IEC 63098-4:2023 provides the performance standards of the RoF-based 5G indoor distributed antenna system (DAS) network for cost-effectively offering quality of service (QoS) guaranteed 5G mobile communication services with high bandwidth and low-latency characteristics without radio shadowing in an indoor environment. First of all, the system overview, system configurations, and the elements of the system are presented and then the electrical and optical interfaces for each system element are defined. Finally, the detail system performance specifications of each element are described for downlink and uplink configurations.

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This part of IEC 61969 contains design guidelines for outdoor enclosures for electrical and electronic equipment and is applicable over a wide field of mechanical, electromechanical and electronic equipment and its installation where a modular design is used.
The objectives of this document are:
- to provide an overview of specifications for enclosures focused on requirements for outdoor applications for stationary use at non-weather protected locations, and
- to achieve product integrity under outdoor conditions and to ease product selection for the sourcing of outdoor enclosures from different vendors.
These enclosures are considered to contain any equipment and provide protection for the outdoor installed facilities against unwanted environmental impacts. The installed equipment can be, but is not limited to, subracks or chassis according to IEC 60917 (all parts) or IEC 60297 (all parts). A typical outdoor enclosure is shown in Figure 1.
[Figure 1]

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This part of IEC 61969 contains design guidelines for outdoor enclosures for electrical and electronic equipment and is applicable over a wide field of mechanical, electromechanical and electronic equipment and its installation where a modular design is used. The objectives of this document are: - to provide an overview of specifications for enclosures focused on requirements for outdoor applications for stationary use at non-weather protected locations, and - to achieve product integrity under outdoor conditions and to ease product selection for the sourcing of outdoor enclosures from different vendors. These enclosures are considered to contain any equipment and provide protection for the outdoor installed facilities against unwanted environmental impacts. The installed equipment can be, but is not limited to, subracks or chassis according to IEC 60917 (all parts) or IEC 60297 (all parts). A typical outdoor enclosure is shown in Figure 1. [Figure 1]

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IEC 61969-1:2023 is available as IEC 61969-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61969-1:2023 contains design guidelines for outdoor enclosures for electrical and electronic equipment and is applicable over a wide field of mechanical, electromechanical and electronic equipment and its installation where a modular design is used. The objectives of this document are:
- to provide an overview of specifications for enclosures focused on requirements for outdoor applications for stationary use at non-weatherprotected locations, and
- to achieve product integrity under outdoor conditions and to ease product selection for the sourcing of outdoor enclosures from different vendors.

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IEC 60297-3-1:2023 provides information on the technological schemes of the IEC 60297 series and shows how to apply the 19-inch series standards for the mechanical structure practices for electrical and electronic equipment.

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IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads.
It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.
This edition includes the following significant technical changes with respect to the previous edition:
a) complete revision of structure;
b) consolidation of essential parameters and requirements in Clause 4.

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IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant technical changes with respect to the previous edition: a) complete revision of structure; b) consolidation of essential parameters and requirements in Clause 4.

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This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads.
It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.
This edition includes the following significant technical changes with respect to the previous edition:
a) complete revision of structure;
b) consolidation of essential parameters and requirements in Clause 4.

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IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:  
addition terms and definitions.
addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
addition of drive hole to the reel (optional);
revision of reel hole diameter tolerances;
revision of 72 mm tape size carrier tape width dimension tolerances;
addition of Annex B (informative);
addition of component size 0201M.

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IEC 60917-1:2019 is available as IEC 60917-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60917-1:2019 specifies the relationships between equipment practices and the modular order which are applicable to the main structural dimensions of electronic and electrical equipment mounted in various installations where dimensional interfaces have to be considered for mechanical compatibility. This document also established terms for parts and assemblies of mechanical structures for electrical and electronic equipment, to clarify the specific relations between equipment practices and modular order. This second edition cancels and replaces the first edition published in 1998 and its Amendment 1:2000. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) added information on newly developed detail specification standards of mechanical structures for the electrical and electronic equipment practices; b) added information on newly developed performance test standards for the verifications of environmental performances and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices; c) introduced the relations between the mechanical structure for electrical and electronic system, the verification of environmental performance and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices. Key words: IT Cabinets, Mechanical Structures

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This part of IEC 61760 defines requirements for component specifications of electronic
components that are intended for usage in surface mounting technology. To this end, it
specifies a reference set of process conditions and related test conditions to be considered
when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to
the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during
assembly. This document defines tests and requirements that need to be part of any SMD
component's general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in
surface mounting technology.
Some of the requirements for component specifications in this document are also applicable
to components with leads intended for mounting on a circuit board. Cases for which this is
appropriate are indicated in the relevant subclauses.

