EN 60917-1:1998
(Main)Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering applications.
Modulordnung für die Entwicklung von Bauweisen für elektronische Einrichtungen - Teil 1: Fachgrundnorm
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 1: Norme générique
Donne les définitions d'un ordre modulaire pour les structures mécaniques, pour les infrastructures électroniques et prévoit la compatibilité dimensionnelle des interfaces mécaniques avec les applications industrielles voisines.
Mechanical structures for electronic equipment - Part 1: Generic standard (IEC 60917-1:1998)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2002
Mechanical structures for electronic equipment - Part 1: Generic standard (IEC
60917-1:1998)
Modular order for the development of mechanical structures for electronic equipment
practices -- Part 1: Generic standard
Modulordnung für die Entwicklung von Bauweisen für elektronische Einrichtungen -- Teil
1: Fachgrundnorm
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électroniques -- Partie 1: Norme générique
Ta slovenski standard je istoveten z: EN 60917-1:1998
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
NORME
CEI
INTERNATIONALE
IEC
60917-1
INTERNATIONAL
Première édition
STANDARD
First edition
1998-09
Ordre modulaire pour le développement
des structures mécaniques
pour les infrastructures électroniques –
Partie 1:
Norme générique
Modular order for the development
of mechanical structures for electronic
equipment practices –
Part 1:
Generic standard
IEC 1998 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée sous quelque forme que ce soit et par aucun any form or by any means, electronic or mechanical,
procédé, électronique ou mécanique, y compris la photo- including photocopying and microfilm, without permission in
copie et les microfilms, sans l'accord écrit de l'éditeur. writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http: //www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
PRICE CODE R
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue
60917-1 © IEC:1998 – 3 –
CONTENTS
Page
FOREWORD . 5
INTRODUCTION . 7
Clause
1 Scope and object . 9
2 Normative references.9
3 Terms, terminology and definitions . 11
4 Fundamentals and background information. 27
4.1 Structures of electronic equipment practices. 27
4.2 Dimensional co-ordination with adjacent technical fields . 27
4.3 Preparation of standards for new equipment practices . 31
5 Modular order details. 33
5.1 Modular grid.33
5.2 Pitches.35
5.3 Co-ordination dimensions.37
5.4 Illustration of the modular order. 39
60917-1 © IEC:1998 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60917-1 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
This standard cancels and replaces IEC 60916 (1988), IEC 60917 (1988), its amendment 1
(1993) and IEC 60917-0 (1989).
The text of this standard is based on the following documents:
FDIS Report on voting
48D/159/FDIS 48D/177/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
60917-1 © IEC:1998 – 7 –
INTRODUCTION
The trend towards constantly increasing functional integration and ever smaller volume and
space requirements for electronic components and integrated circuits, as well as the advent of
new manufacturing methods, automatic manufacturing and testing equipment and the use of
Computer Aided Engineering (CAE) systems offer users considerable technical and economic
advantages.
In order to ensure that, when using newly developed components, manufacturing methods and
CAE systems, the advantages can be fully exploited during planning, design, manufacture and
testing, it is necessary for equipment practices to meet the following requirements (see IEC
Guide 103):
– arrangement of products with a minimum loss of area and space;
– dimensional interchangeability of products, e.g. regarding overall dimensions, mounting
dimensions (fixing holes, cut-outs, etc.);
– dimensional compatibility and determination of interface dimensions of products which:
• are combined with other products, e.g. instruments, racks, panels and cabinets, etc.;
• are used in buildings that have been built in accordance with a modular system, e.g.
column spacing, room height, door height, etc.
An obstacle arises from the use of two systems of dimensioning (inch – metre) that are not
compatible with each other. The use of an interface between both dimensioning systems
represents one way around this obstacle. The recommendation is:
– to use only one dimensioning system and to use SI units.
The dimensions given in 5.3 of this standard have been taken from system I of IEC Guide 103
in consideration with other documents on dimensional coordination.
