ISO/IEC 10373-3:2001

Identification cards — Test methods — Part 3: Integrated circuit(s) cards with contacts and related interface devices

Cartes d'identification — Méthodes d'essai — Partie 3: Cartes à circuit(s) intégré(s) à contacts et dispositifs d'interface assimilés

General Information

• Status: Withdrawn
• Publication Date: 07-Feb-2001
• Withdrawal Date: 07-Feb-2001
• ICS: 35.240.15 - Identification cards. Chip cards. Biometrics
• Technical Committee: ISO/IEC JTC 1/SC 17 - Cards and security devices for personal identification
• Drafting Committee: ISO/IEC JTC 1/SC 17/WG 4 - Generic interfaces and protocols for security devices
• Current Stage: 9599 - Withdrawal of International Standard
• Completion Date: 29-Sep-2010

Relations

• Revised: ISO/IEC 10373-3:2010 - Identification cards — Test methods — Part 3: Integrated circuit cards with contacts and related interface devices
• Effective Date: 15-Apr-2008
• Consolidated By: ISO 21809-5:2010 - Petroleum and natural gas industries — External coatings for buried or submerged pipelines used in pipeline transportation systems — Part 5: External concrete coatings
• Effective Date: 06-Jun-2022

Standards Content (Sample)

INTERNATIONAL ISO/IEC
STANDARD 10373-3
First edition
2001-02-15
Identification cards — Test methods —
Part 3:
Integrated circuit(s) cards with contacts
and related interface devices
Cartes d'identification — Méthodes d'essai —
Partie 3: Cartes à circuit(s) intégré(s) à contacts et dispositifs d'interface
assimilés
Reference number
ISO/IEC 10373-3:2001(E)
©
ISO/IEC 2001

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ISO/IEC 10373-3:2001(E)
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ii © ISO/IEC 2001 – All rights reserved

