Industrial communication networks - Profiles - Part 1: Fieldbus profiles

IEC 61784-1:2010 defines a set of protocol specific communication profiles based primarily on the IEC 61158 series, to be used in the design of devices involved in communications in factory manufacturing and process control. Each profile selects specifications for the communications protocol stack at a device. It contains a minimal set of required services at the application layer and specification of options in intermediate layers defined through references. If no application layer is included, then a minimal set of required services at the Data-link layer is specified. The appropriate references to the protocol specific types are given in each communication profile family or associated profiles. This third edition cancels and replaces the second edition published in 2007. This edition constitutes a technical revision. The main changes with respect to the previous edition are:
- update of the dated references to the IEC 61158 series, to IEC 61784-2, to the IEC 61784-3 series, to the IEC 61784-5 series and to IEC 61918 throughout the document;
- update of the titles of the referenced documents and references if needed;
- update of selection tables for CPF 1, CPF 2, CPF 5 and CPF 8.
This bilingual version published in 2011-12, corresponds to the English version published in 2010-07.

Réseaux de communications industriels - Profils - Partie 1: Profils de bus de terrain

La CEI 61784-1:2010 définit un jeu de profils de communication spécifiques au protocole, principalement fondé sur la série de normes CEI 61158, qui doit être utilisé pour la conception de dispositifs employés en communication dans le cadre du contrôle de la fabrication et du processus en usine. Chaque profil choisit des spécifications pour la pile du protocole de communication au niveau du dispositif. Il comporte un jeu minimal de services exigés au niveau de la couche application et la spécification d'options dans les couches intermédiaires définies par le biais de références. Si aucune couche application n'est incluse, il est spécifié un jeu minimal de services exigés au niveau de la couche liaison de données. Les références appropriées aux types spécifiques au protocole sont données dans chaque famille de profils de communication ou dans des profils associés Cette troisième édition annule et remplace la seconde édition parue en 2007. et constitue une révision technique. Les principales modifications effectuées par rapport à l'édition précédente sont:
- la mise à jour des références datées à la série de normes CEI 61158, à la CEI 61784-2, à la série de normes CEI 61784-3, à la série de normes CEI 61784-5 et à la CEI 61918 dans l'ensemble du document;
- la mise à jour des titres des documents cités et des références, si nécessaire;
- la mise à jour des tableaux de sélection pour CPF 1, CPF 2, CPF 5 et CPF 8.
La présente version bilingue, correspond à la version anglaise monolingue publiée en 2010-07.

General Information

Status
Published
Publication Date
21-Jul-2010
Technical Committee
Drafting Committee
Current Stage
DELPUB - Deleted Publication
Completion Date
19-Aug-2014
Ref Project

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IEC 61784-1
®
Edition 3.0 2010-07
INTERNATIONAL
STANDARD


Industrial communication networks – Profiles –
Part 1: Fieldbus profiles


IEC 61784-1:2010(E)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2010 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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International Standards for all electrical, electronic and related technologies.

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Centre FAQ or contact us:
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Fax: +41 22 919 03 00

---------------------- Page: 2 ----------------------
IEC 61784-1
®
Edition 3.0 2010-07
INTERNATIONAL
STANDARD


Industrial communication networks – Profiles –
Part 1: Fieldbus profiles

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XH
ICS 35.100.20, 35.240.50 ISBN 978-2-88912-062-8
® Registered trademark of the International Electrotechnical Commission

