ISO/IEC 30129:2015
(Main)Information technology — Telecommunications bonding networks for buildings and other structures
Information technology — Telecommunications bonding networks for buildings and other structures
ISO/IEC 30129:2015(E) specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to a) minimise the risk to the correct function of that equipment and interconnecting cabling from electrical hazards and b) provide the telecommunications installation with a reliable signal reference - which may improve immunity from electromagnetic interference (EMI).
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ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
ISO/IEC 30129:2015-10(en)
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ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-2924-8
Warning! Make sure that you obtained this publication from an authorized distributor.
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– 2 – ISO/IEC 30129:2015
ISO/IEC 2015
CONTENTS
FOREWORD . 5
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 11
4 Conformance . 12
5 Overview of bonding networks . 12
6 Selection of the telecommunications bonding network approach . 13
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment . 13
6.2 Telecommunications bonding networks . 14
6.3 Telecommunications bonding network performance . 15
6.3.1 General . 15
6.3.2 Requirements . 16
6.3.3 DC resistance measurements . 17
7 Common features . 17
7.1 General . 17
7.2 Protective bonding networks . 18
7.2.1 Protective bonding network conductors (PBNCs) . 18
7.2.2 Main earthing terminal (MET) . 18
7.3 Telecommunications entrance facility (TEF) . 18
7.4 Telecommunications bonding network components . 18
7.4.1 Telecommunications bonding network conductors . 18
7.4.2 Telecommunications bonding network connections . 19
7.5 Cabinets, frames and racks . 19
7.5.1 External connections to a bonding network . 19
7.5.2 Rack bonding conductors. 20
7.5.3 Internal connections . 21
7.6 Miscellaneous bonding connections . 22
7.6.1 General . 22
7.6.2 Bonding conductors for d.c. resistance control . 22
7.6.3 Bonding conductors for impedance control . 22
7.7 Documentation . 23
8 Dedicated telecommunications bonding network . 23
8.1 General . 23
8.2 Components . 24
8.2.1 Primary bonding busbar (PBB) . 24
8.2.2 Secondary bonding busbar (SBB) . 25
8.2.3 Bonding conductors for d.c. resistance control . 25
8.2.4 Bonding conductors for impedance control . 26
8.3 Implementation . 27
8.3.1 Primary bonding busbar (PBB) . 27
8.3.2 Secondary bonding busbar (SBB) . 28
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ISO/IEC 30129:2015 – 3 –
ISO/IEC 2015
8.3.3 Telecommunications bonding conductor (TBC) . 28
8.3.4 Telecommunications bonding backbone (TBB) . 29
8.3.5 Backbone bonding conductor (BBC) . 29
8.3.6 Bonds to continuous conductive pathway systems . 29
8.3.7 Bonds to structural metal . 29
9 Local telecommunications bonding networks in conjunction with protective
bonding networks . 30
9.1 Bonding for local distribution . 30
9.1.1 Star protective bonding networks . 30
9.1.2 Ring protective bonding networks . 31
9.2 Telecommunications bonding conductors . 32
9.2.1 Bonding conductors for d.c. resistance control . 32
9.2.2 Bonding conductors for impedance control . 32
9.3 Bonding for areas of telecommunications equipment concentration . 33
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks . 33
10.1 Bonding for areas of telecommunications equipment concentration . 33
10.1.1 Requirements . 33
10.1.2 Recommendations . 33
10.1.3 Cabinets, frames and racks . 33
10.2 Telecommunications equipment bonding conductors (TEBC) . 33
10.2.1 TEBC for d.c. resistance control . 33
10.2.2 TEBC for impedance control . 34
10.2.3 Implementation . 34
11 Mesh bonded networks . 34
11.1 General . 34
11.2 Mesh bonding alternatives . 35
11.2.1 Local mesh bonding (MESH-IBN) networks . 35
11.2.2 MESH-BN . 37
11.3 Bonding conductors of a mesh bonding network . 38
11.3.1 Requirements . 38
11.3.2 Recommendations . 38
11.4 Bonding conductors to the mesh bonding network . 38
11.5 Supplementary bonding grid (SBG) . 39
11.6 System reference potential plane (SRPP) . 39
11.6.1 General . 39
11.6.2 Access floors . 40
11.6.3 Transient suppression plate (TSP) . 41
Annex A (normative) Maintenance of telecommunications bonding network
performance . 42
A.1 General . 42
A.2 Periodic activity . 42
A.2.1 Schedule . 42
A.2.2 Implementation . 42
A.3 Causes of performance deterioration . 43
A.3.1 Galvanic corrosion . 43
A.3.2 Requirements . 43
Annex B (normative) Bonding conductor cross-sectional area . 44
Annex C (infomative) Alternative terminology . 45
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ISO/IEC 2015
Bibliography . 46
Figure 1 – Schematic relationship between ISO/IEC 30129 and other relevant
standards . 7
Figure 2 – Schematic of telecommunications equipment distribution and associated
bonding connections . 13
Figure 3 – Example of three methods of equipment and rack bonding . 20
Figure 4 – Example of a bond connection from a cabinet to the cabinet door . 22
Figure 5 – Example of bonding straps . 23
Figure 6 – Illustrative example of a large building . 24
Figure 7 – Illustrative example of a smaller building . 24
Figure 8 – Schematic of PBB . 25
