31.040.30 - Thermistors

EN-IEC 60539-2 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted direc...view more

IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted direc...view more

This part of IEC 60539 is applicable to directly heated negative temperature coefficient
thermistors, typically made from transition metal oxide materials with semiconducting
properties.
It establishes standard terms, inspection procedures and methods of test for use in sectional
and detail specifications of electronic components for quality assessment or any other
purpose.

IEC 60539-1:2016 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxi...view more

IEC 60539-1:2016 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxi...view more

Amandma A1:2010 je dodatek k standardu SIST EN 60539-2:2004
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

Amandma A1:2010 je dodatek k standardu SIST EN 60539-2:2004
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

IEC 60738-1:2006+A1:2009 Prescribes terms and methods of test for positive step-function temperature coefficient thermistors, insulated and non-insulated types typically made from ferro-electric semi-conductor materials. It establishes standard terms, inspection procedures and methods of test for use in detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components.
This consolidated version consists of the third edition (2006) and its amendment ...view more

This blank detail specification is a supplementary  document to the generic specification and contains  requirements for style and layout and minimum  content of detail specifications.

This blank detail specification is a supplementary  document to the generic specification and contains  requirements for style and layout and minimum  content of detail specifications.

This blank detail specification is a supplementary  document to the generic specification and contains  requirements for style and layout and minimum  content of detail specifications.

This blank detail specification is a supplementary  document to the generic specification and contains  requirements for style and layout and minimum  content of detail specifications.

Is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006,1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the...view more

is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006,1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the...view more