IEC 61784-1:2019

Industrial communication networks - Profiles Part 1: Fieldbus profiles

IEC 61784-1:2019 defines a set of protocol specific communication profiles based primarily on the IEC 61158 series, to be used in the design of devices involved in communications in factory manufacturing and process control. This fifth edition cancels and replaces the fourth edition published in 2014 it constitutes a technical revision. The main changes are:
• update of the dated references to the IEC 61158 series, to IEC 61784 2, to the IEC 61784 3 series, to the IEC 61784-5 series and to IEC 61918 throughout the document;
• update of selection tables CPF 2, CPF 4 and CPF 8

Réseaux de communication industriels - Profils - Partie 1 : Profils de bus de terrain

l’IEC 61784-1:2019 définit un jeu de profils de communication spécifiques au protocole, principalement fondé sur la série de normes IEC 61158, à utiliser pour la conception d’appareils employés en communication dans le cadre du contrôle de la fabrication et du processus en usine.
Chaque profil choisit des spécifications pour la pile du protocole de communication au niveau de l’appareil. Il comporte un jeu minimal de services exigés au niveau de la couche application et la spécification d'options dans les couches intermédiaires définies par le biais de références. Si aucune couche application n'est incluse, il est spécifié un jeu minimal de services exigés au niveau de la couche liaison de données. Les références appropriées aux types spécifiques au protocole sont données dans chaque famille de profils de communication ou dans des profils associés.
ette cinquième édition annule et remplace la quatrième édition parue en 2014. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
• la mise à jour des références datées à la série IEC 61158, à l’IEC 61784-2, à la série IEC 61784-3, à la série IEC 61784-5 et à l’IEC 61918 dans l'ensemble du document;
• la mise à jour des tableaux de sélection pour CPF 2, CPF 4 et CPF 8.
La présente version bilingue (2020-03) correspond à la version anglaise monolingue publiée en 2019-04.
La version française de cette norme n'a pas été soumise au vote

General Information

• Status: Replaced
• Publication Date: 09-Apr-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 35.100.20 - Data link layer
• ICS: 35.240.50 - IT applications in industry
• Technical Committee: SC 65C - Industrial networks
• Drafting Committee: WG 9 - TC 65/SC 65C/WG 9
• Current Stage: DELPUB - Deleted Publication
• Start Date: 15-May-2020
• Completion Date: 24-Mar-2023

Relations

• Replaced By: IEC 61784-1-5:2023 - Industrial networks - Profiles - Part 1-5: Fieldbus profiles - Communication Profile Family 5
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-16:2023 - Industrial networks - Profiles - Part 1-16: Fieldbus profiles - Communication Profile Family 16
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-9:2023 - Industrial networks - Profiles - Part 1-9: Fieldbus profiles - Communication Profile Family 9
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-1:2023 - Industrial networks - Profiles - Part 1-1: Fieldbus profiles - Communication Profile Family 1
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-19:2023 - Industrial networks - Profiles - Part 1-19: Fieldbus profiles - Communication Profile Family 19
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-6:2023 - Industrial networks - Profiles - Part 1-6: Fieldbus profiles - Communication Profile Family 6
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-0:2023 - Industrial networks - Profiles - Part 1-0: Fieldbus profiles - General concepts and terminology
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-2:2023 - Industrial networks - Profiles - Part 1-2: Fieldbus profiles - Communication Profile Family 2
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-8:2023 - Industrial networks - Profiles - Part 1-8: Fieldbus profiles - Communication Profile Family 8
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-22:2023 - Industrial networks - Profiles - Part 1-22: Fieldbus profiles - Communication Profile Family 22
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-3:2023 - Industrial networks - Profiles - Part 1-3: Fieldbus profiles - Communication Profile Family 3
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61784-1-4:2023 - Industrial networks - Profiles - Part 1-4: Fieldbus profiles - Communication Profile Family 4
• Effective Date: 05-Sep-2023
• Revises: IEC 61784-1:2014 - Industrial communication networks - Profiles - Part 1: Fieldbus profiles
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61784-1 ®
Edition 5.0 2019-04
INTERNATIONAL
STANDARD
colour
inside
Industrial communication networks – Profiles –
Part 1: Fieldbus profiles
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

Centre: [e-mail].
IEC 61784-1 ®
Edition 5.0 2019-04
INTERNATIONAL
STANDARD
colour
inside
Industrial communication networks – Profiles –

Part 1: Fieldbus profiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.100.20; 35.240.50 ISBN 978-2-8322-6724-0

