EN IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden

Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application

IEC 61760-2:2021 est disponible sous forme de IEC 61760-2:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 61760-2:2021 spécifie les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en œuvre sans problème des composants pour montage en surface (CMS), tant actifs que passifs. (Les conditions pour les cartes à circuits imprimés ne sont pas prises en compte.) L’objet du présent document est de s’assurer que l’utilisateur de composants pour montage en surface reçoit et emmagasine des produits qui pourront être utilisés (par exemple placés, brasés) sans problème de qualité et de fiabilité. Des conditions de transport et de stockage impropres peuvent provoquer une détérioration des CMS et il en résulte des problèmes d’assemblage tels qu’une mauvaise brasabilité, la séparation des couches métallisées des terminaisons et l’effet "pop-corn". Les références croisées donnant les équivalences entre la présente édition 3 et l’édition 2 du présent document sont énumérées à l’Annexe X du présent document.

Tehnologija površinske montaže - 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) - Vodilo za uporabo

General Information

• Status: Published
• Publication Date: 02-Sep-2021
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 03-Sep-2021
• Completion Date: 03-Sep-2021
• Ref Project: SIST EN IEC 61760-2:2021 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Relations

• Replaces: EN 61760-2:2007 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
• Effective Date: 07-Sep-2021

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61760-2:2021
01-november-2021
Nadomešča:
SIST EN 61760-2:2007
Tehnologija površinske montaže - 2. del: Pogoji pri prevažanju in shranjevanju
sestavov za površinsko montažo (SMD) - Vodilo za uporabo
Surface mounting technology - Part 2: Transportation and storage conditions of surface
mounting devices (SMD) - Application guide
Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von
oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden
Technique du montage en surface - Partie 2: Conditions de transport et de stockage des
composants pour montage en surface (CMS) - Guide d'application
Ta slovenski standard je istoveten z: EN IEC 61760-2:2021
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN IEC 61760-2:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61760-2:2021

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SIST EN IEC 61760-2:2021


EUROPEAN STANDARD EN IEC 61760-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2021
ICS 31.240 Supersedes EN 61760-2:2007 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 2: Transportation and
storage conditions of surface mounting devices (SMD) -
Application guide
(IEC 61760-2:2021)
Technique du montage en surface - Partie 2: Conditions de Oberflächenmontagetechnik - Teil 2: Transport- und
transport et de stockage des composants pour montage en Lagerungsbedingungen von oberflächenmontierbaren
surface (CMS) - Guide d'application Bauelementen (SMD) - Anwendungsleitfaden
(IEC 61760-2:2021) (IEC 61760-2:2021)
This European Standard was approved by CENELEC on 2021-08-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61760-2:2021 E

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SIST EN IEC 61760-2:2021
EN IEC 61760-2:2021 (E)
European foreword
The text of document 91/1666/CDV, future edition 3 of IEC 61760-2, prepared by IEC/TC 91
“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-2:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022–05–20
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024–08–20
document have to be withdrawn
This document supersedes EN 61760-2:2007 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61760-2:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60286-3 NOTE Harmonized as EN IEC 60286-3
IEC 60286-4 NOTE Harmonized as EN 60286-4
IEC 60286-5 NOTE Harmonized as EN IEC 60286-5
IEC 60286-6 NOTE Harmonized as EN 60286-6
IEC 60749 (series) NOTE Harmonized as EN 60749 (series)
1
IEC 60749-20-1:2019
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