---------------------- Page: 3 ----------------------
– 2 – 61784-1 © IEC:2010(E)
CONTENTS
FOREWORD.13
INTRODUCTION.15
1 Scope.16
2 Normative references .17
3 Definitions .21
3.1 Terms and definitions .21
3.2 Abbreviations and symbols.21
3.2.1 IEC 61158 abbreviations and symbols .21
3.2.2 Other abbreviations and symbols.21
3.3 Conventions .22
3.3.1 Conventions common to all layers .22
3.3.2 Physical layer .23
3.3.3 Data-link layer .23
3.3.4 Application layer.24
4 Conformance to communication profiles .24
5 Communication Profile Family 1 (FOUNDATION® Fieldbus) .25
5.1 General overview .25
5.2 Profile 1/1 (FF H1).26
5.2.1 Physical layer .26
5.2.2 Data-link layer .41
5.2.3 Application layer.105
5.3 Profile 1/2 (FF HSE) .106
5.3.1 Physical layer .106
5.3.2 Data-link layer .106
5.3.3 Network layer .106
5.3.4 Transport layer .106
5.3.5 Application layer.107
5.4 Profile 1/3 (FF H2).107
5.4.1 Physical layer .107
5.4.2 Data-link layer .109
5.4.3 Application layer.109
6 Communication Profile Family 2 (CIP™).109
6.1 General overview .109
6.2 Profile 2/1 (ControlNet) .110
6.2.1 Physical layer .110
6.2.2 Data-link layer .111
6.2.3 Application layer.113
6.3 Profile 2/2 (EtherNet/IP) .114
6.3.1 Physical layer .114
6.3.2 Data-link layer .114
6.3.3 Application layer.115
6.4 Profile 2/3 (DeviceNet) .116
6.4.1 Physical layer .116
6.4.2 Data-link layer .116
6.4.3 Application layer.117
7 Communication Profile Family 3 (PROFIBUS & PROFINET) .119

---------------------- Page: 4 ----------------------
61784-1 © IEC:2010(E) – 3 –
7.1 General overview .119
7.2 Profile 3/1 (PROFIBUS DP) .121
7.2.1 Physical layer .121
7.2.2 Data-link layer .123
7.2.3 Application layer.142
7.3 Profile 3/2 (PROFIBUS PA) .188
7.3.1 Physical layer .188
7.3.2 Data-link layer .191
7.3.3 Application layer.201
7.4 Profile 3/3 (PROFINET CBA) .201
7.4.1 Physical layer .201
7.4.2 Data-link layer .201
7.4.3 Application layer.202
8 Communication Profile Family 4 (P-NET®) .203
8.1 General overview .203
8.2 Profile 4/1 (P-NET RS-485) .203
8.2.1 Physical layer .203
8.2.2 Data-link layer .204
8.2.3 Application layer.205
8.3 Profile 4/2 (P-NET RS-232) .206
8.3.1 Physical layer .206
8.3.2 Data-link layer .207
8.3.3 Application layer.207
9 Communication Profile Family 5 (WorldFIP®) .208
9.1 General overview .208
9.2 Profile 5/1 (WorldFIP).209
9.2.1 Physical layer .209
9.2.2 Data-link layer .210
9.2.3 Application layer.212
9.3 Profile 5/2 (WorldFIP).217
9.3.1 Physical layer .217
9.3.2 Data-link layer .217
9.3.3 Application layer.217
9.4 Profile 5/3 (WorldFIP).221
9.4.1 Physical layer .221
9.4.2 Data-link layer .222
9.4.3 Application layer.222
10 Communication Profile Family 6 (INTERBUS®) .223
10.1 General overview .223
10.2 Profile 6/1 .224
10.2.1 Physical layer .224
10.2.2 Data-link layer .225
10.2.3 Application layer.226
10.3 Profile 6/2 .227
10.3.1 Physical layer .227
10.3.2 Data-link layer .227
10.3.3 Application layer.228
10.4 Profile 6/3 .230
10.4.1 Physical layer .230