– 2 – IEC 61784-1:2019 © IEC 2019

CONTENTS
FOREWORD . 15

INTRODUCTION . 17

1 Scope . 18

2 Normative references . 19

3 Terms, definitions, abbreviated terms, symbols, and conventions . 23

3.1 Terms and definitions . 23

3.2 Abbreviations and symbols . 24

3.2.1 IEC 61158 abbreviations and symbols . 24
3.2.2 Other abbreviations and symbols . 24
3.3 Conventions . 24
3.3.1 Conventions common to all layers . 24
3.3.2 Physical layer . 26
3.3.3 Data-link layer . 26
3.3.4 Application layer . 27
4 Conformance to communication profiles . 27
5 Communication Profile Family 1 (FOUNDATION™ fieldbus) . 28
5.1 General overview . 28
5.2 Profile 1/1 (FOUNDATION™ H1) . 29
5.2.1 Physical layer . 29
5.2.2 Data-link layer . 45
5.2.3 Application layer . 115
5.3 Profile 1/2 (FOUNDATION™ HSE) . 117
5.3.1 Physical layer . 117
5.3.2 Data-link layer . 117
5.3.3 Network layer . 117
5.3.4 Transport layer . 117
5.3.5 Application layer . 117
5.4 Profile 1/3 (FOUNDATION™ H2) . 118
5.4.1 Physical layer . 118
5.4.2 Data-link layer . 121
5.4.3 Application layer . 121
6 Communication Profile Family 2 (CIP™) . 121

6.1 General overview . 121
6.2 Profile 2/1 (ControlNet) . 122
6.2.1 Physical layer . 122
6.2.2 Data-link layer . 123
6.2.3 Application layer . 125
6.3 Profile 2/2 (EtherNet/IP) . 126
6.3.1 Physical layer . 126
6.3.2 Data-link layer . 127
6.3.3 Application layer . 128
6.4 Profile 2/3 (DeviceNet) . 130
6.4.1 Physical layer . 130
6.4.2 Data-link layer . 131
6.4.3 Application layer . 132
7 Communication Profile Family 3 (PROFIBUS & PROFINET) . 134

7.1 General overview . 134

7.2 Profile 3/1 (PROFIBUS DP). 135

7.2.1 Physical layer . 135

7.2.2 Data-link layer . 137

7.2.3 Application layer . 162

7.3 Profile 3/2 (PROFIBUS PA) . 219

7.3.1 Physical layer . 219

7.3.2 Data-link layer . 223

7.3.3 Application layer . 235

8 Communication Profile Family 4 (P-NET®) . 236

8.1 General overview . 236
8.2 Profile 4/1 (P-NET RS-485) . 236
8.2.1 Physical layer . 236
8.2.2 Data-link layer . 237
8.2.3 Application layer . 238
9 Communication Profile Family 5 (WorldFIP®) . 239
9.1 General overview . 239
9.2 Profile 5/1 (WorldFIP) . 240
9.2.1 Physical layer . 240
9.2.2 Data-link layer . 242
9.2.3 Application layer . 245
9.3 Profile 5/2 (WorldFIP) . 251
9.3.1 Physical layer . 251
9.3.2 Data-link layer . 251
9.3.3 Application layer . 251
9.4 Profile 5/3 (WorldFIP) . 257
9.4.1 Physical layer . 257
9.4.2 Data-link layer . 257
9.4.3 Application layer . 257
10 Communication Profile Family 6 (INTERBUS®) . 258
10.1 General overview . 258
10.2 Profile 6/1 . 259
10.2.1 Physical layer . 259
10.2.2 Data-link layer . 261
10.2.3 Application layer . 263

10.3 Profile 6/2 . 264
10.3.1 Physical layer . 264
10.3.2 Data-link layer . 265
10.3.3 Application layer . 266
10.4 Profile 6/3 . 267
10.4.1 Physical layer . 267
10.4.2 Data-link layer . 267
10.4.3 Application layer . 268
11 Communication Profile Family 7 – Void . 269
12 Communication Profile Family 8 (CC-Link) . 270
12.1 General overview . 270
12.1.1 General . 270
12.1.2 Profile 8/1 . 270

– 4 – IEC 6
...

IEC 61784-1 ®
Edition 5.0 2019-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial communication networks – Profiles –
Part 1: Fieldbus profiles
Réseaux de communication industriels – Profils –
Partie 1: Profils de bus de terrain

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

Centre: [e-mail].
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC - Electropedia - www.electropedia.org
webstore.iec.ch/advsearchform Le premier dictionnaire d'électrotechnologie en ligne au
La recherche avancée permet de trouver des publications IEC monde, avec plus de 22 000 articles terminologiques en
en utilisant différents critères (numéro de référence, texte, anglais et en français, ainsi que les termes équivalents dans
comité d’études,…). Elle donne aussi des informations sur les 16 langues additionnelles. Egalement appelé Vocabulaire
projets et les publications remplacées ou retirées. Electrotechnique International (IEV) en ligne.

