ASTM F68-99(2004)
(Specification)Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices
Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices
SCOPE
1.1 This specification establishes the requirements for wrought and fabricated shapes made from Copper UNS No. C10100, conforming to the chemical requirements of Specification B 170, Grade 1, and suitable for use in electron devices.
1.2 The requirements of this specification are in addition to those prescribed in the following product specifications appropriate to the material being ordered: B 1, B 2, B 75, B 75M, B 152/B 152M, B 170, B 187/B 187M, B 272, and B 372. In case of conflict, however, this specification shall take precedence.
1.3 The inch-pound units are the standard for this specification except for grain sizes which are in metric units. Metric values given in parentheses are for information only.
1.4 The following safety hazard caveat applies to sections 17.4, 17.5 and 18.7 of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: F 68 – 99 (Reapproved 2004)
Standard Specification for
Oxygen-Free Copper in Wrought Forms for Electron
Devices
This standard is issued under the fixed designation F 68; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope* B 75M Specification for Seamless Copper Tube (Metric)
B 152/B 152M Specification for Copper Sheet, Strip, Plate
1.1 This specification establishes the requirements for
and Rolled Bar
wrought and fabricated shapes made from Copper UNS No.
B 170 Specification for Oxygen-Free Electrolytic Copper—
C10100, conforming to the chemical requirements of Specifi-
Refinery Shapes
cation B 170, Grade 1, and suitable for use in electron devices.
B 187/B 187M Specification for Copper Bar, Bus Bar, Rod
1.2 The requirements of this specification are in addition to
and Shapes
those prescribed in the following product specifications appro-
B 188 Specification for Seamless Copper Bus Pipe and
priate to the material being ordered: B 1, B 2, B 75, B 75M,
Tube
B 152/B 152M, B 170, B 187/B 187M, B 272, and B 372. In
B 193 Test Method for Resistivity of Electrical Conductor
case of conflict, however, this specification shall take prece-
Materials
dence.
B 248 Specification for General Requirements for Wrought
1.3 The inch-pound units are the standard for this specifi-
Copper and Copper-Alloy Plate, Sheet, Strip and Rolled
cation except for grain sizes which are in metric units. Metric
Bar
values given in parentheses are for information only.
B 248M Specification for General Requirements for
1.4 The following safety hazard caveat applies to sections
Wrought Copper and Copper-Alloy Plate, Sheet, Strip and
17.4,17.5and18.7ofthisspecification: This standard does not
Rolled Bar [Metric]
purport to address all of the safety concerns, if any, associated
B 249/B 249M Specification for General Requirements for
with its use. It is the responsibility of the user of this standard
Wrought Copper and Copper-Alloy Rod, Bar, Shapes, and
to establish appropriate safety and health practices and
Forgings
determine the applicability of regulatory limitations prior to
B 250/B 250M Specification for General Requirements for
use.
Wrought Copper-Alloy Wire
2. Referenced Documents B 272 Specification for Copper Flat Products with Finished
(Rolled or Drawn) Edges (Flat Wire and Strip)
2.1 The following documents in the current issue of the
B 372 Specification for Seamless Copper and Copper-Alloy
BookofStandardsformapartofthisspecificationtotheextent
Rectangular Waveguide Tube
referenced herein:
B 577 Test Methods for Detection of Cuprous Oxide Hy-
2.2 ASTM Standards:
drogen Embrittlement Susceptibility in Copper
B 1 Specification for Hard-Drawn Copper Wire
E 29 Practice for Using Significant Digits in Test Data to
B 2 Specification for Medium-Hard-Drawn Copper Wire
Determine Conformance with Specifications
B 3 Specification for Soft or Annealed Copper Wire
E 112 Test Methods for Determining Average Grain Sizes
B 75 Specification for Seamless Copper Tube
E 527 Practice for Numbering Metals and Alloys (UNS)
2.3 ASTM Adjunct:
Comparison Chart
ThisspecificationisunderthejurisdictionofASTMCommitteeB05onCopper
and CopperAlloys and is the direct responsibility of Subcommittee B05.02 on Rod,
3. Terminology
Bar, Wire, Shapes, and Forgings.
Current edition approved May 1, 2004. Published June 2004. Originally
3.1 For definitions of terms related to this product, refer to
approved in 1966. Last previous edition approved in 1999 as F 68 – 99.
the terminology sections of Specifications B 248, B 249/
The UNS System for copper and copper alloys (see Practice E 527) is a simple
expansion of the former standard designation system accomplished by the addition
B 249M, B 250/B 250M, or B 251.
of a prefix “C” and a suffix “00”. The suffix can be used to accommodate
3.2 Definition of Terms Specific to This Standard:
composition variations of the base alloy.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on Available from ASTM International Headquarters. Order Adjunct No.
the ASTM website. ADJF0068.