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ISO/IEC 10373-3:2001(E)
Contents
Foreword.vi
1 Scope.1
2 Normative references.1
3 Terms and definitions .2
4 General items applicable to the test methods .3
4.1 Test environment .3
4.2 Pre-conditioning.3
4.3 Default tolerance.3
4.4 Total measurement uncertainty.3
4.5 Conventions for electrical measurements .3
4.6 Apparatus .3
4.6.1 Default ICC-holder, reference axes and default measurement position.3
4.6.2 Apparatus for testing the integrated circuit(s) cards with contacts (ICC-test-apparatus).5
4.6.3 Apparatus for testing the interface device (IFD-test-apparatus).11
4.6.4 Test Scenario .17
4.7 Relationship of test methods versus base standard requirements.17
5 Test methods for physical characteristics of ICCs with contacts .21
5.1 Dimension and Location of Contacts.21
5.1.1 Apparatus .21
5.1.2 Procedure.21
5.1.3 Test report.22
5.2 Static electricity.22
5.2.1 Test Report.22
5.3 Electrical surface resistance of contacts.22
5.3.1 Apparatus .22
5.3.2 Procedure.23
5.3.3 Test report.23
5.3.4 Preliminary requirement .23
5.4 Surface profile of contacts .24
5.4.1 Apparatus .24
5.4.2 Procedure.24
5.4.3 Test report.25
6 Test methods for electrical characteristics of ICCs with contacts .25
6.1 VCC contact.25
6.1.1 Apparatus .25
6.1.2 Procedure.25
6.1.3 Test report.26
6.2 I/O contact .27
6.2.1 Apparatus .27
6.2.2 Procedure.27
6.2.3 Test report.29
6.3 CLK contact.29
6.3.1 Apparatus .29
6.3.2 Procedure.29
6.3.3 Test report.31
6.4 RST contact.31
6.4.1 Apparatus .31
6.4.2 Procedure.31
6.4.3 Test report.32
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ISO/IEC 10373-3:2001(E)
6.5 VPP contact.32
7 Test methods for logical operations of ICCs with contacts.33
7.1 Answer to Reset (ATR).33
7.1.1 Cold Reset and Answer-to-Reset (ATR).33
7.1.2 Warm Reset .33
7.1.3 Selection of the operation class A .34
7.2 T=0 Protocol .35
7.2.1 I/O transmission timing for T=0 protocol .35
7.2.2 I/O character repetition for T=0 protocol.36
7.2.3 I/O reception timing and error signaling for T=0 protocol.37
7.3 T=1 Protocol .38
7.3.1 I/O transmission timing for T=1 protocol .38
7.3.2 I/O reception timing for T=1 protocol.39
7.3.3 ICC Character Waiting Time (CWT) behavior.41
7.3.4 ICC-reaction to IFD exceeding character waiting time (CWT).41
7.3.5 Block Guardtime (BGT).42
7.3.6 Block sequencing by the ICC .43
7.3.7 Reactions of the ICC to protocol errors .45
7.3.8 Recovery of a transmission error by the ICC.46
7.3.9 Resynchronization.47
7.3.10 IFSD negotiation.48
7.3.11 Abortion by the IFD.49
8 Test methods for physical and electrical characteristics of the IFD.50
8.1 Activation of contacts.50
8.1.1 Apparatus .50
8.1.2 Procedure.50
8.1.3 Test report.51
8.2 VCC contact.51
8.2.1 Apparatus.51
8.2.2 Procedure.51
8.2.3 Test report.53
8.3 I/O contact .53
8.3.1 Apparatus.53
8.3.2 Procedure.53
8.3.3 Test report.55
8.4 CLK contact.55
8.4.1 Apparatus.56
8.4.2 Procedure.56
8.4.3 Test report.58
8.5 RST contact.58
8.5.1 Apparatus.58
8.5.2 Procedure.58
8.5.3 Test report.59
8.6 VPP contact.59
8.7 Deactivation of the contacts.59
8.7.1 Apparatus.60
8.7.2 Procedure.60
8.7.3 Test report.60
9 Test methods for logical operations of the IFD .60
9.1 Answer to Reset (ATR).60
9.1.1 ICC Reset (cold reset) .60
9.1.2 ICC Reset (warm reset) .61
9.2 T=0 Protocol .61
9.2.1 I/O transmission timing for T=0 protocol .61
9.2.2 I/O character repetition for T=0 protocol.62
9.2.3 I/O reception timing and error signaling for T=0 protocol.63
9.3 T=1 Protocol .65
9.3.1 I/O transmission timing for T=1 protocol .65
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ISO/IEC 10373-3:2001(E)
9.3.2 I/O reception timing for T=1 protocol .66
9.3.3 IFD Character Waiting Time (CWT) behavior .67
9.3.4 IFD-reaction to ICC exceeding CWT .68
9.3.5 Block Guardtime (BGT).68
9.3.6 Block sequencing by the IFD.69
9.3.7 Recovery of a transmission error by the IFD.73
9.3.8 IFSC negotiation.73
9.3.9 Abortion by the ICC.74
Annex A (informative) Additional Test Methods .76
A.1 ICC — Mechanical strength: 3 wheel test .76
A.1.1 Apparatus .76
A.1.2 Method.78
A.1.3 Test Report.79
A.2 IFD — Reaction of the IFD to invalid PCBs .79
A.2.1 Apparatus .79
A.2.2 Procedure.79
A.2.3 Test report.80
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ISO/IEC 10373-3:2001(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission)
form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC
participate in the development of International Standards through technical committees established by the
respective organization to deal with particular fields of technical activity. ISO and IEC technical committees
collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in
liaison with ISO and IEC, also take part in the work.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 3.
In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting.
Publication as an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this part of ISO/IEC 10373 may be the subject of
patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
International Standard ISO/IEC 10373-3 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information
technology, Subcommittee SC 17, Identification cards and related devices.
ISO/IEC 10373 consists of the following parts, under the general title Identification cards — Test methods:
 Part 1: General characteristics tests
 Part 2: Cards with magnetic stripes
 Part 3: Integrated circuit(s) cards with contacts and related interface devices
 Part 4: Contactless integrated circuit cards
 Part 5: Optical memory cards
 Part 6: Proximity cards
 Part 7: Vicinity cards
Annex A of this part of ISO/IEC 10373 is for information only.
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INTERNATIONAL STANDARD ISO/IEC 10373-3:2001(E)
Identification cards — Test methods —
Part 3:
Integrated circuit(s) cards with contacts and related interface
devices
1 Scope
This part of ISO/IEC 10373 defines test methods for characteristics of integrated circuit(s) cards with contacts and
related interface devices according to the definition given in ISO/IEC 7816. Each test method is cross-referenced to
one or more base standards, which may be ISO/IEC 7810 or one or more of the supplementary standards that
define the information storage technologies employed in identification card applications.
NOTE 1 Criteria for acceptability do not form part of this International Standard but will be found in the International
Standards mentioned above.
This part of ISO/IEC 10373 deals with test methods, which are specific to integrated circuit technology with
contacts. ISO/IEC 10373-1 deals with test methods which are common to one or more card technologies and other
parts deal with other technology-specific tests.
Test methods described in this part of ISO/IEC 10373 are intended to be performed separately and independently.
A given card is not required to pass through all the tests sequentially. The test methods described in this part of
ISO/IEC 10373 are based on specifications defined or to be defined in ISO/IEC 7816.
Conformance of ICCs and IFDs determined using the test methods defined in this part of ISO/IEC 10373 do not
preclude failures in the field. Reliability testing is outside the scope of this part of ISO/IEC 10373.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of
this part of ISO/IEC 10373. For dated references, subsequent amendments to, or revisions of, any of these
publications do not apply. However, parties to agreements based on this part of ISO/IEC 10373 are encouraged to
investigate the possibility of applying the most recent editions of the normative documents indicated below. For
undated references, the latest edition of the normative document referred to applies. Members of ISO and IEC
maintain registers of currently valid International Standards.
ISO/IEC 7810:1995, Identification cards — Physical characteristics.
ISO/IEC 7816-1:1998, Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical
characteristics.
ISO/IEC 7816-2:1999, Information technology — Identification cards — Integrated circuit(s) cards with contacts —
Part 2: Dimensions and location of the contacts.
ISO/IEC 7816-3:1997, Information technology — Identification cards — Integrated circuit(s) cards with contacts —
Part 3: Electronic signals and transmission protocols.
ISO/IEC 7816-4:1995, Information technology — Identification cards — Integrated circuit(s) cards with contacts —
Part 4: Interindustry commands for interchange.
ISO/IEC 10373-1:1998, Identification cards — Test methods — Part 1: General characteristics tests.
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ISO/IEC 10373-3:2001(E)
United States of America, Department of Defense, Test Method Standard, Microcircuits, MIL-STD-883, Version E,
31 December 1996, Method 3015.7 ‘Electrostatic discharge sensitivity classification’.
3 Terms and definitions
For the purposes of this part of ISO/IEC 10373, the following terms and definitions apply.
3.1
test method
method for testing characteristics of identification cards and related interface devices for the purpose of confirming
their compliance with International Standards
3.2
testably functional
has survived the action of some potentially destructive influence to the extent that:
a) any magnetic stripe present on the card shows a relationship between signal amplitudes before and after
exposure that is in accordance with the base standard;
1
b) any integrated circuit(s) present in the card continues to show an Answer to Reset response which conforms
to the base standard;
c) any contacts associated with any integrated circuit(s) present in the card continue to show electrical resistance
which conforms to the base standard;
d) any optical memory present in the card continue to show optical characteristics which conform to the base
standard
3.3
normal use
use as an Identification card (see clause 4 of ISO/IEC 7810:1995), involving equipment processes appropriate to
the card technology and storage as a personal document between equipment processes
3.4
ICC
integrated circuit(s) card with contacts as defined in the ISO/IEC 7816 series of standards
3.5
IFD
interface device related to integrated circuit(s) cards with contacts as defined in the ISO/IEC 7816 series of
standards
3.6
DUT
device under test; within the scope of this document the ICC or the IFD subject to testing

