ETSI TS 103 465 V16.4.0 (2021-05)

Smart Cards; Smart Secure Platform (SSP); Requirements Specification (Release 16)

RTS/SCP-RSSPvg40

General Information

• Status: Not Published
• Technical Committee: SET REQ - SET-REQ
• Current Stage: 12 - Completion
• Due Date: 26-May-2021
• Completion Date: 11-May-2021

Standards Content (Sample)

TECHNICAL SPECIFICATION
Smart Cards;
Smart Secure Platform (SSP);
Requirements Specification
(Release 16)
Release 16 2 ETSI TS 103 465 V16.4.0 (2021-05)

Reference
RTS/SCP-RSSPvg40
Keywords
interface, secure element, security, UICC

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ETSI
Release 16 3 ETSI TS 103 465 V16.4.0 (2021-05)
Contents
Intellectual Property Rights . 7
Foreword . 7
Modal verbs terminology . 8
Introduction . 8
1 Scope . 9
2 References . 9
2.1 Normative references . 9
2.2 Informative references . 11
3 Definition of terms, symbols and abbreviations . 11
3.1 Terms . 11
3.2 Symbols . 12
3.3 Abbreviations . 13
4 Abstract (informative) . 13
5 SSP concept description . 14
5.1 Introduction . 14
5.2 Core features . 15
5.3 Security . 15
5.4 Electrical characteristics and physical interfaces . 15
5.4.1 Unlinking electrical characteristics of the SSP from its physical interfaces . 15
5.4.2 Operational stages . 15
6 Background (informative) . 16
6.1 Overview of the use cases . 16
6.2 Use Case 1 - Embedded secure element . 16
6.2.1 Overview . 16
6.2.2 Sub use cases . 16
6.2.2.1 Use case 1.1 - Embedded secure element, electrical interface . 16
6.2.2.2 Use case 1.2 - Embedded secure element, physical interface . 17
6.2.2.3 Use case 1.3 - Embedded secure element, independence from hardware form factor . 17
6.2.2.4 Use case 1.4 - Embedded secure element, protocol interface . 17
6.2.3 Interaction with existing features . 17
6.3 Use case 2 - Securing IoT devices . 17
6.3.1 Overview . 17
6.3.2 Sub use cases . 18
6.3.2.1 Use case 2.1 - Management of IoT devices . 18
6.3.2.2 Use case 2.2 - Constrained terminals for M2M . 18
6.3.2.3 Use case 2.3 - General power efficiency . 18
6.3.3 Interaction with existing features . 18
6.4 Use case 3 - Storage of large data . 18
6.4.1 Overview . 18
6.4.2 Sub use cases . 18
6.4.2.1 Use case 3.1 - Storage of large configuration data . 18
6.4.2.2 Use case 3.2 - Storage of identification data . 18
6.4.2.3 Use case 3.3 - Storage of user data . 18
6.4.2.4 Use case 3.4 - Storage of emails . 18
6.4.3 Interaction with existing features (informative) . 18
6.5 Use case 4 - Security token/HSM . 19
6.5.1 Overview . 19
6.5.2 Sub use cases . 19
6.5.2.1 Use case 4.1 - Security for VPN . 19
6.5.2.2 Use case 4.2 - Security token for email . 19
6.5.2.3 Use case 4.3 - Security token for network elements . 19
6.5.2.4 Use case 4.4 - Secure boot . 19
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6.5.3 Interaction with existing features . 19
6.6 Use case 5 - Multiple applications . 19
6.6.1 Overview . 19
6.6.2 Sub use cases . 20
6.6.2.1 Use case 5.1 - Multiple applications active at the same time . 20
6.6.2.2 Use case 5.2 - Multiple applications from independent stakeholders . 20
6.6.3 Interaction with existing features . 20
6.7 Use case 6 - Optimization for LPWA IoT . 20
6.7.1 Overview . 20
6.8 Use case 7 - Tamper resistant secure hardware component for 3GPP next generation system . 21
6.8.1 Overview . 21
6.8.2 Sub use cases . 21
6.8.2.1 Use case 7.1 - Storage and processing of network access credentials . 21