60917-1 © IEC:1998 – 9 –
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
1 Scope and object
This International Standard relates to equipment practices. The modular order is applicable to
the main structural dimensions of electronic equipment mounted in various installations where
dimensional interfaces have to be considered.
It refers to basic design parameters and is not intended to be used for manufacturing
tolerances or clearances.
In addition, information on interfaces to other technical fields, on technology and advanced
design aspects is included.
This standard also covers standard terms for parts and assemblies of mechanical structures
for electronic equipment.
This generic standard gives the definitions of a modular order for mechanical structures of
electronic equipment and provides for dimensional compatibility at mechanical interfaces with
related engineering applications, e.g. printed boards, components, instrumentation, furniture,
rooms, buildings, etc.
Furthermore, it supports the introduction and application of the modular order rules considering
that:
– compatibility of interface dimensions is aimed at the electronic field on the basis of the SI
unit metre;
– technical and economic advantages can be achieved when using the rules.
The terms in this standard should be used in all standards for mechanical structures of
electronic equipment and in related technical documents.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this International Standard. At the time of publication, the editions
indicated were valid. All normative documents are subject to revision, and parties to
agreements based on this International Standard are encouraged to investigate the possibility
of applying the most recent editions of the normative documents indicated below. Members of
IEC and ISO maintain registers of currently valid International Standards.
IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electro-
mechanical components for electronic equipment
IEC 60297-1:1986, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 1: Panels and racks
IEC 60297-2:1982, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 2: Cabinets and pitches of rack structures
IEC 60297-3:1984, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 3:
Subracks and associated plug-in units
60917-1 © IEC:1998 – 11 –
IEC 60297-4:1995, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 4:
Subracks and associated plug-in units – Additional dimensions
IEC 60473:1974, Dimensions for panel-mounted indicating and recording electrical measuring
instruments
IEC 60629:1978, Standard sheets for a modular system (for installation accessories for use in
domestic and similar installations)
IEC 60668:1980, Dimensions of panel areas and cut-outs for panel and rack-mounted
industrial-process measurement and control instruments
IEC 60917-2:1992, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice
IEC 60917-2-1:1993, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions
for the 25 mm equipment practice – Section 1: Detail specification – Dimensions for cabinets
and racks
IEC 60917-2-2:1994, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice – Section 2: Detail specification – Dimensions for subracks,
chassis, backplanes, front panels and plug-in units
IEC Guide 103:1980, Guide on dimensional co-ordination
ISO 31:1992, Quantities and units
ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain
other units
ISO 1006:1983, Building construction – Modular coordination – Basic module
ISO 1040:1983, Building construction – Modular coordination – Multimodules for horizontal
coordinating dimensions
ISO 3827-1:1977, Shipbuilding – Coordination of dimensions in ships' accommodation – Part 1:
Principles of dimensional coordination
3 Terms, terminology and definitions
For the purpose of this International Standard, the terminology used is in accordance with the
terminology in IEC 60050(581) and the following additional terms and definitions apply.
3.1
equipment practice
mechanical structure involved in housing and mounting of electronic and electromechanical
systems. It provides for compatibility between mechanical parts, electrical interconnections and
electronic components.
3.2
modular order
set of rules which establishes a relationship between co-ordination dimensions and the base
pitch, multiple pitches and mounting pitches to be used in equipment practice
3.3
co-ordination dimension
reference dimension used to co-ordinate mechanical interfaces. This is not a manufacturing
dimension with a tolerance.
NOTE – An actual outside dimension of a mechanical structure related to a co-ordination dimension can only
decrease.
60917-1 © IEC:1998 – 13 –
3.4
aperture dimension
special co-ordination dimension for a usable space between features (structural parts)
NOTE – An actual inside dimension of an aperture can only increase.
3.5
n
multiplier having integer values of range continuing 1, 2, 3, .
3.6
base pitch (p)
smallest distance between adjacent grid lines used in the equ
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.