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– 4 – 61784-1 © IEC:2010(E)
10.4.2 Data-link layer .230
10.4.3 Application layer.231
11 Communication Profile Family 7 (This Clause has been removed) . 232
12 Communication Profile Family 8 (CC-Link) .232
12.1 General overview .232
12.1.1 General .232
12.1.2 Profile 8/1.232
12.1.3 Profile 8/2.233
12.1.4 Profile 8/3.233
12.2 Profile 8/1 .233
12.2.1 Physical layer .233
12.2.2 Data-link layer .234
12.2.3 Application layer.236
12.3 Profile 8/2 .239
12.3.1 Physical layer .239
12.3.2 Data-link layer .239
12.3.3 Application layer.239
12.4 Profile 8/3 .239
12.4.1 Physical layer .239
12.4.2 Data-link layer .240
12.4.3 Application layer.242
13 Communication Profile Family 9 (HART).244
13.1 General Overview.244
13.2 Profile 9/1, universal command .244
13.2.1 Physical layer .244
13.2.2 Data-link layer .244
13.2.3 Application layer.244
14 Communication Profile Family 16 (SERCOS).245
14.1 General overview .245
14.2 Profile 16/1 (SERCOS I).246
14.2.1 Physical layer selection .246
14.2.2 Data-link layer .246
14.2.3 Application layer.247
14.3 Profile 16/2 (SERCOS II).247
14.3.1 Physical layer .247
14.3.2 Data-link layer .248
14.3.3 Application layer.248
Annex A (informative) Communication concepts .249
Annex B (informative) Added value of IEC 61784-1.263
Bibliography.264

Figure 1 – Communication profile families and profiles .16
Figure 2 – Example optical power budget for a 100/140 μm fiber system with a 16/16
optical passive star coupler.40
Figure 3 – CP 3/2 Slave devices usable in applications.121
Figure A.1 – Ring structure .261
Figure A.2 – Topology example.262

---------------------- Page: 6 ----------------------
61784-1 © IEC:2010(E) – 5 –

Table 1 – Relations of Communication Profile Families to type numbers .17
Table 2 – Layout of profile (sub)clause selection tables .22
Table 3 – Contents of (sub)clause selection tables .22
Table 4 – Layout of service selection tables.22
Table 5 – Contents of service selection tables .23
Table 6 – Layout of parameter selection tables .23
Table 7 – Contents of parameter selection tables .23
Table 8 – Layout of class attribute selection tables .24
Table 9 – Contents of class attribute selection tables.24
Table 10 – CPF 1: overview of profile sets .25
Table 11 – CP 1/1: PhL selection for communicating devices and their MAUs.26
Table 12 – CP 1/1: PhL classification of MAUs and attached devices.28
Table 13 – CP 1/1: PhL selection of Clause 16 for devices and their MAUs .28
Table 14 – CP 1/1: PhL selection of Clause 12 for devices and their MAUs .29
Table 15 – CP 1/1: PhL selection of Clause 21 for devices and their MAUs (denigrated).30
Table 16 – CP 1/1: PhL selection of recommended IS parameters for FF MAU classes
111, 112, 121, 122, 511 and 512 .31
Table 17 – CP 1/1: PhL selection for media components.32
Table 18 – CP 1/1: PhL selection of imperative IS parameters for media in FISCO
systems .32
Table 19 – CP 1/1: PhL selection for power supplies .33
Table 20 – CP 1/1: PhL selection of power supply types .33
Table 21 – CP 1/1: PhL selection of permissible output voltage and IS parameters for
FISCO power supplies .34
Table 22 – CP 1/1: PhL selection for terminators .35
Table 23 – CP 1/1: PhL selection of IS parameters for terminators .35
Table 24 – CP 1/1: PhL selection of Clause 12 for intrinsic safety barriers.36
Table 25 – CP 1/1: PhL selection of recommended IS parameters for intrinsic safety
barriers and galvanic isolators (Entity model only) .37
Table 26 – CP 1/1: PhL selection of Clause 12 for intrinsically safe galvanic isolators .38
Table 27 – CP 1/1: PhL selection of Clause 15, recommended optical fiber types .39
Table 28 – CP 1/1: PhL selection of passive star couplers, recommended maximum
insertion loss .39
Table 29 – CP 1/1: PhL selection of active star couplers.39
Table 30 – CP 1/1: Optical power budget considerations .40
Table 31 – CP 1/1: DLL service selection.41
Table 32 – CP 1/1: DLL service selection of Clause 5 .41
Table 33 – CP 1/1: DLL service selection of 5.4.41
Table 34 – CP 1/1: DLL service selection of 5.4.1.42
Table 35 – CP 1/1: DLL service selection of 5.4.3.42
Table 36 – CP 1/1: DLL service selection of 5.4.6.43
Table 37 – CP 1/1: DLL service selection of Clause 6 .43
Table 38 – CP 1/1: DLL service selection of the summary of 6.3, DL-connection QoS.44
Table 39 – CP 1/1: DLL service selection of figures 9–14 of 6.4.44

