.
This document provides common rules for:
a) life cycle assessment (LCA), including the requirements for developing default scenarios;
b) the LCA report;
c) the development of product specific rules.
This document provides further guidelines for environmental declarations.
The basic LCA principles and framework are based on the EN ISO 14040 series of standards (i.e EN ISO 14040
and ISO 14044), and therefore out of scope of the standard.

This European Standard is applicable to the processes relating to the preparing for re-use of WEEE.
NOTE 1   This European Standard covers the preparing for re-use of WEEE arising from electrical and electronic equipment as listed in Annex I and Annex III of Directive 2012/19/EU.
This European Standard is applicable to preparing for re-use operators only and does not cover activities connected with used or second-hand equipment that have not become waste. It applies to all preparing for re-use operators, no matter their size or main focus of activity.
This European Standard assists in quantifying re-use, recycling and recovery rates in conjunction with EN 50625-1.
In case of treatment operations (including the collection and logistics of WEEE) other than preparing for re-use the EN 50625 series applies.
Preparing for re-use processes can include the removal of whole components or parts where they are intended to either be used in the repair of faulty equipment or sold as re-use parts.
The following EEE are not in the scope of this standard:
-    industrial monitoring and control instruments;
-    in vitro diagnostic medical devices, medical devices or active implantable devices.
NOTE 2   Examples of industrial monitoring and control instruments include equipment intended for use in potentially explosive atmospheres, and monitoring and control equipment that performs a safety function as part of industrial control system.
NOTE 3   In vitro diagnostic medical devices, medical devices and active implantable devices have the capacity to collect and harbour pathogens, depending on the environment in which they operated. It is essential to follow clinically proven means for decontamination. Relevant Directives are 93/42/EEC and 98/79/EC.

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

This standard specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of
electric or electronic components and mechanical parts such as punched/stamped parts (for
example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit
pins and other mechanical parts used in electronic assemblies) representing the finished
stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds,
plastics and the like during the required test flow are not considered or assessed. The test
methods have been developed by using a knowledge-based approach.
This document can also be used at sub-suppliers, like plating shops, stamping shops or other
service providers to ensure a consistent surface quality within the supply chain.
These test methods are employed with defined acceptance criteria by a relevant component
or application specification.
The tests described in this document are applicable for initial qualification, for periodic
monitoring in accordance with Clause 7, and for changes of technology or manufacturing
processes of existing surfaces in accordance with Clause 9.
The mating area of connectors is not covered by this test method. IEC 60512-16-21 applies
for the mating areas of connectors.

This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The
requirements pertain to those assemblies that are entirely terminal/wire interconnecting
structures or to the terminal/wire portions of those assemblies that include other related
technologies (i.e. surface mounting, through-hole mounting, chip mounting).

This document specifies the procedure, content, and form relating to material declarations for
products and accessories of organizations operating in and supplying to the electrotechnical
industry. Process chemicals, emissions during product use and product packaging material
are not in the scope of this document.
The main intended use of this document is to provide data up and down the supply chain that:
• allows organizations to assess products against substance compliance requirements,
• allows organizations to use this information in their environmentally conscious design
process and across all product life cycle phases.
This document specifies mandatory declaration requirements and also provides optional
declaration requirements.
This document does not suggest any specific method or process to capture material
declaration data in the supply chain. However, it provides a data format used to transfer
information within the supply chain. Organizations have the flexibility to determine the most
appropriate method to capture material declaration data without compromising data utility and
quality. This document is intended to allow reporting based on engineering judgement,
supplier material declarations, and/or sampling and testing.

This document specifies the technical documentation that the manufacturer compiles in order
to declare compliance with the applicable substance restrictions.
The documentation of the manufacturer’s management system is outside the scope of this
document.

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined
to be (2,0 ± 0,30) W/(m•K).

This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.

IEC 61249-2-45:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (1,0 ± 0,15) W/(m•K).

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to be 105 °C minimum. Thermal Conductivity is defined
to be (1,5 ± 0,2) W/(m•K).

This Technical Report provides information on the alignment between Directive 2012/19/EU and EN 50625 series standards and EN 50614.

IEC corrigendum

This document applies to labels on the packaging of electronic components for automatic
handling in B2B processes. These labels use linear bar code and two-dimensional (2D)
symbols. Labels for direct product marking and shipping labels are excluded. Labels required
on the packaging of electronic components that are intended for the retail channel of
distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identification and
automatic handling of components in electronics assembly lines. Intended applications include
systems that automate the control of component packages during production, inventory and
distribution.