1
This part of ISO/IEC 10373 does not define any test to establish the complete functioning of integrated circuit(s) cards. The
test methods require only that the minimum functionality (testably functional) be verified. This may, in appropriate
circumstances, be supplemented by further, application specific functionality criteria which are not available in the general case.
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ISO/IEC 10373-3:2001(E)
3.7
typical protocol and application specific communication
any communication between a DUT and the corresponding test-apparatus based on protocol and application
implemented in the DUT and representing its normal use
3.8
Test Scenario
a defined typical protocol and application specific communication to be used with the test methods defined in this
document
4 General items applicable to the test methods
4.1 Test environment
Unless otherwise specified, testing of physical, electrical and logical characteristics shall take place in an
environment of temperature 23 °C ± 3 °C, of relative humidity 40 % to 60 %.
4.2 Pre-conditioning
Where pre-conditioning is required by the test method, the identification cards to be tested shall be conditioned to
the test environment for a period of 24 h before testing unless otherwise specified.
4.3 Default tolerance
Unless otherwise specified, a default tolerance of ± 5 % shall be applied to the quantity values given to specify the
characteristics of the test equipment (e.g. linear dimensions) and the test method procedures (e.g. test equipment
adjustments).
4.4 Total measurement uncertainty
The total measurement uncertainty for each quantity determined by these test methods shall be stated in the test
report.
4.5 Conventions for electrical measurements
Potential differences ar
...