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IEC 62966-1:2019 defines the dimensions and mechanical requirements of aisle containment for information technology (IT) cabinets. The cabinets concerned are dealt with in the standard series IEC 60297 and IEC 60917. The objective of this document is to stipulate properties and requirements of aisle containment ensuring cost effective installation, energy efficient and user-friendly operation of IT equipment in data centres and server rooms. Key words: IT Cabinets, Aisle Containment

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This part of IEC 61587 specifies environmental requirements, test set-ups, as well as safety
aspects for empty enclosures, i.e. cabinets, racks, subracks, chassis, chassis integrated
subracks and associated plug-in units under indoor condition use and transportation. It defines
classifications (product performance levels) for these products, regarding and simulating the
usually arising loads during their use. For mechanical static and dynamic load tests typical
examples with dummy loads are used.
The purpose of this document is to establish defined levels of physical performance in order to
meet certain requirements of manufacture, storage, transport and final location conditions.
This document applies in general only to the above cited mechanical structures.

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IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.

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IEC 61587-1:2022 specifies environmental requirements, test set-ups, as well as safety aspects for empty enclosures, i.e. cabinets, racks, subracks, chassis, chassis integrated subracks and associated plug-in units under indoor condition use and transportation. It defines classifications (product performance levels) for these products, regarding and simulating the usually arising loads during their use. For mechanical static and dynamic load tests typical examples with dummy loads are used. The purpose of this document is to establish defined levels of physical performance in order to meet certain requirements of manufacture, storage, transport and final location conditions. This document applies in general only to the above cited mechanical structures. This fifth edition cancels and replaces the fourth edition published in 2016. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Modification of title. b) Revision of Clauses 6, 7 and 8 including new defined test setups. c) Compatibility with IEC 61587-2, IEC 61587-3 and IEC 61587-5.

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IEC TR 60286-3-3:2021(E) describes the possible requirements for paper taping for the Auto Loading Feeder mechanism to mount electronic components without leads or with stump type leads used for electric circuits. This document is applicable to the punched carrier tape with the bottom cover tape (nominal tape width: 8 mm only) among the tapes of Type 1a, and the pressed carrier tape (nominal tape width: 8 mm) of Type 1b in IEC 60286-3.

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IEC TR 60286-3-4:2021(E) considers the proposed requirements for emboss taping for the Auto Loading Feeder mechanism to mount electric components without leads or with stump type leads used for electric circuits. This document is applicable to the embossed carrier tape, with single round sprocket holes, with tape pitches of 2 mm or more (nominal tape width: 8 mm only) among the tapes of Type 2a in IEC 60286-3.
The contents of the corrigendum of June 2022 have been included in this copy.

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NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

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IEC 60297-3-110:2018 specifies dimensions, specification for installation, environmental aspects and safety aspect of residential racks and cabinets based on IEC 60297 series, for smart houses, likely to be part of smart cities. Key words: Racks, Residential, Cabinets, Smart house

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This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

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IEC 61760-2:2021 is available as IEC 61760-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

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IEC 62610-2:2018 provides for compatible methods of configuring forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This document contains the following: a) thermal interfaces of subracks and/or chassis-based equipment in a cabinet, described by: • reference temperature, • preferred airflow conditions, • airflow volume conditions, • standard air; b) procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions. The drawings used are not intended to indicate product design. They are only for explanatory indications for determining forced air cooling. Keywords: Cabinets, Subracks, Forced Air Cooling, Thermal Management

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This part of IEC 61587 specifies security aspects and security performance levels of the
mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and
IEC 60297 (all parts). This document does not address vandalism.
NOTE Protection against vandalism is typically controlled by user-specific requirements.

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IEC 61587-6:2021 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism. This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Revised and expanded terms and definitions. b) Additional information in 4.2 Access security level of the cabinet. c) Revised requirements for Security performance levels of cabinets and added additional levels in Table 2 – Security performance levels of cabinets. d) Added a column for panel strength in Table 3 – Security performance levels of cabinet – mechanical. e) Revised test for mechanical lock (and hinges added) in 5.2.2 Tests for strength of mechanical locks and hinges. f) Added 5.2.4 Tests for panel strength. g) Added additional description of Key function in Table 5 – Security performance levels of key. h) Revised test method for handles in Annex A.

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IEC 61587-6:2021 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism.
This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Revised and expanded terms and definitions.
b) Additional information in 4.2 Access security level of the cabinet.
c) Revised requirements for Security performance levels of cabinets and added additional levels in Table 2 – Security performance levels of cabinets.
d) Added a column for panel strength in Table 3 – Security performance levels of cabinet – mechanical.
e) Revised test for mechanical lock (and hinges added) in 5.2.2 Tests for strength of mechanical locks and hinges.
f) Added 5.2.4 Tests for panel strength.
g) Added additional description of Key function in Table 5 – Security performance levels of key.
h) Revised test method for handles in Annex A.

