EN IEC 60539-2:2019
(Main)Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. This edition includes the following significant technical changes with respect to the previous edition: a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016; b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1 have been added; c) the dimensions of 0402M in Annex A have been added.
Direkt geheizte temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten - Teil 2: Rahmenspezifikation - Oberflächenmontierbare temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten
Thermistances à coefficient de température négatif à chauffage direct - Partie 2: Spécification intermédiaire - Thermistances à coefficient de température négatif pour montage en surface
IEC 60539-2:2019 est disponible sous forme de IEC 60539-2:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 60539-2:2019 s'applique aux thermistances à coefficient de température négatif à chauffage direct pour montage en surface, typiquement constituées de matériaux faits d'oxyde de métal de transition dotés de propriétés semi-conductrices. Ces thermistances sont équipées de contacts de connexion métallisés ou de bandes de brasure et sont destinées à être montées directement sur des substrats pour circuits hybrides ou sur des cartes imprimées. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) révision de la structure conformément aux directives ISO/IEC, Partie 2:2016 (septième édition), dans la mesure du possible, et pour l'harmonisation avec l'IEC 60539-1:2016; b) les températures maximales de catégorie 175 °C, 200 °C, 250 °C, 315 °C, 400 °C ont été ajoutées dans le Tableau 1; c) les dimensions de 0402M à l'Annexe A ont été ajoutées.
Neposredno ogrevani termistorji z negativnim temperaturnim koeficientom - 2. del: Področna specifikacija - Termistorji z negativnim temperaturnim koeficientom za površinsko montažo (IEC 60539-2:2019)
Standard EN-IEC 60539-2 se uporablja za neposredno ogrevane termistorje z negativnim temperaturnim koeficientom za površinsko montažo, ki so običajno izdelani iz materialov prehodnega kovinskega oksida s polprevodniškimi lastnostmi. Ti termistorji imajo metalizirane priključne blazinice ali varilne trakove ter so namenjeni namestitvi neposredno na podloge za hibridne tokokroge ali na tiskana vezja.
General Information
Relations
Overview
EN IEC 60539-2:2019 (CLC) is the sectional specification for surface mount directly heated negative temperature coefficient (NTC) thermistors. It complements the generic requirements in IEC 60539-1 and applies to SMD NTC thermistors typically made from transition metal oxide semiconducting materials with metallized connecting pads or soldering strips intended for mounting on printed boards or hybrid substrates. This edition is published as an IEC International Standard and an RLV (redline) showing technical changes from the previous edition.
Key Topics
- Scope and structure aligned with ISO/IEC Directives, Part 2:2016 and harmonized with IEC 60539-1:2016.
- Component definition: surface mount NTC thermistors (SMD thermistors) with metallized terminations.
- Electrical characteristics: requirements and test methods for zero-power resistance, B‑value (or resistance ratio) and resistance/temperature characteristic.
- Thermal characteristics: dissipation factor (δ) and thermal time constant (τ) by cooling after self‑heating.
- Soldering and solderability: tests for resistance to soldering heat and solderability (including test conditions and recovery).
- Environmental and mechanical tests: rapid change of temperature, thermal shock, damp heat (steady state), endurance (including upper category temperature tests), shear (adhesion), substrate bending, and solvent/marking resistance.
- Quality assessment: Annex B provides qualification, lot-by-lot inspection and sampling plans; Annex A guides dimension coding (0402M dimension added).
- Category temperatures: Table 1 expanded with upper category temperatures 175 °C, 200 °C, 250 °C, 315 °C and 400 °C.
Applications
EN IEC 60539-2:2019 is essential for:
- Specifying and verifying SMD NTC thermistors used for temperature sensing, inrush current limiting (where applicable), and circuit protection on PCBs and hybrid modules.
- Ensuring reliable performance in applications requiring high-temperature endurance and soldering robustness (e.g., automotive electronics, industrial controls, power electronics).
- Defining dimensional coding and footprint compatibility (Annex A updates including 0402M).