6.8.2.2 Use case 7.2 - Interworking with non-3GPP systems . 21
6.8.3 Interaction with existing features . 21
6.9 Use case 8 - IMEI protection . 21
6.10 Use case 9 - Integrated secure element . 22
6.11 Use case 10 - Evolution of UICC functionality to support 3GPP requirements . 22
6.11.1 Introduction. 22
6.11.2 Existing features . 22
6.11.2.1 Introduction . 22
6.11.2.2 File Storage . 22
6.11.2.2.1 Introduction . 22
6.11.2.2.2 Examples from 3GPP specifications . 23
6.11.2.3 Internet of Things . 23
6.11.2.3.1 Power efficiency . 23
6.11.2.3.2 Hardware flexibility . 25
6.11.2.3.3 Electrical Interface and protocols . 25
6.11.2.4 Toolkit . 25
6.11.2.4.1 User-related applications . 25
6.11.2.4.2 System applications . 26
6.11.2.5 Concurrent operation of applications . 26
6.11.3 Possible new features . 26
6.11.3.0 General . 26
6.11.3.1 Storage of data . 27
6.11.3.1.1 The ability to provide the ME with storage space . 27
6.11.3.1.2 The ability to provide the new secure platform with storage space in the ME . 27
6.11.3.2 Extensibility of functionality . 27
6.11.3.3 Multiple application environment . 27
6.12 Use Case 11 - SSP remote management . 27
6.12.1 Overview . 27
6.12.2 Telecommunication industry use cases . 27
6.13 Use Case X - Discovery service . 28
6.13.1 Overview . 28
7 SSP Classes overview . 28
7.1 Introduction . 28
7.2 iSSP: integrated SSP . 28
7.3 eSSP: embedded SSP . 28
7.3.0 General . 28
7.3.1 eSSP: Type 1. 28
7.3.2 eSSP: Type 2. 28
7.4 rSSP: removable SSP . 28
8 Requirements applicable for all SSP classes . 29
8.1 General . 29
8.1.0 Introduction. 29
8.1.1 General - mandatory requirements . 29
8.1.2 General - optional requirements. 29
8.1.3 General - use case specific requirements . 30
8.2 Application and file structure . 30
8.2.1 SSP applications . 30
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8.2.1.1 SSP applications - mandatory requirements . 30
8.2.1.2 SSP applications - optional requirements . 30
8.2.1.3 SSP applications - use case specific requirements . 30
8.2.2 File system . 31
8.2.2.1 File system - mandatory requirements . 31
8.2.2.2 File system - optional requirements . 31
8.2.2.3 File system - class dependent requirements . 31
8.2.2.4 File system - use case specific requirements . 31
8.2.3 SSP application and file system access conditions . 31
8.2.3.1 SSP application and file system access conditions - mandatory requirements . 31
8.2.3.2 SSP application and file system access conditions - optional requirements. 31
8.2.4 Terminal support for SSP applications . 32
8.2.4.1 Terminal support for SSP applications - mandatory requirements . 32
8.2.4.2 Terminal support for SSP applications - optional requirements . 32
8.3 Protocols . 32
8.3.1 Protocols - mandatory requirements . 32
8.3.2 Protocols - optional requirements . 32
8.3.2.1 SCL network layer requirements . 32
8.3.2.2 SCL Transport layer requirements . 33
8.3.2.3 SCL session layer requirements . 33
8.3.2.4 Presentation layer requirements . 33
8.3.2.5 Common underlying protocol stack requirements . 33
8.3.3 Protocols - class dependent requirements . 33
8.3.3.1 Protocols - requirements for SPI . 33
8.4 Electrical and physical Interface . 34
8.4.1 Electrical and physical Interface - mandatory requirements . 34
8.4.2 Electrical and physical Interface - class dependent requirements . 34
8.4.2.1 Electrical and physical Interface requirements. 34