  • Standard
    37 pages
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IEC TS 62966-3:2021 defines the requirements for operational and personal safety of aisle containments for IT cabinets.
The aim is to provide physical security for the IT equipment installed in the containment using the criteria “availability” and “safety”.
The requirements apply to all operational, working and maintenance procedures.
This document does not apply to ordinary persons, when using installations and equipment.
The requirements described herein are also intended to ensure that it is possible for authorized personnel to enter and remain in the containment (as accessible equipment) and to maintain or upgrade the systems installed in the containment without risk. It should also be possible to evacuate the containment quickly and safely at any time, especially in the event of a fire or any other hazardous situation, whilst reducing the health risk to personnel to a minimum.
Aspects relating to computing, data processing, data storage, building protection or the data centre itself do not fall within the scope of this document. Only those additional aspects arising from the integration of an aisle containment are considered.
The design and positioning of an aisle containment, which is integrated in the data centre, has influence on the following different aspects of operational safety:
a) escape and evacuation plans;
b) escape routes;
c) emergency exits;
d) functional aspects of escape doors;
e) lighting conditions
f) lighting and signposting of escape routes;
g) fire protection.
In this document, these operational safety requirements and recommendations are considered.
To achieve the highest effectiveness, all these requirements are considered as much as possible during the design of an aisle containment.
This document applies to normal operations, not to the initial installation of the containment.

  • Technical specification
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IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b)   some of the terminology used in the document has been updated; c)   references to IEC standards have been corrected; d)   five termination styles have been added.

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This part of IEC 62966, dedicated to aisle containment techniques for information technology
(IT) equipment typically used in data centres, describes the quantification of its air tightness, in
particular the air loss ratio that describes the content of the volumetric flow not used for cooling
the IT equipment. This ratio provides an index of efficiency, being inversely proportional to
efficiency (the lower this ratio, the higher the efficiency). This document provides methods to
measure an aisle containment air leakage rate and defines a classification system for aisle
containment leakage.
This document defines:
a) the measurement of the air leakage of the individual components of an aisle containment;
b) a method for calculating the air leakage of an aisle containment based on its individual
components;
c) a method for calculating the air leakage rate of an aisle containment in relation to the utilised
IT equipment;
d) a classification system for aisle containment leakage.

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IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

  • Standard
    47 pages
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IEC 62966-2:2020 is dedicated to aisle containment techniques for information technology (IT) equipment typically used in data centres, describes the quantification of its air tightness, in particular the air loss ratio that describes the content of the volumetric flow not used for cooling the IT equipment. This ratio provides an index of efficiency, being inversely proportional to efficiency (the lower this ratio, the higher the efficiency). This document provides methods to measure an aisle containment air leakage rate and defines a classification system for aisle containment leakage. This document defines: - the measurement of the air leakage of the individual components of an aisle containment; - a method for calculating the air leakage of an aisle containment based on its individual components; - a method for calculating the air leakage rate of an aisle containment in relation to the utilised IT equipment; - a classification system for aisle containment leakage.

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IEC 60286-1:2017(E) applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: a) a complete revision of the structure (detailed in Annex A) and reworked layout.

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IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). This edition includes the following significant technical changes with respect to the previous edition: The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

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This part of IEC 61969 specifies a set of basic environmental requirements and tests, as well
as safety aspects for outdoor enclosures under conditions of non-weather protected locations
above ground.
The purpose of this document is to define a minimum level of environmental performance in
order to meet requirements of storage, transport and final installation. The intention is to
establish basic environmental performance criteria for outdoor enclosure compliance.

  • Standard
    16 pages
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IEC 61969-3:2020 is available as IEC 61969-3:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61969-3:2020 specifies a set of basic environmental requirements and tests, as well as safety aspects for outdoor enclosures under conditions of non-weather protected locations above ground. The purpose of this document is to define a minimum level of environmental performance in order to meet requirements of storage, transport and final installation. The intention is to establish basic environmental performance criteria for outdoor enclosure compliance. This third edition cancels and replaces the second edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - alignment with the content of ETSI EN 300 019 and IEC 60721 series latest editions, particularly with the actualization of climate conditions; - new requirements added to reflect market requirements on environmental issues; - improvement on terminology and overall editorial improvement.

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This part of IEC 61969 contains design guidelines for outdoor enclosures and is applicable over
a wide field of mechanical, electromechanical and electronic equipment and its installation
where a modular design is used.
The objectives of this document are:
– to provide an overview of specifications for enclosures focused on requirements for outdoor
applications for stationary use at non-weather protected locations, and
– to achieve product integrity under outdoor conditions and to ease product selection for the
sourcing of outdoor enclosures from different vendors.
These enclosures are considered to contain any equipment and provide protection for the
outdoor installed facilities against unwanted environmental impacts. The installed equipment
can be, but is not limited to, subracks or chassis according to IEC 60917 (all parts) or
IEC 60297 (all parts).