*A Summary of Changes section appears at the end of this standard.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 68 – 99 (2004)
3.2.1 extrusion pipe, n—a lamination resulting from the 8. Physical Properties
flow of the oxide surface of a billet into the article being
8.1 Electrical Resistivity:
extruded and usually confined to the trailing-end portion of the
8.1.1 The maximum mass resistivity shall be 0.15176 ohms
extruded product.
g/m (conductivity 101.0 % minimum, InternationalAnnealed
3.2.2 oxygen-free, adj—electrolytic copper produced sub-
Copper Standard {IACS} at 20°C when tested in the annealed
stantiallyfreeofcuprousoxideandcontainingnomorethan10
condition.
ppm oxygen, as determined by metallographic examination at
8.2 Scaling:
753 under polarized light, and manufactured without the use
8.2.1 The test specimens of oxygen-free copper shall show
of metallic or metalloidal deoxidizers.
substantial surface oxide adherence when subjected to test as
3.2.3 oxygen-free, grade 1, adj—as defined in 3.2.2 except
described in 15.3.
that the oxygen content must be 5 ppm maximum. This copper
NOTE 1—The purpose of this test is to distinguish between oxygen free
is also commonly termed “oxygen-free electronic.”
and deoxidized copper. Deoxidized copper will not retain the surface
3.2.4 rms, n—root-mean-square, a statistical measure of
oxide in this test.
surface roughness usually determined by means of a profilo-
meter.
9. Mechanical Properties
9.1 All products shall conform to the mechanical property
4. Ordering Information
requirements of the basic product specification to which the
4.1 Orders for the product shall include the following
item was ordered, with the following exception:
information:
9.1.1 Sheetandstripwithathicknessof0.125in.orlessand
4.1.1 The designation and year of issue of both Specifica-
intended for gaskets or for deep drawing shall conform to the
tion F 68 and the basic product specification involved,
requirements prescribed in Table 1.
4.1.2 Shape of product,
4.1.3 Size,
10. Hydrogen Embrittlement (Reverse Bend Test
4.1.4 Total estimated weight or number of pieces, or both,
Method)
for each size and shape,
10.1 Specimens shall withstand a minimum of ten reverse
4.1.5 The Specification F 68 Class of material,
bends without breaking. Evidence of blisters, upon visual
4.1.6 Intended application (for example, wave guide),
examination, shall be cause for rejection.
4.1.7 Temper,
4.1.8 Heat identification or traceability details,
NOTE 2—Fractured areas of the bent samples should show some
reduction in area and have a distorted, smeared surface. The ideal break
4.1.9 Certification,
will have the appearance of a cup and cone tensile failure.
4.2 The following options are available:
4.2.1 Mill test report,
11. General Examination
4.2.2 Special packaging,
11.1 When examined the samples shall have:
4.2.3 Special marking.
11.1.1 A relatively uniform surface free of irregular rough
5. Materials and Manufacture spots sometimes termed open grains,
11.1.2 Edges free of seams, laps and cracks,
5.1 Material:
11.1.3 Cross sections free of breaks, inclusions or extrusion
5.1.1 The material shall be oxygen-free electronic copper
pipe.
which conforms to the requirements of Specification B 170,
Grade 1.
12. Special Examinations
5.2 Manufacture:
12.1 Special Macro Examination:
5.2.1 The manufacturing process shall conform to the re-
quirements of this specification and to the basic product 12.1.1 The samples shall show no subsurface defects in
excess of the following limits:
specification to which the product was ordered.
12.1.1.1 Tubular Products:
6. Chemical Composition
(a) Tubes for Exhaust (Pinch-off) Purposes:
(a.1) For wall thickness over 0.1 in. (2.5 mm), no defects on
6.1 The cast refinery shape shall conform to the require-
ments specified in Specification B 170, Grade 1, Table 1. the external surface deeper than 0.005 in. (0.13 mm).
(a.2) For wall thicknesses up to 0.1 (2.5 mm) inclusive, no
6.1.1 Copper shall be taken as the difference between the
sum of results for Grade 1 specified elements and 100 %. defects on the external surface deeper than 5 % of the wall
thickness.
6.2 These composition limits do not preclude the possible
presence of other unnamed elements. Limits may be estab-
lished and analysis required for unnamed elements by agree-
TABLE 1 Grain Size
ment between the manufacturer and the purchaser.
Average Grain
Hardness
Thickness Size,
7. Temper A
HRF max
max, mm
7.1 The temper of the wrought or fabricated product sup-
Less than 0.040 in. (1.0 mm) 0.035 75
0.040 to 0.125 in. (1.0 to 3.2 mm) 0.050 75
plied shall conform to the requirements of the basic product
A
specification to which it was ordered. For information only.
F 68 – 99 (2004)
(a.3) No significant defects on the inside surface when 13. Dimensions, Mass and Permissible Variations
examined with fiber optics or a boroscope.
13.1 The dimensional tolerances for the product described
(b) Waveguides—No defects on the external surface deeper
by this specification shall be as prescribed in the basic product
than 0.005 in. (0.13 mm) or 5 % of the wall thickness,
specification to which it was ordered.
whichever is smaller. No significant defects on the inside
surface when examined with fiber optics or a boroscope.