Who should use this standard
- Component manufacturers and designers producing surface mount NTC thermistors
- Electronic component procurement and quality assurance teams
- Test laboratories performing environmental, electrical and solderability testing
- Electronic system designers and PCB assembly engineers specifying SMD thermistor requirements
Related standards
- IEC 60539-1:2016 (Generic specification)
- IEC 60068-2‑xx series (environmental testing)
- IEC 61193-2 (sampling plans and quality assessment)
Keywords: EN IEC 60539-2:2019, surface mount NTC thermistors, SMD thermistors, negative temperature coefficient thermistors, solderability, dissipation factor, zero-power resistance, thermal time constant.
Frequently Asked Questions
EN IEC 60539-2:2019 is a standard published by CLC. Its full title is "Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors". This standard covers: IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. This edition includes the following significant technical changes with respect to the previous edition: a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016; b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1 have been added; c) the dimensions of 0402M in Annex A have been added.
IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. This edition includes the following significant technical changes with respect to the previous edition: a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016; b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1 have been added; c) the dimensions of 0402M in Annex A have been added.
EN IEC 60539-2:2019 is classified under the following ICS (International Classification for Standards) categories: 31.040.30 - Thermistors. The ICS classification helps identify the subject area and facilitates finding related standards.
EN IEC 60539-2:2019 has the following relationships with other standards: It is inter standard links to EN 60539-2:2004/A1:2010, EN 60539-2:2004. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase EN IEC 60539-2:2019 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of CLC standards.
Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2019
Nadomešča:
SIST EN 60539-2:2004
SIST EN 60539-2:2004/A1:2010
Neposredno ogrevani termistorji z negativnim temperaturnim koeficientom - 2. del:
Področna specifikacija - Termistorji z negativnim temperaturnim koeficientom za
površinsko montažo (IEC 60539-2:2019)
Directly heated negative temperature coefficient thermistors - Part 2: Sectional
specification - Surface mount negative temperature coefficient thermistors (IEC 60539-
2:2019)
Direkt geheizte temperaturabhängige Widerstände mit negativem
Temperaturkoeffizienten - Teil 2: Rahmenspezifikation - Oberflächenmontierbare
temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten (IEC 60539-
2:2019)
Thermistances à coefficient de température négatif à chauffage direct - Partie 2:
Spécification intermédiaire - Thermistances à coefficient de température négatif pour
montage en surface (IEC 60539-2:2019)
Ta slovenski standard je istoveten z: EN IEC 60539-2:2019
ICS:
31.040.30 Termistorji Thermistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60539-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2019
ICS 31.040.30 Supersedes EN 60539-2:2004 and all of its amendments
and corrigenda (if any)
English Version
Directly heated negative temperature coefficient thermistors -
Part 2: Sectional specification - Surface mount negative
temperature coefficient thermistors
(IEC 60539-2:2019)
Thermistances à coefficient de température négatif à Direkt geheizte temperaturabhängige Widerstände mit
chauffage direct - Partie 2: Spécification intermédiaire - negativem Temperaturkoeffizienten - Teil 2:
Thermistances à coefficient de température négatif pour Rahmenspezifikation - Oberflächenmontierbare
montage en surface temperaturabhängige Widerstände mit negativem
(IEC 60539-2:2019) Temperaturkoeffizienten
(IEC 60539-2:2019)
This European Standard was approved by CENELEC on 2019-08-28. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60539-2:2019 E
European foreword
The text of document 40/2672/FDIS, future edition 2 of IEC 60539-2, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN IEC 60539-2:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-05-23
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-08-23
document have to be withdrawn
This document supersedes EN 60539-2:2004 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60539-2:2019 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-2 2007 Environmental testing - Part 2-2: Tests - EN 60068-2-2 2007
Test B: Dry heat
IEC 60068-2-14 2009 Environmental testing - Part 2-14: Tests - EN 60068-2-14 2009
Test N: Change of temperature
IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - EN 60068-2-58 2015
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
+ A1 2017 + A1 2018
IEC 60068-2-78 - Environmental testing - Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60539-1 2016 Directly heated negative temperature EN 60539-1 2016
coefficient thermistors - Part 1: Generic
specification
IEC 61193-2 2007 Quality assessment systems - Part 2: EN 61193-2 2007
Selection and use of sampling plans for
inspection of electronic components and
packages
IEC 60539-2 ®
Edition 2.0 2019-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Directly heated negative temperature coefficient thermistors –
Part 2: Sectional specification – Surface mount negative temperature coefficient
thermistors
Thermistances à coefficient de température négatif à chauffage direct –
Partie 2: Spécification intermédiaire – Thermistances à coefficient de
température négatif pour montage en surface
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.30 ISBN 978-2-8322-7098-1
– 2 – IEC 60539-2:2019 IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Information to be given in a detail specification . 7
4.1 General . 7
4.2 Outline drawing and dimensions . 7
4.3 Mounting . 7
4.4 Ratings and characteristics . 7
4.4.1 Particular characteristics . 7
4.4.2 Marking . 7
5 Preferred ratings and characteristics . 7
5.1 Tolerances on rated zero-power resistance . 7
5.2 Climatic categories . 8
6 Quality assessment procedures . 8
7 Test and measurement procedures . 8
7.1 Mounting . 8
7.2 Drying and recovery . 8
7.2.1 Drying . 8
7.2.2 Recovery . 8
7.3 Visual examination and check of dimensions . 8
7.3.1 Visual examination . 8
7.3.2 Requirements . 9
7.3.3 Marking . 10
7.3.4 Dimensions . 11
7.4 Electrical tests . 11
7.4.1 Zero-power resistance . 11
7.4.2 B-value or resistance ratio . 11
7.4.3 Resistance/temperature characteristic . 11
7.5 Thermal tests . 12
7.5.1 Dissipation factor (δ) . 12
7.5.2 Thermal time constant by cooling after self-heating (τ ) . 12
c
7.6 Resistance to soldering heat . 12
7.6.1 General . 12
7.6.2 Initial measurement . 12
7.6.3 Test conditions . 12
7.6.4 Recovery . 12
7.6.5 Final inspection, measurements and requirements. 12
7.7 Solderability . 13
7.7.1 General . 13
7.7.2 Test conditions . 13
7.7.3 Recovery . 13
7.7.4 Final inspection, measurements and requirements. 13
7.8 Rapid change of temperature . 13
7.9 Thermal shock . 13
IEC 60539-2:2019 IEC 2019 – 3 –
7.10 Damp heat, steady state . 14
7.11 Endurance . 14
7.11.1 Endurance at T and P . 14
3 max
7.11.2 Endurance at upper category temperature . 15
7.12 Shear (adhesion) test . 15
7.13 Substrate bending test . 15
7.14 Component solvent resistance . 15
7.15 Solvent resistance of marking . 15
Annex A (normative) Guide for the specification and coding of dimensions of surface
mount negative temperature coefficient thermistors . 16
Annex B (normative) Quality assessment procedure . 17
B.1 Primary stage of manufacture . 17
B.2 Structurally similar components . 17
B.3 Qualification approval procedures . 17
B.4 Quality conformance inspection . 17
B.4.1 General . 17
B.4.2 Qualification approval on the basis of the fixed sample size procedure . 17
B.5 Quality conformance inspection . 19
B.5.1 Formation of inspection lots . 19
B.5.2 Test schedule . 20
B.5.3 Delayed delivery . 20
B.5.4 Assessment level . 20
Figure 1 – Fault: fissure or defect . 9
Figure 2 – Fault: crack . 9
Figure 3 – Separation or delamination . 9
Figure 4 – Exposed electrodes . 10
Figure 5 – Principal faces . 10
Figure 6 – Principal terminations – Gull wing . 11
Figure 7 – Principal terminations – Round termination . 11
Figure A.1 – Dimensioning of surface mount thermistors . 16
Table 1 – Upper and lower category temperatures and duration of the damp heat test . 8
Table A.1 – Dimensions . 16
Table B.1 – Fixed sample size test schedule for qualification approval of surface mount
negative temperature coefficient thermistors Assessment level EZ . 19
Table B.2 – Lot-by-lot inspection . 20
Table B.3 – Periodic test . 21
– 4 – IEC 60539-2:2019 IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DIRECTLY HEATED NEGATIVE TEMPERATURE
COEFFICIENT THERMISTORS –
Part 2: Sectional specification –
Surface mount negative temperature coefficient thermistors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60539-2 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This second edition cancels and replaces the first edition published in 2003 and Amendment
1:2010. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh
edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016;
b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1
have been added;
c) the dimensions of 0402M in Annex A have been added.
