ISO/IEC 10373-1:2006/Amd 1:2012
(Amendment)Identification cards — Test methods — Part 1: General characteristics — Amendment 1
Identification cards — Test methods — Part 1: General characteristics — Amendment 1
Cartes d'identification — Méthodes d'essai — Partie 1: Caractéristiques générales — Amendement 1
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Standards Content (Sample)
ISO/IEC
10373-1
Second edition
2006-05-01
AMENDMENT 1
2012-11-01
Identification cards — Test methods —
Part 1:
General characteristics
AMENDMENT 1
Cartes d'identification — Méthodes d'essai —
Partie 1: Caractéristiques générales
AMENDEMENT 1
Reference number
ISO/IEC 10373-1:2006/Amd.1:2012(E)
©
ISO/IEC 2012
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
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ii © ISO/IEC 2012 – All rights reserved
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are members of
ISO or IEC participate in the development of International Standards through technical committees
established by the respective organization to deal with particular fields of technical activity. ISO and IEC
technical committees collaborate in fields of mutual interest. Other international organizations, governmental
and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information
technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of the joint technical committee is to prepare International Standards. Draft International
Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as
an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights ISO and IEC shall not be held responsible for identifying any or all such patent rights.
Amendment 1 to ISO/IEC 10373-1 was prepared by Joint Technical Committee JTC1, Information technology,
Subcommittee SC 17, Cards and personal identification.
© ISO/IEC 2012 – All rights reserved iii
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
Identification cards — Test methods —
Part 1:
General characteristics
AMENDMENT 1
Page 1, Normative references
Add the following references:
ISO/IEC 7816-2, Identification cards — Integrated circuit(s) cards with contacts — Part 2: Dimensions and
location of the contacts
IEC 60749-26, Semiconductor devices — Mechanical and climatic test methods — Electrostatic discharge
(ESD) sensitivity testing — Human body model (HBM)
Page 3, Terms and definitions
Add the following terms and definitions:
3.15
ICC
integrated circuit(s) card
3.16
typical protocol and application specific communication
any communication between a DUT and the corresponding test-apparatus based on protocol and application
implemented in the DUT and representing its normal use
3.17
Test Scenario
defined typical protocol and application specific communication to be used with the test methods defined in
this document
3.18
PICC
Proximity integrated circuit(s) card or object
Page 4, Clause 4
Add the following subclauses after 4.5.
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
4.6 Conventions for electrical measurements on ICCs with contacts
Potential differences are defined with respect to the GND contact of the ICC and currents flowing to the ICC
are considered positive.
4.7 Apparatus for measurements on ICCs with contacts
4.7.1 Default ICC-holder, reference axes and default measurement position
When required by the test-method, the ICC shall be positioned in the default measurement position as
subsequently defined.
The default measurement position requires the ICC to be positioned in an ICC-holder and flattened by a
flattening plate. All Measurements using this default measurement position shall be relative to the reference
axes defined in Figure Amd.1-1.
4.7.2 Default ICC-holder and reference axes:
The default ICC holder shall comply with Figure Amd.1-1:
Dimensions in millimetres
All Tolerances ± 0,01 mm
71,25
O X-Axis
11,25
Reference Reference
T1 T2
L
Y-Axis
Reference
L, T1 and T2 shall be metal cylinders, having a diameter of 5 mm ± 0,1 mm , a surface roughness
R < 5 µm , m ounted on a level rigid plate with a surface roughness R < 5 µm .
a a
Figure Amd.1-1 — ICC-holder
4.7.3 Flattening Plate
The flattening plate shall comply with Figure Amd.1-2:
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27,00
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
Dimensions in mm
All Tolerances ± 0,1 mm
50,0
The surface roughness of the flattening plate shall be R < 5 µm .
a
Figure Amd.1-2 — Flattening plate
4.7.4 Default Measurement Position
The ICC and the flattening plate shall be mounted on the ICC-holder as shown in Figure Amd.1-3:
(30 ± 1) m m Top card edge X-Axis
Reference
T1 T2
L
F = 1 N to 2 N
1
Front Side
Left card edge
F = 2 N to 4 N
Y-Axis 2
Reference
F and F are forces applied to the center of the right and the bottom edge of the card respectively to fix
1 2
the card in the card-holder.