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– 6 – 61784-1 © IEC:2010(E)
Table 40 – CP 1/1: DLL service selection of 6.5.44
Table 41 – CP 1/1: DLL service selection: replacement for Table 13 of 6.5 .45
Table 42 – CP 1/1: DLL service selection of 6.5, replacement for Table 14 .45
Table 43 – CP 1/1: DLL service selection of 6.5 for use of addresses for peer DLC .46
Table 44 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at publisher .46
Table 45 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at subscriber .46
Table 46 – CP 1/1: DLL service selection of 6.6.46
Table 47 – CP 1/1: DLL service selection: replacement for Table 15 of 6.6 .47
Table 48 – CP 1/1: DLL service selection of 6.7.47
Table 49 – CP 1/1: DLL service selection of 6.7, replacement for Table 16 .47
Table 50 – CP 1/1: DLL service selection of 6.7, replacement for Table 17 .47
Table 51 – CP 1/1: DLL service selection of 6.7, replacement for Table 18 .48
Table 52 – CP 1/1: DLL service selection of Clause 7 .48
Table 53 – CP 1/1: DLL service selection of 7.5, replacement for Table 23 .49
Table 54 – CP 1/1: DLL service selection of Clause 8 .49
Table 55 – CP 1/1: DLL service selection of 8.5, replacement for Table 28 .49
Table 56 – CP 1/1: DLL protocol selection .50
Table 57 – CP 1/1: DLL protocol selection of Clause 4.50
Table 58 – CP 1/1: DLL protocol selection of 4.3 .51
Table 59 – CP 1/1: DLL protocol selection of 4.3.2.1 for use of link designators.51
Table 60 – CP 1/1: DLL protocol selection of 4.3.2.2 for use of node designators .51
Table 61 – CP 1/1: DLL protocol selection of 4.3.3.1 for predefined flat non–local
DL-addresses .51
Table 62 – CP 1/1: DLL protocol selection of 4.3.3.2 for predefined flat link–local
DL-addresses .52
Table 63 – CP 1/1: DLL protocol selection of 4.3.3.3 for predefined node–local
DL-addresses .52
Table 64 – CP 1/1: DLL protocol selection of 4.7 .52
Table 65 – CP 1/1: DLL protocol selection of 4.7.4 .53
Table 66 – CP 1/1: DLL protocol selection of 4.7.5 .54
Table 67 – CP 1/1: DLL protocol selection of Clause 6.55
Table 68 – CP 1/1: DLL protocol selection, replacement for Table 10 of 6.0.56
Table 69 – CP 1/1: DLL protocol selection of 6.5 .57
Table 70 – CP 1/1: DLL protocol selection of 6.7 .60
Table 71 – CP 1/1: DLL protocol selection of 6.8 .64
Table 72 – CP 1/1: DLL protocol selection of 6.11 .65
Table 73 – CP 1/1: DLL protocol selection of 6.12 .65
Table 74 – CP 1/1: DLL protocol selection of 6.15 .66
Table 75 – CP 1/1: DLL protocol selection of 6.20 .67
Table 76 – CP 1/1: DLL protocol selection of Clause 7.68
Table 77 – CP 1/1: DLL protocol selection of 7.4 .69
Table 78 – CP 1/1: DLL protocol selection of Clause 8.70
Table 79 – CP 1/1: DLL protocol selection of 8.2 .71

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61784-1 © IEC:2010(E) – 7 –
Table 80 – CP 1/1: DLL protocol selection of 8.2.2 .81
Table 8
...

