IEC 62453-302:2023

Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

IEC 62453-302:2023 provides information for integrating the CIP™ technology into the FDT interface specification (IEC 62453‑2). Communication Profile Family 2 (commonly known as CIP™[1]) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]), and CP 2/3 (DeviceNet™1) are defined in IEC 61784‑1 and IEC 61784‑2. An additional communication profile (CompoNet™1), also based on CIP™, is defined in IEC 62026-7. This part of IEC 62453 specifies communication and other services. This specification neither contains the FDT specification nor modifies it.
[1] CIP™ (Common Industrial Protocol), DeviceNet™ and CompoNet™ are trade names of Open DeviceNet Vendor Association, Inc (ODVA). This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trade name holder or any of its products. Compliance to this standard does not require use of the trade names CIP™, DeviceNet™ or CompoNet™. Use of the trade names CIP™, DeviceNet™ or CompoNet™ requires permission of Open DeviceNet Vendor Association, Inc.
[2] ControlNet™ is a trade name of ControlNet International, Ltd. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name ControlNet™. Use of the trade name ControlNet™ requires permission of ControlNet International, Ltd.
[3] EtherNet/IP™ is a trade name of ControlNet International, Ltd. and Open DeviceNet Vendor Association, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name EtherNet/IP™. Use of the trade name EtherNet/IP™ requires permission of either ControlNet International, Ltd. or Open DeviceNet Vendor Association, Inc.

Spécification des interfaces des outils des dispositifs de terrain (FDT) - Partie 302: Intégration des profils de communication - CPF 2 de l'IEC 61784

L’IEC 62453-302:2023 fournit des informations sur l’intégration de la technologie CIP™ dans la spécification des interfaces des outils des dispositifs de terrain (FDT) (IEC 62453‑2). La Famille de profils de communication 2 (communément appelée CIP™[1]) définit des profils de communication basés sur les normes IEC 61158‑2 Type 2, IEC 61158‑3‑2, IEC 61158‑4‑2, IEC 61158‑5‑2, IEC 61158‑6‑2 et IEC 62026‑3. Les profils de base CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]) et CP 2/3 (DeviceNet™1) sont définis dans l’IEC 61784‑1 et l’IEC 61784‑2. Un Profil de communication supplémentaire (CompoNet™1), également basé sur CIP™, est défini dans l’IEC 62026-7. La présente partie de l’IEC 62453 spécifie les services de communication et autres services. La présente spécification ne contient pas la spécification des outils FDT et ne la modifie pas.
[1] CIP™ (Common Industrial Protocol), DeviceNet™ et CompoNet™ sont les appellations commerciales de Open DeviceNet Vendor Association, Inc (ODVA). Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à la présente norme n’exige pas l’emploi des appellations commerciales CIP™, DeviceNet™ ou CompoNet™. L’utilisation des appellations commerciales CIP™, DeviceNet™ ou CompoNet™ nécessite l’autorisation de Open DeviceNet Vendor Association, Inc.
[2] ControlNet™ est l’appellation commerciale de ControlNet International, Ltd. Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à ce profil n’exige pas l’emploi de l’appellation commerciale ControlNet™. L’utilisation de l’appellation commerciale ControlNet™ nécessite l’autorisation de ControlNet International, Ltd.
[3] EtherNet/IP™ est l’appellation commerciale de ControlNet International, Ltd et de Open DeviceNet Vendor Association, Inc. Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à ce profil n’exige pas l’emploi de l’appellation commerciale EtherNet/IP™. L’utilisation de l’appellation commerciale EtherNet/IP™ nécessite l’autorisation de ControlNet International, Ltd. ou de Open DeviceNet Vendor Association, Inc.

General Information

• Status: Published
• Publication Date: 07-Nov-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• ICS: 35.110 - Networking
• Technical Committee: SC 65E - Devices and integration in enterprise systems
• Current Stage: PPUB - Publication issued
• Start Date: 08-Dec-2023
• Completion Date: 08-Nov-2023

Relations

• Revises: IEC 62453-302:2016 - Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62453-302 ®
Edition 3.0 2023-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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IEC 62453-302 ®
Edition 3.0 2023-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40, 35.100.05, 35.110 ISBN 978-2-8322-7830-7

– 2 – IEC 62453-302:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 2
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, symbols, abbreviated terms and conventions . 8
3.1 Terms and definitions . 8
3.2 Symbols and abbreviated terms . 8
3.3 Conventions . 9
3.3.1 Data type names and references to data types . 9
3.3.2 Vocabulary for requirements . 9
4 Bus category . 9
5 Access to instance and device data . 11
6 Protocol specific behavior . 11
7 Protocol specific usage of general data types . 11
8 Protocol specific common data types . 12
9 Network management data types . 16
9.1 General . 16
9.2 Node address . 16
9.3 Scanner/master – Bus parameter set (CIP) . 16
10 Communication data types. 24
11 Channel parameter data types . 27
12 Device identification . 29
12.1 Device type identification data types . 29
12.2 Topology scan data types . 30
12.3 Scan identification data types . 30
12.4 Device type identification data types . 31
Annex A (informative) Implementation hints . 34
A.1 Addressing in CompoNet DTMs . 34
A.2 Displaying addresses of CompoNet DTMs . 35
A.3 Handling of Config1 and Config2 elements in EtherNet/IP . 35
Bibliography . 36

