ISO/IEC 10373-3:2010
(Main)Identification cards — Test methods — Part 3: Integrated circuit cards with contacts and related interface devices
Identification cards — Test methods — Part 3: Integrated circuit cards with contacts and related interface devices
ISO/IEC 10373-3:2010 defines test methods for characteristics of integrated circuit cards with contacts and related interface devices according to the definition given in ISO/IEC 7816. Each test method is cross‑referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the supplementary International Standards that define the information storage technologies employed in identification card applications. ISO/IEC 10373-3:2010 defines test methods which are specific to integrated circuit technology with contacts. ISO/IEC 10373-1 defines test methods which are common to one or more card technologies and other parts define other technology‑specific tests. Test methods defined in ISO/IEC 10373-3:2010 are intended to be performed separately and independently. A given card is not required to pass through all the tests sequentially. The test methods defined in ISO/IEC 10373-3:2010 are based on ISO/IEC 7816-3. Conformance of cards and IFDs determined using the test methods defined in ISO/IEC 10373-3:2010 does not preclude failures in the field. Reliability testing is outside the scope of ISO/IEC 10373-3:2010. ISO/IEC 10373-3:2010 does not define any test to establish the complete functioning of integrated circuit cards. The test methods require only that the minimum functionality be verified. Minimum functionality is defined as follows. Any integrated circuit present in the card continues to show an Answer to Reset response which conforms to the base standard. Any contacts associated with any integrated circuit present in the card continue to show electrical resistance which conforms to the base standard.
Cartes d'identification — Méthodes d'essai — Partie 3: Cartes à circuit(s) intégré(s) à contacts et dispositifs d'interface assimilés
General Information
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Standards Content (Sample)
INTERNATIONAL ISO/IEC
STANDARD 10373-3
Second edition
2010-10-01
Identification cards — Test methods —
Part 3:
Integrated circuit cards with contacts and
related interface devices
Cartes d'identification — Méthodes d'essai —
Partie 3: Cartes à circuit(s) intégré(s) à contacts et dispositifs d'interface
assimilés
Reference number
ISO/IEC 10373-3:2010(E)
©
ISO/IEC 2010
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ISO/IEC 10373-3:2010(E)
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ii © ISO/IEC 2010 – All rights reserved
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ISO/IEC 10373-3:2010(E)
Contents Page
Foreword .v
1 Scope.1
2 Normative references.1
3 Terms and definitions .2
4 General items applicable to the test methods.2
4.1 Test environment.2
4.2 Pre-conditioning .2
4.3 Selection of test methods.3
4.4 Default tolerance .3
4.5 Total measurement uncertainty .3
4.6 Conventions for electrical measurements.3
4.7 Apparatus.3
4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus) .3
4.7.2 Apparatus for testing the interface device (IFD-test-apparatus).8
4.7.3 Test Scenario .13
4.8 Relationship of test methods versus base standard requirements.13
5 Test methods for electrical characteristics of cards with contacts.16
5.1 VCC contact .16
5.1.1 Apparatus.16
5.1.2 Procedure.16
5.1.3 Test report.17
5.2 I/O contact .17
5.2.1 Apparatus.17
5.2.2 Procedure.17
5.2.3 Test report.19
5.3 CLK contact .19
5.3.1 Apparatus.19
5.3.2 Procedure.19
5.3.3 Test report.20
5.4 RST contact.20
5.4.1 Apparatus.20
5.4.2 Procedure.20
5.4.3 Test report.21
5.5 SPU (C6) contact .21
6 Test methods for logical operations of cards with contacts .21
6.1 Answer to Reset (ATR).21
6.1.1 Cold Reset and Answer-to-Reset (ATR).21
6.1.2 Warm Reset.22
6.2 T=0 Protocol.22
6.2.1 I/O transmission timing for T=0 protocol.22
6.2.2 I/O character repetition for T=0 protocol .23
6.2.3 I/O reception timing and error signaling for T=0 protocol .24
6.3 T=1 Protocol.25
6.3.1 I/O transmission timing for T=1 protocol.25
6.3.2 I/O reception timing for T=1 protocol .25
6.3.3 Character Waiting Time (CWT) behavior.26
6.3.4 card-reaction to IFD exceeding character waiting time (CWT).27
6.3.5 Block Guard time (BGT).27
6.3.6 Block sequencing by the card .28