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test
method for the erosion of the metal materials without or with surface processing intended to
be used for lead-free wave soldering equipment as a solder bath and other components which
are in contact with the molten solder.

This part of IEC 61191 gives the requirements for surface mount solder connections. The
requirements pertain to those assemblies that are totally surface mounted or to the surface
mounted portions of those assemblies that include other related technologies (e.g. throughhole,
chip mounting, terminal mounting, etc.).

Clause 1 is replaced with the following:
This European Technical Specification is intended to be used in conjunction with the WEEE Treatment Standard for photovoltaic panels, FprEN 50625-2-4 and Technical Specification for de-pollution - General CLC/TS 50625-3-1:2015.

This clause of part 1 is replaced with the following:
This European Standard is applicable to the treatment of photovoltaic panels as mentioned in the WEEE Directive under Annex 4.
The scope of this document is limited to photovoltaic panels with a minimum surface area of 0,2 m2.
This European Standard applies to the treatment of photovoltaic panels until end-of-waste status is fulfilled, or photovoltaic panel fractions are recycled, recovered or disposed.
This European Standard addresses all operators involved in the treatment including related handling, sorting and storage of photovoltaic panels. This European Standard applies to all facilities including those whose treatment operations using mobile treatment installation.

This European Standard is applicable to the treatment of waste temperature exchange equipment and other WEEE containing VFC or VHC in refrigerants or blowing agents.
This European Standard applies to the treatment of temperature exchange equipment until end-of-waste status is fulfilled, or temperature exchange equipment fractions are recycled, recovered, or disposed of.
This European Standard addresses all operators involved in the treatment including related handling, sorting and storage of temperature exchange equipment.

This Technical Specification is intended to be used in conjunction with the WEEE Treatment Standard for temperature exchange equipment, EN 50625-2-3, and the Technical Specification for de-pollution, CLC/TS 50625 3-1.

Clause 1 of CLC/TS 50625-3-1:2015 is replaced with the following:
This European Technical Specification is intended to be used in conjunction with CLC/TS 50625-3-1 Collection, logistics and treatment requirements for WEEE - Part 1: General treatment requirements, EN 50625 1, Collection, logistics and Treatment requirements for WEEE - Part 2-2: Treatment requirements for WEEE containing CRTs and flat panel displays, EN 50625-2-2 and Collection, logistics and treatment requirements for WEEE - Part 3-1: Specification for de-pollution - General, CLC/TS 50625-3-1.

This part of IEC 61188 establishes a consistent technique for the description of electronic
component orientation, and their land pattern geometries. This facilitates and encourages a
common data capture and transfer methodology amongst and between global trading partners.

This Technical Specification addresses the processes regarding the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE.
NOTE 1   For the treatment of WEEE EN 50625-1 applies.
This Technical Specification relates to the chemical and metallurgical processes used for the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE, thereby differentiating it from manual/mechanical processing (see Annex A).
All chemical and metallurgical processes are included up and until the output materials will be used for their original purpose or for other purposes or will be finally disposed of.
NOTE 2   The main precious metals concerned are gold, silver, and palladium.
NOTE 3   The majority of the WEEE volumes that are processed by final treatment operators consists of fractions of WEEE (e.g. circuit boards) containing copper and/or precious metals, however there may be whole small WEEE that can be treated directly in final treatment (e.g. USB sticks).
NOTE 4   Chemical and metallurgical processes are processes in which a chemical reaction takes place for example: pyrolysis, smelting, refining, solvent extraction, ion exchange, leaching/dissolution in water acids or base, precipitation, cementation, pressure leaching. They differ from mechanical / physical processes such as sorting and separation based on physical properties (e.g. density, magnetism, colour) and size reduction processes such as shredding and grinding.
NOTE 5   In general, these final treatment facilities are covered by the IED 2010/75/EU, e.g. copper smelters or refiners.

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF)
and specifies not only the steady-state temperature and humidity test, but also a temperaturehumidity
cyclic test and an unsaturated pressurized vapour test (HAST).

