47D - Semiconductor devices packaging

Specifies a small-scale laboratory screening procedure for comparing the relative burning behaviour of vertically or horizontally oriented specimens made from plastic and other non-metallic materials, exposed to a small-flame ignition source of 50 W nominal power.  These test methods determine the linear burning rate and the afterflame/afterglow times, as well as the damaged length of specimens.  Applicable to solid and cellular materials that have an apparent density of not less than 250 kg/m3,...view more

IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have...view more

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 m...view more

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition...view more

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;...view more

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes ...view more

IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.