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ISO/IEC 10373-3:2010(E)
6.3.7 Reaction of the card to protocol errors.31
6.3.8 Recovery of a transmission error by the card .31
6.3.9 Resynchronization.32
6.3.10 IFSD negotiation .33
6.3.11 Abortion by the IFD.34
7 Test methods for physical and electrical characteristics of the IFD.35
7.1 Activation of contacts .35
7.1.1 Apparatus .35
7.1.2 Procedure .35
7.1.3 Test report .35
7.2 VCC contact.36
7.2.1 Apparatus .36
7.2.2 Procedure .36
7.2.3 Test report .37
7.3 I/O contact .37
7.3.1 Apparatus .37
7.3.2 Procedure .37
7.3.3 Test report .39
7.4 CLK contact.39
7.4.1 Apparatus .39
7.4.2 Procedure .39
7.4.3 Test report .41
7.5 RST contact.41
7.5.1 Apparatus .41
7.5.2 Procedure .41
7.5.3 Test report .42
7.6 SPU (C6) contact.42
7.7 Deactivation of the contacts.42
7.7.1 Apparatus .42
7.7.2 Procedure .42
7.7.3 Test report .43
8 Test methods for logical operations of the IFD .43
8.1 Answer to Reset (ATR).43
8.1.1 Card Reset (cold reset) .43
8.1.2 card Reset (warm reset) .43
8.2 T=0 Protocol .44
8.2.1 I/O transmission timing for T=0 protocol .44
8.2.2 I/O character repetition for T=0 protocol.44
8.2.3 I/O reception timing and error signaling for T=0 protocol.45
8.3 T=1 Protocol .46
8.3.1 I/O transmission timing for T=1 protocol .46
8.3.2 I/O reception timing for T=1 protocol .47
8.3.3 IFD Character Waiting Time (CWT) behavior .48
8.3.4 IFD-reaction to card exceeding CWT.49
8.3.5 Block Guard time (BGT) .49
8.3.6 Block sequencing by the IFD.50
8.3.7 Recovery of a transmission error by the IFD.52
8.3.8 IFSC negotiation .53
8.3.9 Abortion by the card.53
8.4 IFD — Reaction of the IFD to invalid PCBs .54
8.4.1 Apparatus .54
8.4.2 Procedure .54
8.4.3 Test report .55
iv © ISO/IEC 2010 – All rights reserved
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ISO/IEC 10373-3:2010(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are members of
ISO or IEC participate in the development of International Standards through technical committees
established by the respective organization to deal with particular fields of technical activity. ISO and IEC
technical committees collaborate in fields of mutual interest. Other international organizations, governmental
and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information
technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of the joint technical committee is to prepare International Standards. Draft International
Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as
an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
ISO/IEC 10373-3 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology,
Subcommittee SC 17, Cards and personal identification.
This second edition cancels and replaces the first edition (ISO/IEC 10373-3:2001), which has been technically
revised.
ISO/IEC 10373 consists of the following parts, under the general title Identification cards — Test methods:
⎯ Part 1: General characteristics
⎯ Part 2: Cards with magnetic stripes
⎯ Part 3: Integrated circuit cards with contacts and related interface devices
⎯ Part 5: Optical memory cards
⎯ Part 6: Proximity cards
⎯ Part 7: Vicinity cards
⎯ Part 8: USB-ICC
The following part is under preparation:
⎯ Part 9: Optical memory cards: Holographic recording method
© ISO/IEC 2010 – All rights reserved v
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INTERNATIONAL STANDARD ISO/IEC 10373-3:2010(E)
Identification cards — Test methods —
Part 3:
Integrated circuit cards with contacts and related interface
devices
1 Scope
This part of ISO/IEC 10373 defines test methods for characteristics of integrated circuit cards with contacts
and related interface devices according to the definition given in ISO/IEC 7816. Each test method is
cross-referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the
supplementary International Standards that define the information storage technologies employed in
identification card applications.
NOTE Criteria for acceptability do not form part of this part of ISO/IEC 10373 but will be found in the International
Standards mentioned above.
This part of ISO/IEC 10373 defines test methods which are specific to integrated circuit technology with
contacts. ISO/IEC 10373-1 defines test methods which are common to one or more card technologies and
other parts define other technology-specific tests.