IEC 61784-1
®

Edition 3.0 2010-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Industrial communication networks – Profiles –
Part 1: Fieldbus profiles

Réseaux de communication industriels – Profils –
Partie 1: Profils de bus de terrain

IEC 61784-1:2010

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2010 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
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---------------------- Page: 2 ----------------------
IEC 61784-1
®
Edition 3.0 2010-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Industrial communication networks – Profiles –
Part 1: Fieldbus profiles

Réseaux de communication industriels – Profils –
Partie 1: Profils de bus de terrain

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
XH
CODE PRIX
ICS 35.100.20; 35.240.50 ISBN 978-2-88912-807-5
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – 61784-1  IEC:2010
CONTENTS
FOREWORD . 13
INTRODUCTION . 15
1 Scope . 16
2 Normative references . 17
3 Definitions . 21
3.1 Terms and definitions . 21
3.2 Abbreviations and symbols . 21
3.2.1 IEC 61158 abbreviations and symbols . 21
3.2.2 Other abbreviations and symbols . 21
3.3 Conventions . 22
3.3.1 Conventions common to all layers . 22
3.3.2 Physical layer . 23
3.3.3 Data-link layer . 23
3.3.4 Application layer . 24
4 Conformance to communication profiles . 24
5 Communication Profile Family 1 (FOUNDATION® Fieldbus) . 25
5.1 General overview . 25
5.2 Profile 1/1 (FF H1). 26
5.2.1 Physical layer . 26
5.2.2 Data-link layer . 41
5.2.3 Application layer . 105
5.3 Profile 1/2 (FF HSE) . 106
5.3.1 Physical layer . 106
5.3.2 Data-link layer . 106
5.3.3 Network layer . 106
5.3.4 Transport layer . 106
5.3.5 Application layer . 107
5.4 Profile 1/3 (FF H2). 107
5.4.1 Physical layer . 107
5.4.2 Data-link layer . 109
5.4.3 Application layer . 109
6 Communication Profile Family 2 (CIP™) . 109
6.1 General overview . 109
6.2 Profile 2/1 (ControlNet) . 110
6.2.1 Physical layer . 110
6.2.2 Data-link layer . 111
6.2.3 Application layer . 113
6.3 Profile 2/2 (EtherNet/IP) . 114
6.3.1 Physical layer . 114
6.3.2 Data-link layer . 114
6.3.3 Application layer . 115
6.4 Profile 2/3 (DeviceNet) . 116
6.4.1 Physical layer . 116
6.4.2 Data-link layer . 116
6.4.3 Application layer . 117
7 Communication Profile Family 3 (PROFIBUS & PROFINET) . 119

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61784-1  IEC:2010 – 3 –
7.1 General overview . 119
7.2 Profile 3/1 (PROFIBUS DP) . 121
7.2.1 Physical layer . 121
7.2.2 Data-link layer . 123
7.2.3 Application layer . 142
7.3 Profile 3/2 (PROFIBUS PA) . 188
7.3.1 Physical layer . 188
7.3.2 Data-link layer . 191
7.3.3 Application layer . 201
7.4 Profile 3/3 (PROFINET CBA) . 201
7.4.1 Physical layer . 201
7.4.2 Data-link layer . 201
7.4.3 Application layer . 202
8 Communication Profile Family 4 (P-NET®) . 203
8.1 General overview . 203
8.2 Profile 4/1 (P-NET RS-485) . 203
8.2.1 Physical layer . 203
8.2.2 Data-link layer . 204
8.2.3 Application layer . 205
8.3 Profile 4/2 (P-NET RS-232) . 206
8.3.1 Physical layer . 206
8.3.2 Data-link layer . 207
8.3.3 Application layer . 207
9 Communication Profile Family 5 (WorldFIP®) . 208
9.1 General overview . 208
9.2 Profile 5/1 (WorldFIP) . 209
9.2.1 Physical layer . 209
9.2.2 Data-link layer . 210
9.2.3 Application layer . 212
9.3 Profile 5/2 (WorldFIP) . 217
9.3.1 Physical layer . 217
9.3.2 Data-link layer . 217
9.3.3 Application layer . 217
9.4 Profile 5/3 (WorldFIP) . 221
9.4.1 Physical layer . 221
9.4.2 Data-link layer . 222
9.4.3 Application layer . 222
10 Communication Profile Family 6 (INTERBUS®) . 223
10.1 General overview . 223
10.2 Profile 6/1 . 224
10.2.1 Physical layer . 224
10.2.2 Data-link layer . 225
10.2.3 Application layer . 226
10.3 Profile 6/2 . 227
10.3.1 Physical layer . 227
10.3.2 Data-link layer . 227
10.3.3 Application layer . 228
10.4 Profile 6/3 . 230
10.4.1 Physical layer . 230

