IEC TS 63290:2024

Supplementary requirements for intelligent assemblies

IEC TS 63290:2024 provides additional requirements for assemblies in accordance with the product standards of the IEC 61439 series (Part 2 onwards) that incorporate digital functions and communication, in addition to the conventional electromechanical features of assemblies to reflect what is defined within this document as intelligence. It specifies the definitions, service conditions, constructional requirements, technical characteristics and verification requirements that can be carried out in addition to the IEC 61439 series for intelligent low-voltage switchgear and controlgear assemblies.

General Information

• Status: Published
• Publication Date: 27-Nov-2024
• ICS: 29.130.20 - Low voltage switchgear and controlgear
• Technical Committee: SC 121B - Low-voltage switchgear and controlgear assemblies
• Drafting Committee: PT 63290 - TC 121/SC 121B/PT 63290
• Current Stage: PPUB - Publication issued
• Start Date: 22-Nov-2024
• Completion Date: 28-Nov-2024

Standards Content (Sample)

IEC TS 63290 ®
Edition 1.0 2024-11
TECHNICAL
SPECIFICATION
Supplementary requirements for intelligent assemblies

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IEC TS 63290 ®
Edition 1.0 2024-11
TECHNICAL
SPECIFICATION
Supplementary requirements for intelligent assemblies

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.130.20  ISBN 978-2-8327-0037-2

– 2 – IEC TS 63290:2024 © IEC 2024
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Symbols and abbreviated terms . 12
5 Interface characteristics. 12
6 Information . 12
6.1 Assembly designation marking . 12
7 Service conditions . 13
8 Intelligent assembly profile . 13
8.1 General . 13
8.2 Intelligent assembly for measurement . 14
8.3 Intelligent assembly for control. 14
8.4 Intelligent assembly for management . 14
9 Constructional requirements . 16
9.1 Constructional requirements of intelligent assembly . 16
9.1.1 General rules . 16
9.1.2 Cable compartment . 16
9.2 Functional requirements . 16
9.2.1 General . 16
9.2.2 Intelligent assembly for measurement . 16
9.2.3 Intelligent assembly for control . 17
9.2.4 Intelligent assembly for management . 17
9.2.5 Communication modes . 18
9.3 System requirements . 18
9.3.1 General rules . 18
9.3.2 Selection of components . 19
9.3.3 Installation of devices with communication interface . 20
9.3.4 System configuration . 20
9.3.5 System software . 20
9.3.6 Control power supply for intelligent devices . 21
9.3.7 Interfaces . 21
9.3.8 Reliability and response time for control functions . 21
9.3.9 Network and system security . 21
9.4 Assembly and wiring . 22
9.4.1 General . 22
9.4.2 Arrangement of components . 22
9.4.3 Wiring rules . 22
10 Design considerations . 23
10.1 General . 23
10.2 Incorporation of electronic devices, thermal aspects . 23
10.3 Incorporation of electronic devices, EMC aspects . 23
10.3.1 General . 23
10.3.2 Device location considering EMC constraints . 24
10.3.3 Recommended dimension of the functional unit compartment . 24

10.4 Integration of radio communication devices in an intelligent assembly . 23
11 Design verification . 25
12 Routine verification . 25
12.1 Construction . 25
12.1.1 Assembly structure . 25
12.1.2 System configuration . 25
12.2 Wiring, operational performance and function . 25
Annex A (informative) System configuration . 28
Annex B (informative) Installation and wiring rules . 29
B.1 General rules for cabling . 29
B.2 To segregate sensitive cables from power cables . 29
B.3 Cables length . 31
B.3.1 Power cables . 31
B.3.2 Communication cables . 32
B.3.3 Earth continuity . 32
B.4 Rules for communication network . 33
B.4.1 Ethernet network . 33
B.4.2 Ethernet connector . 33
B.5 Auxiliary power supply wiring installation . 33
B.6 Installing devices . 34
B.6.1 General . 34
B.6.2 Installation of power meter and accessories – Display location . 35
B.7 Installation of trunking . 36
Annex C (informative) Measures to reduce the effects of electromagnetic influences . 37
C.1 General . 37
C.2 Mitigation of electromagnetic interference (EMI) . 37
C.2.1 General . 37
C.2.2 Measures to reduce EMI . 37
C.2.3 Separation and segregation of cables . 38
Annex D (informative) Communication network media and protocols . 39
D.1 General . 39
D.2 Multi-vendor interoperable communication system . 39
D.2.1 General . 39
D.2.2 Ethernet and IP standard solution . 39
D.2.3 OPC UA – Open Platform Communication Unified Architecture . 40
D.2.4 Ethernet, the targeted physical layer . 40
D.3 Alternatives to the Ethernet solutions . 41
Annex E (informative) Documentation of software and firmware revisions . 42
Annex F (informative) Documentation of access control . 44
Annex G (informative) Examples of a connected building with intelligent assemblies . 45
Annex H (informative) Examples of temperature mapping . 47
Annex I (informative) Examples of EMC aspects . 49
Annex J (informative) List of notes concerning certain countries . 52
Bibliography . 53

Figure 1 – Example of a connected environment . 7
Figure 2 – Intelligent assembly profile . 15

– 4 – IEC TS 63290:2024 © IEC 2024
Figure 3 – Locations in respect of EMC for a large assembly . 24
Figure A.1 – Example of system configuration. 28
Figure B.1 – Rules for arrangement of communication cable and power cable . 30
Figure B.2 – Example of shielding . 31
Figure B.3 – Typical installation with and without appropriate cables lengths . 32
Figure B.4 – Examples of communication cables .
...