Figure 9 – Schematic of SBB . 25
Figure 10 – Star protective bonding and supplementary telecommunications bonding . 30
Figure 11 – Example of high common impedance and large loop . 30
Figure 12 – Example of low common impedance and small loop . 31
Figure 13 – Ring protective bonding and supplementary telecommunications bonding . 31
Figure 14 – MESH-BN example . 32
Figure 15 – Example TEBC to rack bonding conductor connection . 34
Figure 16 – Local mesh bonding network . 36
Figure 17 – A MESH-IBN having a single point of connection (SPC) . 36
Figure 18 – A MESH-BN with equipment cabinets, frames, racks and CBN bonded
together . 37
Figure 19 – Example of access floor . 40
Figure 20 – Example of installation details for an under floor transient suppression
plate . 41
Table 1 – Sensitivity of cabling media to bonding network performance . 14
Table 2 – Telecommunications bonding network requirements . 14
Table 3 – DC resistance requirements for protective bonding networks . 16
Table 4 – DC resistance requirements for dedicated telecommunications bonding
networks . 17
Table 5 – TBB conductor sizing . 26
Table B.1 – Bonding conductor cross-sectional areas . 44
Table C.1 – Alternative terminology . 45
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ISO/IEC 30129:2015 – 5 –
ISO/IEC 2015
INFORMATION TECHNOLOGY –
TELECOMMUNICATIONS BONDING NETWORKS
FOR BUILDINGS AND OTHER STRUCTURES
FOREWORD
1) ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission)
form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC
participate in the development of International Standards through technical committees established by the
respective organization to deal with particular fields of technical activity. ISO and IEC technical committees
collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in
liaison with ISO and IEC, also take part in the work. In the field of information technology, ISO and IEC have
established a joint technical committee, ISO/IEC JTC 1.
2) The formal decisions or agreements of IEC and ISO on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested IEC National Committees and ISO member bodies.
3) IEC, ISO and ISO/IEC publications have the form of recommendations for international use and are accepted
by IEC National Committees and ISO member bodies in that sense. While all reasonable efforts are made to
ensure that the technical content of IEC, ISO and ISO/IEC publications is accurate, IEC or ISO cannot be held
responsible for the way in which they are used or for any misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees and ISO member bodies undertake to
apply IEC, ISO and ISO/IEC publications transparently to the maximum extent possible in their national and
regional publications. Any divergence between any ISO, IEC or ISO/IEC publication and the corresponding
national or regional publication should be clearly indicated in the latter.
5) ISO and IEC do not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. ISO or IEC are not responsible
for any services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or ISO or its directors, employees, servants or agents including individual experts
and members of their technical committees and IEC National Committees or ISO member bodies for any
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publication or any other IEC, ISO or ISO/IEC publications.
8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this ISO/IEC publication may be the subject of
patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
International Standard ISO/IEC 30129 was prepared by subcommittee 25: Interconnection of
information technology equipment, of ISO/IEC joint technical committee 1: Information
technology.
This International Standard has been approved by vote of the member bodies, and the voting
results may be obtained from the address given on the second title page.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
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ISO/IEC 2015
INTRODUCTION
This International Standard specifies requirements and recommendations for the design and
installation of connections (bonds) between various electrically conductive elements in
buildings and other structures, during their construction or refurbishment, in which information
technology (IT) and, more generally, telecommunications equipment is intended to be
installed in order to
a) minimise the risk to the correct function of that equipment and interconnecting cabling
from electrical hazards,
b) provide the telecommunications installation with a reliable signal reference – which may
improve immunity from electromagnetic interference (EMI).
This International Standard
– specifies assessment criteria to determine the relevant bonding configurations that are
appropriate,
– enables the implementation of any bonding configurations that may be necessary by
means of either
• the provision of a bonding network that utilises the existing protective bonding network
for electrical safety, or
• the provision of a dedicated bonding network for the telecommunications infrastructure.
This standard is intended for
• building architects, owners and managers,
• designers and installers of electrical and telecommunications cabling installations.