The flattening plate shall apply a force of 2,2 N ± 0,2 N to the surface of the card
Figure Amd.1-3 — Position of ICC and flattening plate on ICC-holder
© ISO/IEC 2012 – All rights reserved 3
(1 ± 1) mm
27,0
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
Page 9, 5.4.1.1.g)
Correct the formula for ethylene glycol to HOCH CH OH.
2 2
Page 23, Clause 5
After 5.16, add the following subclauses:
5.17 Dimension and Location of Contacts for ICCs with contacts
The purpose is to determine the compliance of the dimensions and the location of the ICC’s contacts with
ISO/IEC 7816-2.
5.17.1 Apparatus
An ICC-Holder and a flattening plate compliant with 4.7.1.
Any device capable of executing the procedure below with the defined accuracy.
5.17.2 Procedure
a) Mount the ICC in the default measurement position as defined in 4.6.1.
b) Construct two lines parallel to the X-Axis and two lines parallel to the Y-Axis on the ICC
Reference Reference
surface, forming the minimum contact area C1 as defined in ISO/IEC 7816-2 with an accuracy of
equal to or better than 0,01 mm.
c) Check if the rectangular area enclosed by the four lines is completely covered by contact metallization
and note the result.
d) Check if the metallization within the rectangular area enclosed by the four lines is connected to
metallization in any other minimum contact area and note the result.
e) Repeat b) to d) for the minimum contact areas C2 to C8.
5.17.3 Test report
The test report shall state for each observed minimum contact area, whether it is completely covered by
contact metallization and if it is connected to metallization in any other minimum contact area.
5.18 Static electricity test for ICCs with contacts
IEC 60749-26 shall be used to test conformance with the static electricity requirements of the base standard.
5.18.1 Test Report
The test report shall state whether or not the card under test remained testably functional following the
exposure.
5.19 Static electricity test for proximity and vicinity ICCs
The purpose of this test is to check the behaviour of the card IC in relation to electrostatic discharge (ESD)
exposure in the test sample. The PICC or VICC under test is exposed to a simulated electrostatic discharge
(ESD, human body model) and its basic operation checked following the exposure.
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ISO/IEC 10373-1:2006/Amd.1:2012(E)
Discharge tip
ESD gun
PICC or VICC
Horizontal coupling
conductive plane on a
470 k
wooden table, standing on a
ground reference plane.
470 k
Figure Amd.1-4 ― ESD test circuit
5.19.1 Apparatus
Refer to IEC 61000-4-2:1995.
a) Main specifications of the ESD generator:
— energy storage capacitance: 150 pF ± 10 %;
— discharge resistance: 330 ± 10 %;
— charging resistance: between 50 M and 100 M;
— rise time: 0,7 ns to 1 ns.
b) Selected specifications from the optional items:
— type of equipment: table top equipment;
— discharge method: direct application of air discharge to the equipment under test;
— discharge electrodes of the ESD generator: Round tip probe of 8 mm diameter.
5.19.2 Test procedure
Connect the ground pin of the apparatus to the conductive plate upon which the PICC or VIVV is placed (see
Figure Amd.1-4).
Apply the discharge successively in normal polarity to each of the 20 test zones shown in Figure Amd.1-5
ensuring that the discharge tip is not applied within 6 mm of the card perimeter (see the dashed boundary line
in Figure Amd.1-5) and allowing a cool-down period between successive pulses of at least 10 s.
Repeat the procedure with reversed polarity.
WARNING — If the PICC or VICC includes contacts, the contacts shall face up and the zone which
includes contacts shall not be exposed to this discharge.
Check that the PICC or VICC operates as intended at the end of the test.
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