ISO/IEC 14776-121:2010

Information technology — Small Computer System Interface (SCSI) — Part 121: Passive Interconnect Performance (PIP)

ISO/EC 14776-121:2010(E) specifies the performance requirements of the interconnect and expands the coverage to the complete assembled interconnect including connectors, uniform bulk cable, and non-uniform bulk cable. A syntax and framework is described for all types of passive interconnect. The methodology for performing the electrical measurements required to determine compliance with the performance requirements for bulk cable of several types, various assembled interconnects and printed circuit board designs is included. Details of the measurement methodology are specified to minimize the difference in measured results from different electrical testing laboratories. Details include calibration, fixturing and sample preparation, equipment, measurement procedure and data output format.

Technologies de l'information — Interface de petit système d'ordinateur (SCSI) — Partie 121: Performance passive d'interconnexion (PIP)

General Information

• Status: Published
• Publication Date: 21-Oct-2010
• ICS: 35.200 - Interface and interconnection equipment
• Technical Committee: ISO/IEC JTC 1/SC 25 - Interconnection of information technology equipment
• Drafting Committee: ISO/IEC JTC 1/SC 25 - Interconnection of information technology equipment
• Current Stage: 9093 - International Standard confirmed
• Completion Date: 13-Jul-2018

Standards Content (Sample)

ISO/IEC 14776-121
Edition 1.0 2010-10
INTERNATIONAL
STANDARD

colour
inside

Information technology –
Small computer system interface (SCSI)
Part 121: Passive interconnect performance (PIP)



ISO/IEC 14776-121:2010(E)

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ISO/IEC 14776-121
Edition 1.0 2010-10
INTERNATIONAL
STANDARD

colour
inside

Information technology –
Small computer system interface (SCSI)
Part 121: Passive interconnect performance (PIP)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 35.200 ISBN 978-2-88912-220-2

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14776-121 © ISO/IEC:2010(E) - 3 -
1 Scope .13
2 Normative references .13
3 Terms, definitions and abbreviations .13
3.1 Terms and definitions .13
3.2 Acronyms .20
3.3 Symbols and abbreviations .21
3.4 Keywords .22
3.5 Conventions .22
3.6 Specification of measurement equipment .23
4 Overview .24
4.1 General .24
4.2 Open versus closed systems related to this standard .24
4.3 Structural considerations .24
4.3.1 SCSI interconnects .24
4.3.2 SCSI passive interconnect topology .25
4.3.3 Interconnect sub-assemblies, transition regions and bulk cable .25
4.3.4 Interconnect assemblies .25
4.3.5 Relationship between SE and DF in this document .25
4.4 Relationship between requirements on bulk cable and requirements on interconnect assemblies .26
4.5 Physical measurement points .26
4.6 Concatenated configurations .26
4.7 Interoperability points .26
4.8 Constructions considered .27
4.9 Identification, constraints and loading requirements .28
4.9.1 Connector function identification .28
4.9.2 Constraints .28
4.9.3 Standard loads .29
4.9.3.1 Targets and initiators with no enabled terminator .29
4.9.3.2 Targets and initiators with enabled terminator .29
4.10 Nature of requirements .29
4.10.1 Measurements and tests .29
4.10.2 Performance levels and applications .29
4.10.3 Basic performance requirements for interconnect assemblies .30
4.10.3.1 Overview .30
4.10.3.2 Measurement conditions for non-precomp received signal quality requirements .31
4.10.3.3 Measurement conditions for precomp received signal quality requirements .31
4.10.4 Deriving the launch signal requirements for this standard from the signal requirements in SPI-x .
31
4.11 Local neighborhood concepts .32
4.12 Length specifications .32
4.13 S21 relationship among point-to-point and multidrop configurations .32
4.14 Accommodation of receiver compensation in interconnect requirements .33
4.15 Instrumentation and text fixture considerations .33
4.16 Signals covered by this standard .34
4.17 Error rate considerations .36
5 Summary bulk cable .37
6 Bulk cable samples, test fixtures and setups .39
6.1 Bulk cable samples and sample preparation .39
6.1.1 Overview .39
6.1.2 Summary .39
6.1.3 Point-to-point bulk cable .39
6.1.3.1 Point-to-point bulk cable sample preparation (SP_Bulk_PP3) .39

