IEC 62769-4:2021

Field Device Integration (FDI) - Part 4: FDI Packages

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.

Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI

L'IEC 62769-4:2021 spécifie les Paquetages FDI. L'architecture FDI complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans la Figure 1.

General Information

• Status: Published
• Publication Date: 04-Feb-2021
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Drafting Committee: WG 7 - TC 65/SC 65E/WG 7
• Current Stage: DELPUB - Deleted Publication
• Start Date: 28-Jan-2022
• Completion Date: 05-Apr-2023

Relations

• Revises: IEC 62769-4:2015 - Field Device Integration (FDI) - Part 4: FDI Packages
• Effective Date: 05-Sep-2023
• Revised: IEC 62769-4:2023 - Field Device Integration (FDI®) - Part 4: FDI Packages
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62769-4 ®
Edition 2.0 2021-02
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 4: FDI Packages
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

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International Standards for all electrical, electronic and related technologies.

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IEC 62769-4 ®
Edition 2.0 2021-02
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –

Part 4: FDI Packages
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9391-1

– 2 – IEC 62769-4:2021 RLV © IEC 2021

CONTENTS
FOREWORD . 7

INTRODUCTION . 2

1 Scope . 11

2 Normative references . 11

3 Terms, definitions, abbreviated terms and acronyms conventions . 13

3.1 Terms and definitions . 13

3.2 Abbreviated terms . 14
3.3 Conventions . 14
4 FDI Package Model . 14
4.1 Overview. 14
4.2 FDI Package Elements . 15
4.2.1 Package Catalog . 15
4.2.2 Electronic Device Description . 15
4.2.3 User Interface Plug-in . 16
4.2.4 Attachment . 17
4.3 FDI Package Types . 18
4.3.1 FDI Device Package . 18
4.3.2 FDI Communication Package . 18
4.3.3 FDI UIP Package . 19
4.3.4 FDI Profile Package . 19
5 FDI Package implementation . 21
5.1 Packaging technology . 21
5.2 Use of Open Packaging Conventions . 21
5.2.1 Unknown parts . 21
5.2.2 Invalid parts . 21
5.2.3 Unknown relationships . 21
5.2.4 Interleaving. 21
5.2.5 Core properties . 21
5.2.6 Thumbnails . 21
5.2.7 Digital signatures . 21
5.3 FDI Package Parts . 22
5.3.1 Package Catalog . 22

5.3.2 Electronic Device Description . 23
5.3.3 User Interface Plug-in . 23
5.3.4 Attachments . 26
6 FDI Package Versioning . 28
6.1 Version scheme . 28
6.2 Versioned elements . 29
6.3 Version Hierarchy . 29
6.4 UIP Compatibility . 31
7 Digital Signatures and Registration Certificates . 32
7.1 Signed Elements and Certification documents . 32
7.2 Signing mechanism . 33
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 34

Annex A (normative) File name conventions . 35

A.1 Identification . 35

A.2 FDI Package filename convention . 35

Annex B (informative) FDI Package Creation . 36

B.1 General . 36

B.2 Tools and Components . 36

B.3 Development . 36

Annex C (informative) FDI Package deployment . 39

C.1 General . 39

C.2 Scenarios . 39
Annex D (informative) Example . 42
D.1 General . 42
D.2 Open Packaging Conventions . 42
D.3 Creation and Handling of FDI Packages . 45
D.4 FDI Device Package Example . 45
Annex E (normative) Schema . 53
E.1 Target Namespace . 53
E.2 Catalog . 53
E.3 ClassificationIdT . 53
E.4 CommunicationProfileT . 53
E.5 CommunicationRoleT . 54
E.6 CommunicationServerT . 54
E.7 DeviceTypeT . 54
E.8 FdiRegistrationCert . 55
E.9 FdiRegistrationCertT . 55
E.10 HexStringT .
E.10 InterfaceT . 56
E.11 ListOfCommunicationProfilesT . 57
E.12 ListOfDeviceImagesT . 58
E.13 ListOfDeviceTypesT . 58
E.14 ListOfDocumentsT . 58
E.15 ListOfInterfacesT . 59
E.16 ListOfLocalizedStringsT . 59
E.17 ListOfProtocolSupportFilesT . 59

