IEC PAS 61076-4-115:2001
(Main)Connectors for electronic equipment - Part 4-115: Printed board connectors - Detail specification for a single-part hybrid connector, with a section of high-speed differential pair connections, and a section of low-speed, power and ground connections between printed boards and backplanes, in accordance with IEC 60917
Connectors for electronic equipment - Part 4-115: Printed board connectors - Detail specification for a single-part hybrid connector, with a section of high-speed differential pair connections, and a section of low-speed, power and ground connections between printed boards and backplanes, in accordance with IEC 60917
Is a detail specification describing a single-part hybrid connector, with a section for high-speed on a 3 mm grid and a low-speed section with power and ground connections on a 2 mm grid, for printed boards and backplanes in accordance with IEC 60917.
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IEC/PAS 61076-4-115
Edition 1.0
2001-06
Connectors for electronic equipment –
Part 4-115:
Printed board connectors –
Detail specification for a single-part
hybrid connector, with a section
of high-speed differential pair connections,
and a section of low-speed, power
and ground connections between
printed boards and backplanes,
in accordance with IEC 60917
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 61076-4-115
C O MMI S S I O N
IEC/PAS 61076-4-115
Edition 1.0
2001-06
Connectors for electronic equipment –
Part 4-115:
Printed board connectors –
Detail specification for a single-part
hybrid connector, with a section
of high-speed differential pair connections,
and a section of low-speed, power
and ground connections between
printed boards and backplanes,
in accordance with IEC 60917
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 61076-4-115
C O MMI S S I O N
– 2 – Copyright © 2001, IEC
CONTENTS
1. General data 7
1.1. Recommended method of mounting .7
1.1.1. Number of contacts and contact cavities .8
1.2. Ratings and characteristics.8
1.3. Normative references.9
1.4. Marking.10
1.5. IEC type designation.10
1.6. Ordering information .10
2. Technical data 11
2.1. Definitions.11
2.1.1. Mechanical features.11
2.1.2. Contacts and terminations .11
2.1.3. Engagement sequence.11
2.2. Survey of styles and variants .12
2.2.1. Styles of connectors .12
2.2.2. Styles of termination .12
2.2.3. Variants of the paddle-guard.12
2.3. Information on application.13
2.3.1. Description of the connector .13
2.3.2. Contact designation.14
2.3.3. Arrangement of contact levels .16
2.3.4. Polarisation and keying.16
2.3.5. Mounting on backplane.16
2.3.6. Mounting on the plug-in card.16
3. Dimensional Information 17
3.1. General.17
3.2. Isometric view and common features.17
3.2.1. Common features.18
3.2.2. Height dimensions .18
3.2.3. Width dimensions .19
3.2.4. Depth dimensions.19
3.3. Mating information .20
3.3.1. Engaging direction.20
3.3.2. Perpendicular to engaging direction.21
3.3.3. Inclination .22
3.4. Fixed connector .23
3.4.1. Dimensions of fixed connector.23
3.4.2. Dimensions of contacts and terminations .24
3.5. Plug-in card paddle.24
3.5.1. Dimensions of paddle-guard .24
3.6. Mounting information for fixed connector .26
3.6.1. Footprint for press-in / compression mounted fixed connector.26
3.6.2. Footprint for press-in only mounted fixed connector.26
3.6.3. Footprint for surface-mount soldered fixed connector .26
3.7. Mounting information for paddle-guard.27
3.7.1. Footprint for high-speed and shielding ground connections .27
3.7.2. Footprint for low-speed connections .28
3.8. Gauges.29
3.8.1. Compression force gauges for high-speed section .29
3.8.2. Sizing and compression force gauges for low-speed section.32
4. Characteristics 34
4.1. Climatic category .34
4.2. Electrical.34
4.2.1. Creepage and clearance distances.34
4.2.2. Voltage proof .34
4.2.3. Current carrying capacity.35
4.2.4. Contact resistance.36
4.2.5. Insulation resistance.36
4.2.6. Inductance.36
4.3. Mechanical.37
4.3.1. Mechanical operation.37
4.3.2. Engaging and separating forces .37
4.3.3. Gauge supporting force .37
4.3.4. Vibration (sinusoidal) .37
4.3.5. Shock .38
4.3.6. Polarising method.38
4.3.7. Retention of fixed connector on backplane .38
4.3.8. Retention of the paddle-guard.38
4.4. High-speed characteristics.39
4.4.1. Differential impedance.39
4.4.2. Differential crosstalk .40
4.4.3. Differential attenuation.41
4.4.4. Propagation delay skew.41
5. Test schedule 42
5.1. General.42
5.1.1. Layout of printed circuit boards for electromechanical tests.43
5.1.2. Layout of printed circuit boards for signal integrity validation .44
5.1.3. Arrangement for contact resistance measurement .45
5.1.4. Arrangement for dynamic stress tests .45
5.1.5. Arrangement for insulation resistance, voltage proof and polarisation voltage .45
5.1.6. Arrangement for gauge supporting force test on high-speed contacts .47
5.1.7. Arrangement for gauge supporting force test on low-speed contacts.48
5.2. Test schedule tables.49
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