8.4.2.2 Electrical and physical Interface: SPI requirements . 34
8.4.2.3 Electrical and physical Interface: I2C requirements . 34
8.5 Form factor . 35
8.5.1 Form factor - mandatory requirements . 35
8.6 Security . 35
8.6.1 Security - mandatory requirements . 35
8.6.2 Security - optional requirements . 35
8.7 SSP management . 36
8.7.1 SSP management - mandatory requirements . 36
8.7.2 SSP management - optional requirements . 36
8.8 Backwards compatibility . 36
8.8.1 Backwards compatibility - mandatory requirements . 36
8.8.2 Backwards compatibility - optional requirements . 36
8.9 Primary/secondary platform architecture . 37
8.9.1 Primary/secondary platform architecture - class dependent requirements . 37
8.9.1.1 General . 37
8.9.1.2 Primary/secondary platform external interfaces and SPB provisioning and management . 39
8.9.1.2.1 General description . 39
8.9.1.2.2 Primary/secondary platform external interfaces requirements . 40
8.9.1.2.3 SPB metadata requirements . 41
8.9.1.2.4 SPB provisioning information requirements . 42
8.9.1.2.5 Primary/secondary platform PKI requirements . 42
8.9.1.2.6 SSP discovery service requirements . 43
8.9.1.3 APIs. 43
8.9.1.4 Platform applications . 44
8.9.1.5 Primary/secondary platform security requirements . 44
8.9.1.6 Primary/secondary platform core security requirements . 44
8.9.1.7 Access rights requirements . 44
8.9.1.8 Certification requirements . 45
8.9.1.9 SSP remote management requirements . 45
9 Requirements for iSSP class. 46
9.1 Introduction . 46
9.2 Additional requirements for iSSP . 46
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Release 16 6 ETSI TS 103 465 V16.4.0 (2021-05)
9.2.0 General Requirements . 46
9.2.1 Void (Clause is now 8.9.1.3) . 46
9.2.2 Filesystem . 46
9.2.3 Void (Clause is now 8.9.1.4) . 46
9.2.4 Transport protocol . 46
9.2.5 Link layer protocol. 46
9.2.6 Physical and electrical interface . 47
9.2.7 Form factor . 47
9.2.8 Power modes and related timings . 47
9.2.9 Security . 47
9.2.9.1 Generic security requirements . 47
9.2.9.2 Core platform security requirements . 48
9.2.9.3 Void (Clause is now 8.9.1.7) . 48
9.2.9.4 Void (Clause is now 8.9.1.8) . 48
9.2.9.5 System on chip security requirements . 48
9.2.10 Void (Clause is now 8.9.1.1) . 49
9.2.11 Void (Clause is now 8.9.1.2) . 49
9.2.11.1 Void (Clause is now 8.9.1.2.1) . 49
9.2.11.2 Void (Clause is now 8.9.1.2.2) . 49
9.2.11.3 Void (Clause is now 8.9.1.2.3) . 49
9.2.11.4 Void (Clause is now 8.9.1.2.4) . 49
9.2.11.5 Void (Clause is now 8.9.1.2.5) . 49
10 Requirements for eSSP class . 49
10.1 Introduction . 49
10.2 Additional requirements for the eSSP Type 1 class . 49
10.2.1 Application and file structure. 49
10.2.1.1 SSP application requirements. 49
10.2.1.2 File system . 49
10.2.1.3 SSP application and file system access conditions. 49
10.2.2 Protocols . 50
10.2.2.1 Required protocol support . 50
10.2.3 Electrical and physical Interface . 50
10.2.3.1 General electrical and physical interface requirements . 50
10.2.4 Form factor . 50
10.2.5 Security . 50
10.2.5.1 Generic security requirements . 50
10.2.5.2 Certification requirements . 50
10.2.6 SSP management . 50
10.2.7 Backwards compatibility . 51
10.3 Additional requirements for the eSSP Type 2 class . 51
10.3.1 General requirements . 51
Annex A (normative): Telecom bundle requirements . 52
Annex B (informative): Change history . 53
History . 54