Figure 1 – Part 302 of the IEC 62453 series . 6
Figure A.1 – Examples of DTM naming for CompoNet . 35

Table 1 – Protocol identifiers . 9
Table 2 – Physical layer identifiers for DeviceNet . 9
Table 3 – Physical layer identifiers for ControlNet . 9
Table 4 – Physical layer identifiers for Ethernet/IP . 10
Table 5 – Physical layer identifiers for CompoNet . 10
Table 6 – Data link layer identifiers . 10
Table 7 – Protocol specific usage of general data types . 11
Table 8 – Simple protocol specific common data types . 12

Table 9 – Structured protocol specific common data types . 14
Table 10 – Simple fieldbus configuration data types . 16
Table 11 – Structured fieldbus configuration data types . 18
Table 12 – Simple communication data types . 25
Table 13 – Structured communication data types . 25
Table 14 – Simple channel parameter data types . 27
Table 15 – Structured channel parameter data types . 28
Table 16 – Identification data types with protocol specific mapping . 30
Table 17 – Simple identification data types with protocol independent semantics . 30
Table 18 – Structured identification data types with protocol independent semantics . 30
Table 19 – Simple scan identification data types . 31
Table 20 – Structured scan identification data types . 31
Table 21 – Structured device type identification data types . 32
Table A.1 – CompoNet relationship between Device Category, Node Address, MAC ID . 34

– 4 – IEC 62453-302:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE TOOL (FDT) INTERFACE SPECIFICATION –

Part 302: Communication profile integration –
IEC 61784 CPF 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62453-302:2016. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62453-302 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2016. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) improved support for Ethernet IP (see 9.3, Clause 10, and 12.4).
Each part of the IEC 62453-3xy series is intended to be read in conjunction with IEC 62453-2.
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/1031/FDIS 65E/1032/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplemen
...

IEC 62453-302 ®
Edition 3.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –
Partie 302: Intégration des profils de communication – CPF 2 de l'IEC 61784
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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and French, with equivalent terms in 19 additional languages.
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IEC 62453-302 ®
Edition 3.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –

Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –

Partie 302: Intégration des profils de communication – CPF 2 de l'IEC 61784

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40, 35.100.05, 35.110 ISBN 978-2-8322-7780-5

– 2 – IEC 62453-302:2023 © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, symbols, abbreviated terms and conventions . 8
3.1 Terms and definitions . 8
3.2 Symbols and abbreviated terms . 8
3.3 Conventions . 9
3.3.1 Data type names and references to data types . 9
3.3.2 Vocabulary for requirements . 9
4 Bus category . 9
5 Access to instance and device data . 11
6 Protocol specific behavior . 11
7 Protocol specific usage of general data types . 11
8 Protocol specific common data types . 12
9 Network management data types . 16
9.1 General . 16
9.2 Node address . 16
9.3 Scanner/master – Bus parameter set (CIP) . 16
10 Communication data types. 24
11 Channel parameter data types . 27
12 Device identification . 29
12.1 Device type identification data types . 29
12.2 Topology scan data types . 30
12.3 Scan identification data types . 30
12.4 Device type identification data types . 31
Annex A (informative) Implementation hints . 33
A.1 Addressing in CompoNet DTMs . 33
A.2 Displaying addresses of CompoNet DTMs . 34
A.3 Handling of Config1 and Config2 elements in EtherNet/IP . 34
Bibliography . 35

Figure 1 – Part 302 of the IEC 62453 series . 6
Figure A.1 – Examples of DTM naming for CompoNet . 34

Table 1 – Protocol identifiers . 9
Table 2 – Physical layer identifiers for DeviceNet . 9
Table 3 – Physical layer identifiers for ControlNet . 9
Table 4 – Physical layer identifiers for Ethernet/IP . 10
Table 5 – Physical layer identifiers for CompoNet . 10
Table 6 – Data link layer identifiers . 10
Table 7 – Protocol specific usage of general data types . 11
Table 8 – Simple protocol specific common data types . 12

Table 9 – Structured protocol specific common data types . 14
Table 10 – Simple fieldbus configuration data types . 16
Table 11 – Structured fieldbus configuration data types . 18
Table 12 – Simple communication data types . 25
Table 13 – Structured communication data types . 25
Table 14 – Simple channel parameter data types . 27
Table 15 – Structured channel parameter data types . 28
Table 16 – Identification data types with protocol specific mapping . 30
Table 17 – Simple identification data types with protocol independent semantics . 30
Table 18 – Structured identification data types with protocol independent semantics . 30
Table 19 – Simple scan identification data types . 31
Table 20 – Structured scan identification data types . 31
Table 21 – Structured device type identification data types . 32
Table A.1 – CompoNet relationship between Device Category, Node Address, MAC ID . 33

– 4 – IEC 62453-302:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE TOOL (FDT) INTERFACE SPECIFICATION –

Part 302: Communication profile integration –
IEC 61784 CPF 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC
...