IEC 62769-6:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

Intégration des appareils de terrain (FDI®) - Partie 6: Mappings de technologies FDI

L'IEC 62769-6:2023 spécifie le mapping de technologies pour les concepts décrits dans la norme d'intégration des appareils de terrain (FDI®[1], Field Device Integration). Le mapping de technologies porte essentiellement sur la mise en œuvre des composants Client FDI® et Plugiciel d'interface utilisateur (UIP)) dans les technologies spécifiées pour les plateformes WORKSTATION et MOBILE définies dans l'IEC 62769-4. Les technologies .NET et HTML5 actuellement prises en charge sont traitées dans les différentes sous-parties.

General Information

• Status: Published
• Publication Date: 05-Apr-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Drafting Committee: WG 7 - TC 65/SC 65E/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 21-Mar-2023
• Completion Date: 06-Apr-2023

Relations

• Revises: IEC 62769-6:2021 - Field Device Integration (FDI) - Part 6: Technology Mapping
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62769-6 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI®) –
Part 6: FDI® Technology Mappings

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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About the IEC
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International Standards for all electrical, electronic and related technologies.

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(IEV) online.
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further assistance, please contact the Customer Service
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IEC 62769-6 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI®) –
Part 6: FDI® Technology Mappings
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6837-7
– 2 – IEC 62769-6:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms, acronyms and conventions . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms and acronyms . 8
3.3 Symbols .
3.4 Conventions .
4 Technical concepts .
4.1 General .
4.1.1 Overview .
4.1.2 Platforms .
4.1.3 FDI Type Library .
4.2 UIP representation .
4.3 UIP executable representation .
4.4 UIP executable compatibility rules .
4.5 Allowed .NET Common Language Run-time versions .
4.5.1 General .
4.5.2 CLR compatibility strategy .
4.5.3 How to identify the .NET target platform of a UIP .
4.6 UIP Deployment .
4.7 UIP Lifecycle.
4.7.1 General .
4.7.2 UIP Assembly activation steps .
4.7.3 UIP Assembly deactivation steps .
4.8 Interaction between an FDI Client and a UIP .
4.8.1 Handling of standard UI elements .
4.8.2 Non-blocking service execution .
4.8.3 Blocking service execution.
4.8.4 Cancel service execution .
4.8.5 Threading .
4.8.6 Timeout .
4.8.7 Exception handling .
4.8.8 Type safe interfaces .
4.8.9 Globalization and localization .
4.8.10 WPF Control handling .
4.8.11 Win Form handling .
4.9 Security .
4.9.1 General .
4.9.2 Access permissions .
4.9.3 Code identity concept .
5 Interface definition .
4 Platforms and runtime. 27
4.1 Runtime . 27
4.1.1 .NET Framework . 27
4.1.2 HTML5 . 27

4.2 Platforms . 27
4.2.1 Workstation . 27
4.2.2 Mobile . 27
Bibliography . 28

Figure 1 – FDI Type Library structure .
Figure 2 – .NET surrogate process .
Figure 3 – Identification of Run-time Version.
Figure 4 – IAsyncPattern based asynchronous service execution example .
Figure 5 – Blocking service execution example using IAsyncResult based pattern .
Figure 6 – Cancel service processing sequence example .
Figure 7 – Exception source .

Table 1 – Technology edition reference .
Table 2 – Base Property Services .
Table 3 – Device Model Services .
Table 4 – Access Control Services .
Table 5 – Direct Access Services .
Table 6 – Hosting Services .
Table 7 – UIP Services .
Table 8 – Base Data Types .
Table 9 – Special Types .

– 4 – IEC 62769-6:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 6: FDI Technology Mappings

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the
...

IEC 62769-6 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Field device integration (FDI®) –
Part 6: FDI® Technology Mappings

Intégration des appareils de terrain (FDI®) –
Partie 6: Mappings de technologies FDI®

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
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Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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IEC 62769-6 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Field device integration (FDI®) –

Part 6: FDI® Technology Mappings

Intégration des appareils de terrain (FDI®) –

Partie 6: Mappings de technologies FDI®

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6477-5

– 2 – IEC 62769-6:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, abbreviated terms, acronyms and conventions . 5
3.1 Terms and definitions . 5
3.2 Abbreviated terms and acronyms . 6
4 Platforms and runtime. 6
4.1 Runtime . 6
4.1.1 .NET Framework . 6
4.1.2 HTML5 . 6
4.2 Platforms . 6
4.2.1 Workstation . 6
4.2.2 Mobile . 6
Bibliography . 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 6: FDI Technology Mappings

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62769-6 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2021. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Separated each technology mapping out to subparts of Part 6 (i.e., Part 6-xxx)

– 4 – IEC 62769-6:2023 © IEC 2023
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/867/CDV 65E/924/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62769 series, published under the general title Field device ®
integration (FDI ), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended. ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 6: FDI Technology Mappings

1 Scope
This part of IEC 62769 specifies the technology mapping for the concepts described in the Field
®1
Device Integration (FDI ) standard. The technology mapping focuses on implementation of the ®
components FDI Client and User Interface Plug-in (UIP) in the specified technologies for the
WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are
individual subparts for the currently supported technologies .NET and HTML5.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies. ®
IEC 62769-1, Field Device Integration (FDI ) – Part 1: Overview ®
) – Part 6-100: Technology Mapping – .NET
IEC 62769-6-100, Field Device Integration (FDI ®
IEC 62769-6-200, Field Device Integration (FDI ) – Part 6-200: Technology Mapping – HTML5 ®
FCG TS10099, Field Device Integration (FDI ) – Technology Management
HTML5, W3C Recommendation. World Wide Web Consortium (W3C) (2014)
ECMA-262, ECMAScript 2016 Language Specification
3 Terms, definitions, abbreviated terms, acronyms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62769-1 apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
___________
1 ®
FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given
for the convenie
...