This International Standard is one of a number of documents prepared in support of
international standards and technical reports for cabling design produced by
ISO/IEC JTC 1/SC 25. Figure 1 shows the inter-relationship between these standards and
technical reports.
Users of this standard should be familiar with all applicable cabling design and installation
standards.
NOTE Telecommunications infrastructure affects raw material consumption. The infrastructure design and
installation methods also influence product life and sustainability of electronic equipment life cycling. These
aspects of telecommunications infrastructure impact our environment. Since building life cycles are typically
planned for decades, technological electronic equipment upgrades are necessary. The telecommunications
infrastructure design and installation process magnifies the need for sustainable infrastructures with respect to
building life, electronic equipment life cycling and considerations of effects on environmental waste.
Telecommunications designers are encouraged to research local building practices for a sustainable environment
and conservation of fossil fuels as part of the design process.
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ISO/IEC 30129:2015 – 7 –
ISO/IEC 2015
ISO/IEC 11801:
Information technology – Generic
cabling for customer premises
ISO/IEC 15018:
Information technology – Generic
cabling for homes
IEC 61935-1:
Specification for the testing of balanced
and coaxial information technology
ISO/IEC 24764:
cabling – Part 1: Installed balanced
Information technology – Generic
cabling as specified in ISO/IEC 11801
cabling systems for data centres
and related standards
IEC 61935-3:
Testing of balanced and coaxial
ISO/IEC 24702: ISO/IEC 14763-2:
information technology cabling - Part 3:
Information technology – Generic Implementation and Operation of
Installed cabling as specified in ISO/IEC
cabling for industrial premises Customer Premises Cabling - Part 2:
15018 and related standards
Planning and installation
ISO/IEC TR 24704: ISO/IEC 14763-3:
Information technology – Customer Implementation and Operation of
premises cabling for wireless access customer premises cabling - Part 3:
ISO/IEC 30129:
points Testing of optical fibre cabling
Telecommunications bonding
networks for buildings and other
structures
ISO/IEC 14709-1:
Information technology – Configuration
of customer premises cabling for
applications - Part 1: ISDN basic access
ISO/IEC 14709-2:
Information technology – Configuration
of customer premises cabling for
applications - Part 2: ISDN primary rate
IEC
Figure 1 – Schematic relationship between ISO/IEC 30129
and other relevant standards
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– 8 – ISO/IEC 30129:2015
ISO/IEC 2015
INFORMATION TECHNOLOGY –
TELECOMMUNICATIONS BONDING NETWORKS
FOR BUILDINGS AND OTHER STRUCTURES
1 Scope
This International Standard specifies requirements and recommendations for the design and
installation of connections (bonds) between various electrically conductive elements in
buildings and other structures, during their construction or refurbishment, in which information
technology (IT) and, more generally, telecommunications equipment is intended to be
installed in order to
a) minimise the risk to the correct function of that equipment and interconnecting cabling
from electrical hazards,
b) provide the telecommunications installation with a reliable signal reference – which may
improve immunity from electromagnetic interference (EMI).
The requirements of this International Standard are applicable to the buildings and other
structures within premises addressed by ISO/IEC 14763-2 (e.g. residential, office, industrial
and data centres) but information given in this International Standard may be of assistance for
other types of buildings and structures.
NOTE Telecommunications centres (operator buildings) are addressed by ITU-T K.27.
This International Standard does not apply to power supply distribution of voltages over AC
1 000 V.
Electromagnetic compatibility (EMC) requirements and safety requirements for power supply
installation are outside the scope of this International Standard and are covered by other
standards and regulations. However, information given in this International Standard may be
of assistance in meeting the requirements of these standards and regulations.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60364-4-41, Low-voltage electrical installations – Part 4-41: Protection for safety –
Protection against electric shock
IEC 60364-4-44:2007, Low-voltage electrical installations – Part 4-44: Protection for safety –
Protection against voltage disturbances and electromagnetic disturbances
IEC 60364-5-54, Low-voltage electrical installations – Part 5-54: Selection and erection of
electrical equipment – Earthing arrangements and protective conductors
IEC 60950-1, Information technology equipment – Safety – Part 1: General requirements
IEC 61140, Protection against electric shock – Common aspects for installation and
equipment
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ISO/IEC 30129:2015 – 9 –
ISO/IEC 2015
ISO/IEC 14763-2:2012, Information technology – Implementation and operation of customer
premises cabling – Part 2: Planning and installation
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document the following definitions apply in addition to those of
ISO/IEC 14763-2. Alternatives to certain terms are provided in Annex C.
3.1.1
access provider
operator or another entity providing the means to enable external telecommunications
services provision to a subscriber
3.1.2
asymmetric cabling
cabling within which the cable elements are asymmetric (unbalanced)
3.1.3
application
system, including its associated transmission method, wh
...
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