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– 4 – 61784-1  IEC:2010
10.4.2 Data-link layer . 230
10.4.3 Application layer . 231
11 Communication Profile Family 7 (This Clause has been removed) . 232
12 Communication Profile Family 8 (CC-Link) . 232
12.1 General overview . 232
12.1.1 General . 232
12.1.2 Profile 8/1 . 232
12.1.3 Profile 8/2 . 233
12.1.4 Profile 8/3 . 233
12.2 Profile 8/1 . 233
12.2.1 Physical layer . 233
12.2.2 Data-link layer . 234
12.2.3 Application layer . 236
12.3 Profile 8/2 . 239
12.3.1 Physical layer . 239
12.3.2 Data-link layer . 239
12.3.3 Application layer . 239
12.4 Profile 8/3 . 239
12.4.1 Physical layer . 239
12.4.2 Data-link layer . 240
12.4.3 Application layer . 242
13 Communication Profile Family 9 (HART) . 244
13.1 General Overview . 244
13.2 Profile 9/1, universal command . 244
13.2.1 Physical layer . 244
13.2.2 Data-link layer . 244
13.2.3 Application layer . 244
14 Communication Profile Family 16 (SERCOS) . 245
14.1 General overview . 245
14.2 Profile 16/1 (SERCOS I) . 246
14.2.1 Physical layer selection . 246
14.2.2 Data-link layer . 246
14.2.3 Application layer . 247
14.3 Profile 16/2 (SERCOS II) . 247
14.3.1 Physical layer . 247
14.3.2 Data-link layer . 248
14.3.3 Application layer . 248
Annex A (informative) Communication concepts . 249
Annex B (informative) Added value of IEC 61784-1 . 263
Bibliography . 264

Figure 1 – Communication profile families and profiles . 16
Figure 2 – Example optical power budget for a 100/140 µm fiber system with a 16/16
optical passive star coupler. 40
Figure 3 – CP 3/2 Slave devices usable in applications. 121
Figure A.1 – Ring structure . 261
Figure A.2 – Topology example. 262