IEC Just Published - webstore.iec.ch/justpublished Glossaire IEC - std.iec.ch/glossary
Restez informé sur les nouvelles publications IEC. Just 67 000 entrées terminologiques électrotechniques, en anglais
Published détaille les nouvelles publications parues. et en français, extraites des articles Termes et Définitions des
Disponible en ligne et une fois par mois par email. publications IEC parues depuis 2002. Plus certaines entrées
antérieures extraites des publications des CE 37, 77, 86 et
Service Clients - webstore.iec.ch/csc CISPR de l'IEC.

Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
[e-mail].
IEC 61784-1 ®
Edition 5.0 2019-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial communication networks – Profiles –

Part 1: Fieldbus profiles
Réseaux de communication industriels – Profils –

Partie 1: Profils de bus de terrain

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 35.100.20; 35.240.50 ISBN 978-2-8322-8030-0

– 2 – IEC 61784-1:2019 © IEC 2019
CONTENTS
FOREWORD . 15
INTRODUCTION . 17
1 Scope . 18
2 Normative references . 19
3 Terms, definitions, abbreviated terms, symbols, and conventions . 23
3.1 Terms and definitions . 23
3.2 Abbreviations and symbols . 24
3.2.1 IEC 61158 abbreviations and symbols . 24
3.2.2 Other abbreviations and symbols . 24
3.3 Conventions . 24
3.3.1 Conventions common to all layers . 24
3.3.2 Physical layer . 26
3.3.3 Data-link layer . 26
3.3.4 Application layer . 27
4 Conformance to communication profiles . 27
5 Communication Profile Family 1 (FOUNDATION™ fieldbus) . 28
5.1 General overview . 28
5.2 Profile 1/1 (FOUNDATION™ H1) . 29
5.2.1 Physical layer . 29
5.2.2 Data-link layer . 45
5.2.3 Application layer . 115
5.3 Profile 1/2 (FOUNDATION™ HSE) . 117
5.3.1 Physical layer . 117
5.3.2 Data-link layer . 117
5.3.3 Network layer . 117
5.3.4 Transport layer . 117
5.3.5 Application layer . 117
5.4 Profile 1/3 (FOUNDATION™ H2) . 118
5.4.1 Physical layer . 118
5.4.2 Data-link layer . 121
5.4.3 Application layer . 121
6 Communication Profile Family 2 (CIP™) . 121
6.1 General overview . 121
6.2 Profile 2/1 (ControlNet) . 122
6.2.1 Physical layer . 122
6.2.2 Data-link layer . 123
6.2.3 Application layer . 125
6.3 Profile 2/2 (EtherNet/IP) . 126
6.3.1 Physical layer . 126
6.3.2 Data-link layer . 127
6.3.3 Application layer . 128
6.4 Profile 2/3 (DeviceNet) . 130
6.4.1 Physical layer . 130
6.4.2 Data-link layer . 131
6.4.3 Application layer . 132
7 Communication Profile Family 3 (PROFIBUS & PROFINET) . 134

7.1 General overview . 134
7.2 Profile 3/1 (PROFIBUS DP). 135
7.2.1 Physical layer . 135
7.2.2 Data-link layer . 137
7.2.3 Application layer . 162
7.3 Profile 3/2 (PROFIBUS PA) . 219
7.3.1 Physical layer . 219
7.3.2 Data-link layer . 223
7.3.3 Application layer . 235
8 Communication Profile Family 4 (P-NET®) . 236
8.1 General overview . 236
8.2 Profile 4/1 (P-NET RS-485) . 236
8.2.1 Physical layer . 236
8.2.2 Data-link layer . 237
8.2.3 Application layer . 238
9 Communication Profile Family 5 (WorldFIP®) . 239
9.1 General overview . 239
9.2 Profile 5/1 (WorldFIP) . 240
9.2.1 Physical layer . 240
9.2.2 Data-link layer . 242
9.2.3 Application layer . 245
9.3 Profile 5/2 (WorldFIP) . 251
9.3.1 Physical layer . 251
9.3.2 Data-link layer . 251
9.3.3 Application layer . 251
9.4 Profile 5/3 (WorldFIP) . 257
9.4.1 Physical layer .
...