ASTM E1634-94(1999)

Standard Guide for Performing Sputter Crater Depth Measurements

SCOPE
1.1 This guide covers the preferred procedure for acquiring and post-processing of sputter crater depth measurements. This guide is limited to stylus-type surface profilometers equipped with a stage, stylus, associated scan and sensing electronics, video system for sample and scan alignment, and computerized system.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 09-Apr-2002
• ICS: 71.040.50 - Physicochemical methods of analysis
• Technical Committee: E42 - Surface Analysis
• Drafting Committee: E42.08 - Ion Beam Sputtering

Relations

• Replaced By: ASTM E1634-02 - Standard Guide for Performing Sputter Crater Depth Measurements
• Effective Date: 10-Apr-2002
• Referred By: ASTM E2735-14(2020) - Standard Guide for Selection of Calibrations Needed for X-ray Photoelectron Spectroscopy (XPS) Experiments
• Effective Date: 10-Apr-2002
• Referred By: ASTM E1127-08(2015) - Standard Guide for Depth Profiling in Auger Electron Spectroscopy
• Effective Date: 10-Apr-2002

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: E 1634 – 94 (Reapproved 1999)
Standard Guide for
Performing Sputter Crater Depth Measurements
This standard is issued under the fixed designation E 1634; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope respect to the rastered ion beam and sample geometry or
suitable device feature(s).
1.1 This guide covers the preferred procedure for acquiring
5.2 Place the sample on the profilometer stage surface. If
and post-processing of sputter crater depth measurements. This
sample has an area of less than 1 cm , mount the sample onto
guide is limited to stylus-type surface profilometers equipped
another larger flat surface to prevent sample movement when
with a stage, stylus, associated scan and sensing electronics,
profilometry is performed. The system should be reasonably
video system for sample and scan alignment, and computerized
leveled; for details on instrumental adjustments, see manufac-
system.
turer’s operational manual(s). Keep the environment as dust-
1.2 This standard does not purport to address all of the
free as possible and dust-off the sample surface with clean
safety concerns, if any, associated with its use. It is the
air/gas jet before performing the measurement.
responsibility of the user of this standard to establish appro-
5.3 Pre-select surface profilometer operational settings;
priate safety and health practices and determine the applica-
computerized models are commonly used. Most surface pro-
bility of regulatory limitations prior to use.
filometers commonly permit selection of the following param-
2. Referenced Documents eters:
5.3.1 Stylus type (for example, diamond stylus),
2.1 ASTM Standards:
5.3.2 Stylus radius (for example, 5 μm; various stylus radii
E 673 Terminology Relating to Surface Analysis
are available depending upon desired resolution of measure-
E 1162 Practice for Reporting Sputter Depth Profile Data in
ment, and to a certain degree the strength of the stylus tip for
Secondary Ion Mass Spectrometry
varying hardness of materials),
3. Terminology
5.3.3 Stylus force (that is, force exerted on the analytical
sample during operation, for example, 15 mg; this is an
3.1 Definitions:
important variable when profiling sample with high hardness
3.1.1 Terms used in surface analysis are defined in Termi-
levels; damage to the stylus may occur, and hence damage to
nology E 673.
the instrumentation or errors in profilometry measurements, or
4. Significance and Use
both, may result),
5.3.4 Scan speed (for example, 50 μm/s; this value is
4.1 Sputter crater depth measurements are performed in
dependent upon permissible noise levels, accuracy, etc., and is
order to determine a sputter rate (depth/time) for each matrix
typically determined experimentally),
sputtered during a sputter depth profile or similar in-depth type
5.3.5 Scan length (one typically uses twice the crater size to
analyses. From sputter rate values, a linear depth scale can be
allow for scanning over the level areas about the sputtered
calculated and displayed for the sputter depth profile.
crater, and
4.2 Data obtained from surface profilometry instrumental
5.3.6 Number of scans for signal averaging (for example,
parameters (for example, raster size, shape, and any irregulari-
three repetitive scans averaged to improve the signal-to-noise
ties in topography of the sputtered crater) used for depth
ratio).
profiles.
5.4 Lower the stylus in an area outside the sputtered crater,
5. Procedure
at a distance from the crater edge of approximately one-half the
actual crater size, and in
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