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6.1.3.2 Point-to-point bulk cable sample preparation (SP_Bulk_PP10) .40
6.1.3.3 Point-to-point bulk cable sample preparation (SP_Bulk_PP25) .40
6.1.4 Sample preparation for multi-drop bulk cable or printed circuit boards .40
6.1.4.1 Multi-drop bulk cable sample preparation (SP_Bulk_MD3) .40
6.1.4.2 Printed circuit boards sample preparation .40
6.2 Bulk cable and printed circuit board test fixture specifications .41
6.2.1 Overview .41
6.2.2 Summary .41
6.2.3 Test fixture (FIX_Bulk_1) .41
6.2.4 Test fixture (FIX_Bulk_2) .42
6.2.5 Test fixture (FIX_Bulk_3) .43
6.2.6 Test fixture (FIX_Bulk_4) .43
6.2.7 Printed circuit boards test fixture (FIX_PCB_1) .43
6.3 Bulk cable measurement equipment and setups .44
6.3.1 Summary .44
6.3.2 Setup (SET_Bulk_1) .45
6.3.3 Setup (SET_Bulk_2) .45
6.3.4 Setup (SET_Bulk_3) .46
6.3.5 Setup (SET_Bulk_4) .46
6.3.6 Setup (SET_Bulk_5) .47
6.4 STD calibration .47
7 Level 1 bulk cable tests .49
7.1 SE tests .49
7.2 Differential local impedance .49
7.2.1 Overview .49
7.2.2 Point-to-point bulk cable .49
7.2.2.1 Sample preparation for point-to-point bulk cable .49
7.2.2.2 Test fixtures for point-to-point bulk cable .49
7.2.2.3 Measurement equipment and setup for point-to-point bulk cable .49
7.2.2.4 Calibration and verification procedure for point-to-point bulk cable .49
7.2.2.5 Test procedure and data output format .50
7.2.2.6 Acceptable values for point-to-point bulk cable .51
7.2.3 Multi-drop bulk cable .51
7.2.3.1 Sample preparation for multi-drop bulk cable .51
7.2.3.2 Test fixtures for multi-drop bulk cable .51
7.2.3.3 Measurement equipment and setup for multi-drop bulk cable .51
7.2.3.4 Calibration and verification procedure for multi-drop bulk cable .52
7.2.3.5 Test procedure and data output format for multi-drop bulk cable .52
7.2.3.6 Acceptable values for multi-drop bulk cable .53
7.2.4 Unpopulated printed circuit board (PCB) .53
7.3 Differential propagation time and propagation time skew .53
7.3.1 Overview .53
7.3.2 Point-to-point bulk cable .53
7.3.2.1 Sample preparation for point-to-point bulk cable .53
7.3.2.2 Test fixtures for point-to-point bulk cable .53
7.3.2.3 Measurement equipment and setup for point-to-point bulk cable .54
7.3.2.4 Calibration and verification procedure for point-to-point bulk cable .54
7.3.2.5 Test procedure and data output format for point-to-point bulk cable .54
7.3.2.6 Acceptable values for point-to-point bulk cable .55
7.3.3 Multi-drop bulk cable .55
7.3.3.1 Sample preparation for multi-drop bulk cable .55
7.3.3.2 Test fixtures for multi-drop bulk cable .55
7.3.3.3 Measurement equipment and setup for multi-drop bulk cable .55
7.3.3.4 Calibration and verification procedure for multi-drop bulk cable .56
7.3.3.5 Test procedure and data output format for multi-drop bulk cable .56
7.3.3.6 Acceptable values for multi-drop bulk cable .56