IEC 60539-2:2019 IEC 2019 – 5 –
The text of this International Standard is based on the following documents:
FDIS Report on voting
40/2672/FDIS 40/2680/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60539 series, published under the general title Directly heated
negative temperature coefficient thermistors, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 60539-2:2019 IEC 2019
DIRECTLY HEATED NEGATIVE TEMPERATURE
COEFFICIENT THERMISTORS –
Part 2: Sectional specification –
Surface mount negative temperature coefficient thermistors
1 Scope
This part of IEC 60539 is applicable to surface mount directly heated negative temperature
coefficient thermistors, typically made from transition metal oxide materials with
semiconducting properties. These thermistors have metallized connecting pads or soldering
strips and are intended to be mounted directly on to substrates for hybrid circuits or on to
printed boards.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Tests B: Dry heat
IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of
temperature
IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-58:2015/AMD1:2017
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60539-1:2016, Directly heated negative temperature coefficient thermistors – Part 1:
Generic specification
IEC 61193-2:2007, Quality assessment systems – Part 2: Selection and use of sampling plans
for inspection of electronic components and packages
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60539-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
IEC 60539-2:2019 IEC 2019 – 7 –
4 Information to be given in a detail specification
4.1 General
Detail specifications shall be derived from the relevant blank detail specification.
Detail specifications shall not specify requirements inferior to those of the generic, sectional
or blank detail specification. When more severe requirements are included, they shall be
listed in 1.9 of the detail specification and indicated in the test schedules, for example, by an
asterisk.
The information given in 4.2 may for convenience, be presente
...
The article discusses the specifications of EN IEC 60539-2:2019, which pertains to surface mount negative temperature coefficient thermistors. These thermistors are made from transition metal oxide materials and have connecting pads or soldering strips. They are designed to be mounted directly onto substrates for hybrid circuits or printed boards. The updated edition includes revisions to align with ISO/IEC Directives and harmonize with IEC 60539-1:2016. Additionally, the upper temperature categories and dimensions for a specific thermistor size have been added.
記事のタイトル：EN IEC 60539-2:2019-直接加熱型の負の温度係数サーミスタ-第2部：セクション仕様-表面実装用負の温度係数サーミスタ 記事の内容：IEC 60539-2:2019は、以前の版と比較して技術内容の変更を示す国際標準とそのレッドラインバージョンを含むIEC 60539-2:2019 RLVが利用可能です。 IEC 60539-2:2019は、典型的には半導体特性を持つ遷移金属酸化物材料から作られた表面実装用の直接加熱型負の温度係数サーミスタに適用されます。これらのサーミスタには、金属化された接続パッドまたははんだ付けストリップがあり、ハイブリッド回路や印刷基板に直接取り付けることが意図されています。この改訂版では、次の重要な技術的変更が以前の版と比較して含まれています：a）ISO / IEC規則第2部：2016（第7版）に従って構造の修正（実際に可能な範囲で）とIEC 60539-1：2016との調和、b）表1に上限カテゴリの温度として175℃、200℃、250℃、315℃、400℃が追加されました。 c）付録Aに0402Mの寸法が追加されました。
제목: EN IEC 60539-2:2019 - 직접 가열 음온도계(% 이온 계수) 열 저항체 - 제2부: 분야 사양 - 표면 장착 음온도계(% 이온 계수) 2. 기사 내용: IEC 60539-2:2019는 이전 판과 비교하여 기술 콘텐츠의 변경 내용을 보여주는 국제 표준 및 레드 라인 버전이 포함된 IEC 60539-2:2019 RLV로 사용 가능하다. IEC 60539-2:2019은 반도체 속성을 가지고 있는 전이 금속 산화물 재료로 만든 표면 장착 직접 가열 음온도계에 적용되며, 이들 음온도계는 금속화된 연결 패드 또는 속도 조절 스트립을 가지고 있으며 하이브리드 회로 또는 인쇄된 판 위에 직접 장착되도록 되어 있다. 이번 버전에는 다음과 같은 주요 기술적 변경 사항이 이전 버전과 비교하여 포함되어 있다. a) ISO/IEC 지침 2부:2016(제7판)에 따라 구조의 개정(가능한 한) 및 IEC 60539-1:2016과 조화를 이루기 위한 개정, b) 표 1의 상한 범주 온도에 175°C, 200°C, 250°C, 315°C, 400°C가 추가되었으며, c) 부록 A에 0402M의 치수가 추가되었다.
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.
Loading comments...