Test methods defined in this part of ISO/IEC 10373 are intended to be performed separately and
independently. A given card is not required to pass through all the tests sequentially. The test methods
defined in this part of ISO/IEC 10373 are based on ISO/IEC 7816-3.
Conformance of cards and IFDs determined using the test methods defined in this part of ISO/IEC 10373
does not preclude failures in the field. Reliability testing is outside the scope of this part of ISO/IEC 10373.
This part of ISO/IEC 10373 does not define any test to establish the complete functioning of integrated circuit
cards. The test methods require only that the minimum functionality be verified. Minimum functionality is
defined as follows.
⎯ Any integrated circuit present in the card continues to show an Answer to Reset response which
conforms to the base standard.
⎯ Any contacts associated with any integrated circuit present in the card continue to show electrical
resistance which conforms to the base standard.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO/IEC 7810:2003, Identification cards — Physical characteristics
ISO/IEC 7816-3:2006, Identification cards — Integrated circuit cards — Part 3: Cards with contacts —
Electrical interface and transmission protocols
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ISO/IEC 10373-3:2010(E)
ISO/IEC 7816-4:2005, Identification cards — Integrated circuit cards — Part 4: Organization, security and
commands for interchange
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
card
integrated circuit card with contacts as defined in ISO/IEC 7816
3.2
DUT
device under test
card or IFD that is subject to testing
3.3
etu-factor
parameters negotiable by protocol and parameters selection (PPS), described in ISO/IEC 7816-3:2006, 6.3.1
3.4
IFD
interface device related to integrated circuit cards with contacts as defined in ISO/IEC 7816-3
3.5
normal use
use as an identification card, as defined in ISO/IEC 7810:2003, 4.1, involving equipment processes
appropriate to the card technology and storage as a personal document between equipment processes
3.6
test method
method for testing characteristics of identification cards and related interface devices for the purpose of
confirming their compliance with International Standards
3.7
test scenario
defined typical protocol and application specific communication to be used with the test methods defined in
this part of ISO/IEC 10373
3.8
typical protocol and application specific communication
communication between a DUT and the corresponding test-apparatus based on protocol and application
implemented in the DUT and representing its normal use
4 General items applicable to the test methods
4.1 Test environment
Unless otherwise specified, testing of physical, electrical and logical characteristics shall take place in an
environment of temperature 23 °C ± 3 °C, of relative humidity 40 % to 60 %.
4.2 Pre-conditioning
Where pre-conditioning is required by the test method, the identification cards to be tested shall be
conditioned to the test environment for a period of 24 h before testing unless otherwise specified.
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ISO/IEC 10373-3:2010(E)
4.3 Selection of test methods
Tests shall be applied as required to test the attributes of the card defined by the relevant base standard
(see 4.8).
4.4 Default tolerance
Unless otherwise specified, a default tolerance of ± 5 % shall be applied to the quantity values given to specify
the characteristics of the test equipment (e.g. linear dimensions) and the test method procedures (e.g. test
equipment adjustments).
4.5 Total measurement uncertainty
The total measurement uncertainty for each quantity determined by these test methods shall be stated in the
test report.
4.6 Conventions for electrical measurements
Potential differences are defined with respect to the GND contact of the card and currents flowing to the card
are considered positive.
4.7 Apparatus
4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus)
4.7.1.1 Generating the VCC voltage (U ) and timing
CC
Table 1 — voltage and timing for VCC
Parameter Operating Condition Range Accuracy
U Class A, B, C -1 V to 6 V
± 20 mV
CC
t , t
Class A, B, C 0 µs to 500 µs ± 100 µs
R F
4.7.1.2 Measuring ICC
Table 2 — I parameters
CC
Characteristic Mode Range Accuracy Resolution
Spike Measurement 0 mA to 200 mA ± 2 mA 20 ns
I
Active mode 0 mA to 100 mA ± 1 mA Averaged over 1 ms
CC
Clock stop 0 µA to 200 µA ± 10 µA Averaged over 1 ms
4.7.1.3 Generating SPU (C6) voltage
See 5.5 and ISO/IEC 7816-3.
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ISO/IEC 10373-3:2010(E)
4.7.1.4 Generating the RST voltage and timing
Table 3 — RST voltage and timing
Parameter Operating Condition Range Accuracy
U U Class A, B -1 V to 6 V
± 20 mV
IH, IL
U Class C -1 V to 2 V ± 20 mV
IH
U Class C -1 V to 1 V ± 20 mV
IL
t , t
0 µs to 2 µs ± 20 ns
R F
NOTE t and t are generated between 10% and 90% of V min and V max values.