14. Workmanship, Finish and Appearance
(c) Tube for Other Applications—No defects on either the
14.1 The product shall be prepared and handled in such a
internal or external surfaces deeper than 0.020 in. (0.51 mm) or
manner as to be substantially free from surface oxide and the
5 % of the wall thickness, whichever is the smaller.
presence of foreign material such as metal chips, dirt and
12.1.1.2 Bar and Plate Products—No defects deeper than
grease.
0.06 in. (1.6 mm) or 5 % of the thickness, whichever is the
smaller.
15. Sampling
12.1.1.3 Sheet, Strip and Flat Wire Products—No defects
15.1 The sampling practice shall be as prescribed in the
deeper than 0.005 in. (0.13 mm) or 5 % of the thickness,
basic product specification to which it was ordered.
whichever is smaller.
15.1.1 The number of sample pieces to be selected, how-
12.1.1.4 Rod and Wire Products:
ever, shall be twice the number prescribed in the basic product
(a) Rod and Wire less than 0.19 in. (4.8 mm) in Diameter:
specification.
(a.1) No defects deeper than 0.005 in. (0.13 mm) or 5 % of
the diameter, whichever is smaller.
16. Number of Tests and Retests
(b) Rod and Wire 0.19 in. (4.8 mm) and Over in Diameter:
16.1 Tests:
(b.1) No defects deeper than 0.06 in. (1.6 mm) or 5 % of the
16.1.1 The number of samples submitted to all tests shall be
diameter, whichever is smaller.
twice that required by the basic product specification to which
12.2 Special Microscopical Examination:
the product was ordered.
12.2.1 Samples shall be classified by comparison to Plate 1,
16.2 Retests:
which is available from ASTM International Headquarters as
16.2.1 Retests are permitted as stated in the basic product
an adjunct (see 2.3).
specification to which the product was ordered for tests
12.2.1.1 Product whose samples have an appearance in
associated with the basic product specification.
conforming to either Class 1 or Class 2 shall be considered
16.2.2 Retests shall be permitted for tests and examinations
acceptable.
required by this specification.
12.2.1.2 Subsurface microporosity similar to those typical
16.2.3 Products which fail in retest shall be rejected.
of Class 3, 4 or 5 as illustrated in Plate 1, are permissible in
Class 1 and 2 material provided the microporosity does not
17. Specimen Preparation
appear below the metal surface at depths exceeding the
17.1 Chemical Composition:
following:
17.1.1 Analytical sample preparation shall be as directed in
(a) Tubular Products:
the basic product specification to which the product was
(a.1) Tubes for Exhaust Purposes and Waveguides—No
ordered.
indications at any depth below the surface.
17.2 Electrical Resistivity:
(a.2) Tubes for Other Applications—Microporosity permis-
17.2.1 Specimenpreparationshallbeasdirectedinthebasic
sible to depths of 0.020 in. (0.51 mm) or 5 % of the tube wall,
product specification to which the product was ordered.
whichever is smaller.
17.3 Grain Size:
(b) Bar and Plate—Microporosity permissible to depths of
17.3.1 Specimenpreparationshallbeasdirectedinthebasic
0.06in.(1.5mm)or5 %ofthethickness,whicheverissmaller.
product specification to which the product was ordered.
(c) Sheet, Strip and Flat Wire—Microporosity permissible
17.4 General and Special Macro Examination:
to depths of 0.010 in. (0.25 mm) or 5 % of the thickness,
17.4.1 Transverse sections of the samples shall be machined
whichever is smaller.
to a 63 rms or smoother surface finish and degreased.
(d) Rod and Wire Products:
17.4.1.1 In a properly ventilated fume hood, etch the
(d.1) Rod and Wire less than 0.19 in. (4.8 mm) in
samples for 3 to 5 min by lowering the samples into a freshly
Diameter—Microporosity permissible to depths of 0.010 in.
prepared etching solution and slowly agitate.
(0.25 mm) or 5 % of the diameter or thickness, whichever is
17.4.1.2 Prepare the etching solution by mixing equal parts
smaller.
ofconcentratedreagentgradenitricacid(HNO )anddeionized
(d.2) Rod and Wire 0.19 in. (4.8 mm) and Over in
or distilled water. Add 5 grams of copper for each liter of the
Diameter—Microporosity permissible to depths of 0.06 in. 50 % acid solution and cool the solution to ambient tempera-
(1.5 mm) or 5 % of the diameter or thickness, whichever is the
ture prior to use. The solution shall be kept free of dirt and
smaller. maintained at 75 6 5°F (24 6 3°C) during use.
12.2.1.3 Product whose samples have an appearance corre- (Warning—Do not pour the water into the acid.)
sponding to Class 3, 4 or 5 and not in conformance with 17.4.1.3 Remove the samples periodically from the etching
12.2.1.2, shall be acceptable only by agreement between the solutionandvisuallyexaminetodeterminewhethersufficiently
manufacturer or supplier and the purchaser. etched. Should the samples tend to stain, add 25 mL of
F 68 – 99 (2004)
concentrated reagent grade hydrochloric acid (HCl) to each 17.6.4.2 For products with a thickness greate
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