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14776-121 © ISO/IEC:2010(E) - 5 -
7.3.4 Unpopulated PCB .56
7.4 Differential capacitance by calculation .56
7.4.1 Overview .56
7.4.2 Differential capacitance by calculation for all constructions of bulk cable .56
7.4.3 Acceptable differential capacitance values for all constructions of bulk cable .56
7.5 Differential capacitance by frequency domain measurement .57
7.5.1 Point-to-point bulk cable .57
7.5.1.1 Sample preparation for point-to-point bulk cable .57
7.5.1.2 Test fixtures for point-to-point bulk cable .57
7.5.1.3 Measurement equipment and setup for point-to-point bulk cable .57
7.5.1.4 Calibration and verification procedure for point-to-point bulk cable .57
7.5.1.5 Test procedure and data output format for point-to-point bulk cable .57
7.5.2 Multi-drop bulk cable .57
7.5.3 Unpopulated PCB .57
7.5.4 Acceptable differential capacitance values for all constructions of bulk cable .57
7.6 Differential insertion loss .58
7.6.1 Overview .58
7.6.2 Point-to-point bulk cable .58
7.6.2.1 Sample preparation for point-to-point bulk cable .58
7.6.2.2 Test fixtures for point-to-point bulk cable .58
7.6.2.3 Measurement equipment and setup for point-to-point bulk cable .58
7.6.2.4 Calibration, verification and measurement procedure for point-to-point bulk cable .58
7.6.2.5 Acceptable values for point-to-point bulk cable .59
7.6.3 Multi-drop bulk cable .59
7.6.3.1 Overview .59
7.6.3.2 Sample preparation for multi-drop bulk cable .59
7.6.3.3 Test fixtures for multi-drop bulk cable .59
7.6.3.4 Measurement equipment and setup for multi-drop bulk cable .60
7.6.3.5 Calibration, verification and measurement procedure for multi-drop bulk cable .60
7.6.3.6 Acceptable values for multi-drop bulk cable .60
7.6.4 Unpopulated PCB .60
7.7 Near end cross talk (NEXT) .60
7.7.1 Overview .60
7.7.2 Point-to-point bulk cable .61
7.7.2.1 Sample preparation for point-to-point bulk cable .61
7.7.2.2 Test fixtures for point-to-point bulk cable .61
7.7.2.3 Measurement equipment and setup for point-to-point bulk cable .61
7.7.2.4 Calibration and verification procedure for point-to-point bulk cable .61
7.7.2.5 Test procedure and data output format for point-to-point bulk cable .63
7.7.2.6 Acceptable values for point-to-point bulk cable .63
7.7.3 Multi-drop bulk cable .63
7.7.3.1 Sample preparation for multi-drop bulk cable .63
7.7.3.2 Test fixtures for multi-drop bulk cable .64
7.7.3.3 Measurement equipment and setup for multi-drop bulk cable .64
7.7.3.4 Calibration and verification procedure for multi-drop bulk cable .64
7.7.3.5 Test procedure and data output format for multi-drop bulk cable .64
7.7.3.6 Acceptable values for multi-drop bulk cable .65
7.7.4 Unpopulated PCB .65
8 Summary - Interconnect assemblies .66
9 Interconnect assemblies samples, test fixtures and setups .67
9.1 Interconnect assembly samples and sample preparation .67
9.2 Test fixtures for interconnect assemblies .67
9.2.1 Overview .67
9.2.2 Summary .67
9.2.3 Test fixture (FIX_ASY_1) .68

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9.2.4 Test fixture (FIX_ASY_2) .69
9.2.5 Test fixture (FIX_ASY_3) .70
9.2.6 Test fixture (FIX_ASY_4) .70
9.3 Interconnect assembly measurement equipment and setups .71
9.3.1 Summary .71
9.3.2 Setup (SET_ASY_1) .72
9.3.3 Setup (SET_ASY_2) .72
9.3.4 Setup (SET_ASY_3) .73
9.3.5 Setup (SET_ASY_4) .73
9.4 STD calibration .74
10 Level 1 interconnect assembly tests .74
10.1 Differential impedance .74
10.1.1 Overview .74
10.1.2 Point-to-point interconnect assemblies .74
10.1.2.1 Test fixtures for point-to-point interconnect assemblies .74
10.1.2.2 Measurement equipment and setup for point-to-point interconnect assemblies .74
10.1.2.3 Calibration and verification procedure for point-to-point interconnect assemblies .74
10.1.2.4 Test procedure and data output format for point-to-point interconnect assemblies .74
10.1.3 Multi-drop interconnect assemblies .74
10.1.3.1 Test fixtures for multi-drop interconnect assemblies .74
10.1.3.2 Measurement equipment and setup for multi-drop interconnect assemblies .74
10.1.3.3 Calibration and verification procedure for multi-drop interconnect assemblies .75
10.1.3.4 Test procedure and data output format for multi-drop interconnect assemblies .75
10.1.4 Connectorized backplanes .75
10.1.5 Acceptable values for all constructions of interconnect assemblies .75
10.2 Differential propagation time and propagation time skew .75
10.2.1 Overview .75
10.2.2 Point-to-point interconnect assemblies .75
10.2.2.1 Test fixtures for point-to-point interconnect assemblies .75
10.2.2.2 Measurement equipment and setup for point-to-point interconnect assemblies .75
10.2.2.3 Calibration and verification procedure for point-to-point interconnect assemblies .75
10.2.2.4 Test procedure and data output format for point-to-point interconnect assemblies .75
10.2.3 Multi-drop interconnect assemblies .75
10.2.4 Connectorized backplanes .76
10.2.5 Acceptable values for all constructions of interconnect assemblies .
...