R F H L
4.7.1.5 Measuring the RST current
Table 4 — RST current
Characteristic Mode Range Accuracy Resolution
I Active -30 µA to 200 µA 100 ns
± 10 µA
IH
I Active -200 µA to 30 µA ± 10 µA 100 ns
IL
4.7.1.6 Generating the I/O voltage and timing in reception mode
Table 5 — I/O voltage and timing
Parameter Mode Operating Condition Range Accuracy
Card: Reception,
U U Apparatus: Class A, B -1 V to 6 V
± 20 mV
IH, IL
Transmission
Card: Reception,
U Apparatus: Class C -1 V to 2 V ± 20 mV
IH
Transmission
Card: Reception,
U Apparatus: Class C -1 V to 1 V
± 20 mV
IL
Transmission
Card: Reception,
t , t Apparatus: 0 µs to 2 µs ± 100 ns
R F
Transmission
NOTE ─ t and t are generated between 10% and 90% of V min and V max values.
R F H L
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ISO/IEC 10373-3:2010(E)
4.7.1.7 Measuring the I/O current in reception mode
Table 6 — I/O current (reception mode)
Parameter Mode Range Accuracy Resolution
Card: Reception,
I Apparatus: -300 µA to 30 µA ± 10 µA 100 ns
IH
Transmission
Card: Reception,
Apparatus: -1,5 mA to -0,2 mA 100 ns
± 50 µA
Transmission
I
IL
Card: Reception,
Apparatus: -200 µA to 30 µA ± 10 µA 100 ns
Transmission
4.7.1.8 Generating the I/O current
Table 7 — I/O current
Stabilization time
Parameter Mode Range Accuracy after level is
reached
20 kΩ pull-up to
Card: Transmission
I
VCC or equivalent ± 200 Ω
OH
Apparatus: Reception
circuit
Card: Transmission
I 0 mA to 1,5 mA ± 50 µA < 100 ns
OL
Apparatus: Reception
4.7.1.9 Measuring the I/O voltage and timing
Table 8 — I/O voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U U Class A, B, C -1 V to 6 V ± 20 mV 20 ns
IH, IL
t , t 0 µs to 2 µs ± 20 ns
R F
NOTE ─ t and t are measured between 10% and 90% of V min and V max values.
R F H L
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ISO/IEC 10373-3:2010(E)
4.7.1.10 Generating the CLK voltage
Table 9 — CLK voltage
Parameter Operating Condition Range Accuracy Resolution
U U Class A, B -1 V to 6 V 20 ns
± 20 mV
IH, IL
U Class C -1 V to 2 V 20 ns
± 20 mV
IH
U Class C -1 V to 2 V ± 20 mV 20 ns
IL
4.7.1.11 Generating the CLK waveforms (single cycle measurement)
Table 10 — CLK waveforms
Parameter Range Accuracy
Duty cycle 35 % to 65 % of period
± 5 ns
Frequency 0,5 MHz to 5,5 MHz ± 5 kHz
Frequency 5 MHz to 20,5 MHz ± 50 kHz
t , t 1 % to 10 % of period
± 5 ns
R F
NOTE ─ t and t are generated between 10% and 90% of V (100%) min and V (0%) max.
R F H L
4.7.1.12 Measuring the CLK current
Table 11 — CLK current
Characteristic Mode Range Accuracy Resolution
I active -30 µA to 150 µA ± 10 µA 20 ns
IH
I active -150 µA to 30 µA 20 ns
± 10 µA
IL
4.7.1.13 Measuring the contact capacitance of RST, CLK and I/O
Table 12 — Contact capacitance
Characteristic Range Accuracy
C 0 pF to 50 pF ± 5 pF
The contact capacitance of a contact shall be measured between the
contact and the GND contact.
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ISO/IEC 10373-3:2010(E)
4.7.1.14 Generating the sequence of the activation and deactivation of the contacts
Table 13 — Activation and deactivation
Range of switching the
Accuracy
signals
0 s to 1 s
± 200 ns (or 1 CLK period, whichever is smaller)
4.7.1.15 Emulating the I/O protocol
The card-t
...
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