E.18 ListOfRegDeviceTypesT . 60
E.19 ListOfRegistrationsT . 60
E.20 ListOfSupportedDeviceRevisionsT . 61
E.21 ListOfSupportedUipsT . 61
E.22 ListOfUipVariantsT . 61
E.23 LocalizedStringT . 62
E.24 PackageT . 62
E.25 PackageTypeT . 63
E.26 PlatformT . 64
E.27 RegDeviceTypeT . 64
E.28 RegistrationT . 65
E.29 RelationshipIdT . 65
E.30 String256T . 66
E.31 SupportedUipT . 66

– 4 – IEC 62769-4:2021 RLV
...

IEC 62769-4 ®
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –
Partie 4: Paquetages FDI
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
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IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
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IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: [e-mail].
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IEC 62769-4 ®
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –

Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –

Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9311-9

– 2 – IEC 62769-4:2021 © IEC 2021
CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms, definitions, abbreviated terms and conventions . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
3.3 Conventions . 12
4 FDI Package Model . 12
4.1 Overview. 12
4.2 FDI Package Elements . 14
4.2.1 Package Catalog . 14
4.2.2 Electronic Device Description . 14
4.2.3 User Interface Plug-in . 14
4.2.4 Attachment . 16
4.3 FDI Package Types . 16
4.3.1 FDI Device Package . 16
4.3.2 FDI Communication Package . 17
4.3.3 FDI UIP Package . 18
4.3.4 FDI Profile Package . 18
5 FDI Package implementation . 20
5.1 Packaging technology . 20
5.2 Use of Open Packaging Conventions . 20
5.2.1 Unknown parts . 20
5.2.2 Invalid parts . 20
5.2.3 Unknown relationships . 20
5.2.4 Interleaving. 20
5.2.5 Core properties . 20
5.2.6 Thumbnails . 20
5.2.7 Digital signatures . 20
5.3 FDI Package Parts . 21
5.3.1 Package Catalog . 21
5.3.2 Electronic Device Description . 22
5.3.3 User Interface Plug-in . 22
5.3.4 Attachments . 25
6 FDI Package Versioning . 27
6.1 Version scheme . 27
6.2 Versioned elements . 28
6.3 Version Hierarchy . 28
6.4 UIP Compatibility . 30
7 Digital Signatures and Registration Certificates . 31
7.1 Signed Elements and Certification documents . 31
7.2 Signing mechanism . 32
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 33

Annex A (normative) File name conventions . 34
A.1 Identification . 34
A.2 FDI Package filename convention . 34
Annex B (informative) FDI Package Creation . 35
B.1 General . 35
B.2 Tools and Components . 35
B.3 Development . 35
Annex C (informative) FDI Package deployment . 38
C.1 General . 38
C.2 Scenarios . 38
Annex D (informative) Example . 41
D.1 General . 41
D.2 Open Packaging Conventions . 41
D.3 Creation and Handling of FDI Packages . 44
D.4 FDI Device Package Example . 44
Annex E (normative) Schema . 52
E.1 Target Namespace . 52
E.2 Catalog . 52
E.3 ClassificationIdT . 52
E.4 CommunicationProfileT . 52
E.5 CommunicationRoleT . 52
E.6 CommunicationServerT . 53
E.7 DeviceTypeT . 53
E.8 FdiRegistrationCert . 54
E.9 FdiRegistrationCertT . 54
E.10 InterfaceT . 55
E.11 ListOfCommunicationProfilesT . 56
E.12 ListOfDeviceImagesT . 57
E.13 ListOfDeviceTypesT .
...