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61784-1  IEC:2010 – 5 –

Table 1 – Relations of Communication Profile Families to type numbers . 17
Table 2 – Layout of profile (sub)clause selection tables . 22
Table 3 – Contents of (sub)clause selection tables . 22
Table 4 – Layout of service selection tables . 22
Table 5 – Contents of service selection tables . 23
Table 6 – Layout of parameter selection tables . 23
Table 7 – Contents of parameter selection tables . 23
Table 8 – Layout of class attribute selection tables . 24
Table 9 – Contents of class attribute selection tables . 24
Table 10 – CPF 1: overview of profile sets . 25
Table 11 – CP 1/1: PhL selection for communicating devices and their MAUs . 26
Table 12 – CP 1/1: PhL classification of MAUs and attached devices . 28
Table 13 – CP 1/1: PhL selection of Clause 16 for devices and their MAUs . 28
Table 14 – CP 1/1: PhL selection of Clause 12 for devices and their MAUs . 29
Table 15 – CP 1/1: PhL selection of Clause 21 for devices and their MAUs (denigrated) . 30
Table 16 – CP 1/1: PhL selection of recommended IS parameters for FF MAU classes
111, 112, 121, 122, 511 and 512 . 31
Table 17 – CP 1/1: PhL selection for media components. 32
Table 18 – CP 1/1: PhL selection of imperative IS parameters for media in FISCO
systems . 32
Table 19 – CP 1/1: PhL selection for power supplies . 33
Table 20 – CP 1/1: PhL selection of power supply types . 33
Table 21 – CP 1/1: PhL selection of permissible output voltage and IS parameters for
FISCO power supplies . 34
Table 22 – CP 1/1: PhL selection for terminators . 35
Table 23 – CP 1/1: PhL selection of IS parameters for terminators . 35
Table 24 – CP 1/1: PhL selection of Clause 12 for intrinsic safety barriers . 36
Table 25 – CP 1/1: PhL selection of recommended IS parameters for intrinsic safety
barriers and galvanic isolators (Entity model only) . 37
Table 26 – CP 1/1: PhL selection of Clause 12 for intrinsically safe galvanic isolators . 38
Table 27 – CP 1/1: PhL selection of Clause 15, recommended optical fiber types . 39
Table 28 – CP 1/1: PhL selection of passive star couplers, recommended maximum
insertion loss . 39
Table 29 – CP 1/1: PhL selection of active star couplers . 39
Table 30 – CP 1/1: Optical power budget considerations . 40
Table 31 – CP 1/1: DLL service selection . 41
Table 32 – CP 1/1: DLL service selection of Clause 5 . 41
Table 33 – CP 1/1: DLL service selection of 5.4 . 41
Table 34 – CP 1/1: DLL service selection of 5.4.1 . 42
Table 35 – CP 1/1: DLL service selection of 5.4.3 . 42
Table 36 – CP 1/1: DLL service selection of 5.4.6 . 43
Table 37 – CP 1/1: DLL service selection of Clause 6 . 43
Table 38 – CP 1/1: DLL service selection of the summary of 6.3, DL-connection QoS . 44
Table 39 – CP 1/1: DLL service selection of figures 9–14 of 6.4 . 44

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– 6 – 61784-1  IEC:2010
Table 40 – CP 1/1: DLL service selection of 6.5 . 44
Table 41 – CP 1/1: DLL service selection: replacement for Table 13 of 6.5 . 45
Table 42 – CP 1/1: DLL service selection of 6.5, replacement for Table 14 . 45
Table 43 – CP 1/1: DLL service selection of 6.5 for use of addresses for peer DLC . 46
Table 44 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at publisher . 46
Table 45 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at subscriber . 46
Table 46 – CP 1/1: DLL service selection of 6.6 . 46
Table 47 – CP 1/1: DLL service selection: replacement for Table 15 of 6.6 . 47
Table 48 – CP 1/1: DLL service selection of 6.7 . 47
Table 49 – CP 1/1: DLL service selection of 6.7, replacement for Table 16 . 47
Table 50 – CP 1/1: DLL service selection of 6.7, replacement for Table 17 . 47
Table 51 – CP 1/1: DLL service selection of 6.7, replacement for Table 18 . 48
Table 52 – CP 1/1: DLL service selection of Clause 7 . 48
Table 53 – CP 1/1: DLL service selection of 7.5, replacement for Table 23 . 49
Table 54 – CP 1/1: DLL service selection of Clause 8 . 49
Table 55 – CP 1/1: DLL service selection of 8.5, replacement for Table 28 . 49
Table 56 – CP 1/1: DLL protocol selection . 50
Table 57 – CP 1/1: DLL protocol selection of Clause 4 . 50
Table 58 – CP 1/1: DLL protocol selection of 4.3 . 51
Table 59 – CP 1/1: DLL protocol selection of 4.3.2.1 for use of link designators. 51
Tabl
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