This part of IEC 62321 describes procedures to measure hexavalent chromium, Cr(VI), quantitatively in samples of polymers and electronics. This method employs organic solvent to dissolve or swell the sample matrix, followed by an alkaline digestion procedure to extract Cr(VI) from samples. Studies have shown that organic/alkaline solution is more effective than  acidic solution in extracting Cr(VI) from soluble and insoluble samples. Minimal reduction of Cr(VI) to Cr(III) or oxidation of Cr(III) to Cr(VI) occurs under alkaline conditions.
For soluble polymers consisting of ABS (Acrylonitrile- butadiene-styrene), PC (Polycarbonate) and PVC (poly(vinyl chloride)), the samples are first dissolved in an appropriate organic solvent and Cr(VI) is then extracted by an alkaline extraction solution.
For insoluble/unknown polymers, or electronic materials that do not contain antimony (Sb), the samples are digested in a toluene/alkaline solution at 150 °C to 160 °C. Then the organic phase in the extracts are separated and discarded; the inorganic phase is retained for Cr(VI) analysis.
The Cr(VI) concentration in the extract is determined by its reaction under acidic conditions  with 1,5-diphenylcarbazide. Cr(VI) is reduced to Cr(III) in the reaction with diphenylcarbazide which is oxidized to diphenylcarbazone. The Cr(III) and diphenylcarbazone form a red-violetcoloured complex in the reaction. The complex solution is measured quantitatively by a colorimeter or a spectrophotometer at 540 nm.

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the
solder globule wetting balance method to determine, quantitatively, the solderability of the
terminations. Data obtained by these methods are not intended to be used as absolute
quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method. They are applicable to components and printed boards with metallic
terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without
lead (Pb).

This part of IEC 62321 specifies two normative and two informative techniques for the
determination of di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl
phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl
phthalate (DINP) and di-iso-decyl phthalate (DIDP) in polymers of electrotechnical products.
Gas chromatography-mass spectrometry (GC-MS) and gas chromatography-mass
spectrometry (Py/TD-GC-MS) techniques are described in the normative part of this document.
The GC-MS method is considered the referee technique for the quantitative determination of
DIBP, DBP, BBP, DEHP, DNOP, DINP and DIDP in the range of 50 mg/kg to 2 000 mg/kg.
The GC-MS coupled with a pyrolyzer/thermal desorption (TD) accessory is suitable for
screening and semi-quantitative analysis of DIBP, DBP, BBP, DEHP, DNOP, DINP, and DIDP
in polymers that are used as parts of the electrotechnical products in the range of 100 mg/kg
to 2 000 mg/kg.
The IAMS technique is suitable for screening and semi-quantitative analysis of DIBP, DBP,
BBP, DEHP, DNOP, DINP, and DIDP. Determination of DBP and DIBP, DEHP and DNOP by
IAMS has not been established due to peak and mass spectral resolution limitations.
The LC-MS technique is limited to the determination of of BBP, DEHP, DNOP, DINP, and
DIDP. Determination of DBP and DIBP by LC-MS has not been established due to peak and
mass spectral resolution limitations.
A flow chart depicting how the normative Py/TD-GC-MS and GC-MS methods and informative
methods using ion attachment mass spectrometry (IAMS) coupled with direct injection probe
(DIP) and liquid chromatography-mass spectrometry (LC-MS) can be used are provided in
annexes of this document.
These four test methods have been evaluated by the test of PE (polyethylene) and PVC
(polyvinyl chloride) materials containing individual phthalates between ~450 mg/kg to
30 000 mg/kg as depicted in the normative and informative parts of this document. The use of
the four methods described in this document for other polymer types, phthalate compounds or
concentration ranges other than those specified above has not been specifically evaluated.

This Technical Specification applies to the following operations: collection, handling, sorting, storage, preparation for transport and transport of WEEE. It is applicable to all WEEE prior to arriving at the treatment facility or arriving at a preparation for re-use facility.
This Technical Specification addresses all operators that perform collection and logistics operations.
This technical specification does not cover treatment of WEEE. In case of treatment activities undertaken at collection or logistics facilities the Standard EN 50625-1 applies.

This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of
printed board and assembly materials, expected to be determined 2 to 10 of relative
permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

This part of IEC 62739 provides an evaluating test method for the erosion of the metallic
materials with surface processing intended to be used for lead-free wave soldering equipment
as a solder bath and other components which are in contact with the molten solder. It aims at
prevention of an accident or a fire by predicting a setup and life of a suitable maintenance
cycle.

This part of IEC 60068 provides background information and guidance for writers and users of
specifications for electric and electronic components, containing references to the test
standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to
IEC 61760-1, which defines requirements to the specification of surface mounting
components.