ETSI
Release 16 7 ETSI TS 103 465 V16.4.0 (2021-05)
Intellectual Property Rights
Essential patents
IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The declarations
pertaining to these essential IPRs, if any, are publicly available for ETSI members and non-members, and can be
found in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to
ETSI in respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the
ETSI Web server (https://ipr.etsi.org/).
Pursuant to the ETSI Directives including the ETSI IPR Policy, no investigation regarding the essentiality of IPRs,
including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not
referenced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become,
essential to the present document.
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Members. 3GPP™ and LTE™ are trademarks of ETSI registered for the benefit of its Members and of the 3GPP
Organizational Partners. oneM2M™ logo is a trademark of ETSI registered for the benefit of its Members and of the ®
oneM2M Partners. GSM and the GSM logo are trademarks registered and owned by the GSM Association.
Foreword
This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).
The contents of the present document are subject to continuing work within TC SCP and may change following formal
TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with
an identifying change of release date and an increase in version number as follows:
Version x.y.z
where:
x the first digit:
0 early working draft;
1 presented to TC SCP for information;
2 presented to TC SCP for approval;
3 or greater indicates TC SCP approved document under change control.
y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,
updates, etc.
z the third digit is incremented when editorial only changes have been incorporated in the document.
ETSI
Release 16 8 ETSI TS 103 465 V16.4.0 (2021-05)
Modal verbs terminology
In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and
"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of
provisions).
"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.
Introduction
The current specification of the (e)UICC is based on the ISO/IEC 7816 series [1] of specifications for IC-cards. This
series of specifications has been developed in the 1980s and was suitable at that point in time but today limits the
capabilities that are required by the market. The current (e)UICC specifications also link the form factor to the electrical
interface and the logical protocol. This link limits the (e)UICC implementations to specified form factors.
New requirements are emerging, for example, inspired by embedded secure elements in terminals that are intended to
provide security services or store data securely. Such embedded secure elements may come in different form factors and
are intended to be integrated into the terminals architecture and using electrical and physical interfaces other than those
used by the (e)UICC. Such secure elements could also provide the capability to store large amount of data to be
protected which requires new and more efficient ways to store and manage data.
ETSI
Release 16 9 ETSI TS 103 465 V16.4.0 (2021-05)
1 Scope
The present document defines the use cases and requirements for the definition of the interfaces and protocols for
interfacing with a secure element. This secure element is called Smart Secure Platform (SSP).
2 References
2.1 Normative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
Referenced documents which are not found to be publicly available in the expected location might be found at
https://docbox.etsi.org/Reference.
NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee
their long term validity.
The following referenced documents are necessary for the application of the present document.
[1] ISO/IEC 7816 (all parts): "Identification cards -- Integrated circuit cards".
[2] ETSI TS 102 221: "Smart Cards; UICC-Terminal interface; Physical and logical characteristics".
[3] ETSI TS 102 671: "Smart Cards; Machine to Machine UICC; Physical and logical characteristics".
[4] ETSI TS 102 613: "Smart Cards; UICC - Contactless Front-end (CLF) Interface; Physical and data
link layer characteristics".
[5] SOG-IS: "Protection Profiles".
NOTE: Available at https://www.sogis.eu/uk/pp_en.html.
[6] ETSI TS 102 622: "Smart Cards; UICC - Contactless Front-end (CLF) Interface; Host Controller
Interface (HCI)".
[7] ISO/IEC 7816-3: "Identification cards -- Integrated circuit cards -- Part 3: Cards with contacts --
Electrical interface and transmission protocols".
[8] ISO/IEC 7816-4: "Identification cards -- Integrated circuit cards -- Part 4: Organization, security
and commands for interchange".
[9] ETSI TS 102 600: "Smart Cards; UICC-Terminal interface; Characteristics of the USB interface".
[10] ETSI TS 133 501: "5G; Security architecture and procedures for 5G System (3GPP TS 33.501
Release 15)".
[11] Security IC Platform BSI Protection Profile 2014 with Augmentation Packages.
NOTE: Available at https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf.
[12] Application of Attack Potential to Smartcards (V2.9) (01-2013).
NOTE: Available at https://www.sogis.eu/documents/cc/domains/sc/JIL-Application-of-Attack-Potential-to-
Smartcards-v2-9.pdf.
ETSI
Release 16 10 ETSI TS 103 465 V16.4.0 (2021-05)

[13] GlobalPlatform Card Technology: "Open Firmware Loader for Tamper Resistant Element".
NOTE: Available at https://globalplatform.org/specs-library/open-firmware-loader-for-tamper-resistant-element-
v1-3/.
[14] ETSI TS 102 223: "Smart Cards; Card Application Toolkit (CAT)".
[15] ETSI TS 131 102: "Uni
...