  • Standard
    17 pages
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IEC 62966-2:2020 is dedicated to aisle containment techniques for information technology (IT) equipment typically used in data centres, describes the quantification of its air tightness, in particular the air loss ratio that describes the content of the volumetric flow not used for cooling the IT equipment. This ratio provides an index of efficiency, being inversely proportional to efficiency (the lower this ratio, the higher the efficiency). This document provides methods to measure an aisle containment air leakage rate and defines a classification system for aisle containment leakage.
This document defines:
- the measurement of the air leakage of the individual components of an aisle containment;
- a method for calculating the air leakage of an aisle containment based on its individual components;
- a method for calculating the air leakage rate of an aisle containment in relation to the utilised IT equipment;
- a classification system for aisle containment leakage.

  • Standard
    50 pages
    English and French language
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IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

  • Standard
    87 pages
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IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

  • Standard
    24 pages
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IEC 61969-1:2020 is available as IEC 61969-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61969-1:2020 contains design guidelines for outdoor enclosures and is applicable over a wide field of mechanical, electromechanical and electronic equipment and its installation where a modular design is used. The objectives of this document are: - to provide an overview of specifications for enclosures focused on requirements for outdoor applications for stationary use at non-weather protected locations, and - to achieve product integrity under outdoor conditions and to ease product selection for the sourcing of outdoor enclosures from different vendors. This third edition cancels and replaces the second edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - alignment with the content of ETSI EN 300 019 and IEC 60721 series latest editions, particularly with the actualization of climate conditions; - new requirements added to reflect market requirements on environmental issues; - improvement on terminology and overall editorial improvement.

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IEC 61587-6:2017(E) specifies security aspects and security performance levels of indoor cabinets in accordance with IEC 60917 and IEC 60297. This document intends to clarify the relationship between the installation conditions and the security requirements for indoor cabinets, and to provide the required performances and test methods on mechanical components related with security provisions for indoor cabinets which are in accordance with IEC 60297 series and IEC 60917 series.

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    19 pages
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IEC 61969-3:2020 is available as IEC 61969-3:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61969-3:2020 specifies a set of basic environmental requirements and tests, as well as safety aspects for outdoor enclosures under conditions of non-weather protected locations above ground. The purpose of this document is to define a minimum level of environmental performance in order to meet requirements of storage, transport and final installation. The intention is to establish basic environmental performance criteria for outdoor enclosure compliance. This third edition cancels and replaces the second edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- alignment with the content of ETSI EN 300 019 and IEC 60721 series latest editions, particularly with the actualization of climate conditions;
- new requirements added to reflect market requirements on environmental issues;
- improvement on terminology and overall editorial improvement.

  • Standard
    27 pages
    English and French language
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IEC 62610-6 which deals with thermal management for cabinets in accordance withIEC 60297 and IEC 60917 series, provides compatible measurement methods of recirculationratio and bypass ratio which are indicators for defining quality of airflow in the forced air coolingthat can be commonly applied to indoor cabinets for mounting subrack and/or chassis-basedequipment.

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    27 pages
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IEC 62610-6:2020 deals with thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, provides compatible measurement methods of recirculation ratio and bypass ratio which are indicators for defining quality of airflow in the forced air cooling that can be commonly applied to indoor cabinets for mounting subrack and/or chassis-based equipment. This document contains the following: a) the definition of recirculation and bypass flow rates in the cooling of the cabinet, b) the levels of the recirculation ratio RC, c) the definition of the formula for the recirculation ratio RCs of forced air cooling subrack and/or chassis-based equipment installed in the cabinet, d) the definition formula of recirculation ratio RCr and bypass rate BPr of the entire cabinet, e) the requirements of the measuring method of each temperature necessary for calculating the recirculation ratio RCs, RCr and bypass ratio BPr. The purpose of this document is to provide: • for the equipment integrator and development designer of the cabinet the criteria for efficiently and correctly determining the specification, and • for the supplier of the cabinet the measuring and classifying method for the airflow recirculation rate of the subrack and/or chassis-based equipment installed in the cabinet.

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    27 pages
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IEC 61969-1:2020 is available as IEC 61969-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61969-1:2020 contains design guidelines for outdoor enclosures and is applicable over a wide field of mechanical, electromechanical and electronic equipment and its installation where a modular design is used. The objectives of this document are:
- to provide an overview of specifications for enclosures focused on requirements for outdoor applications for stationary use at non-weather protected locations, and
- to achieve product integrity under outdoor conditions and to ease product selection for the sourcing of outdoor enclosures from different vendors.
This third edition cancels and replaces the second edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- alignment with the content of ETSI EN 300 019 and IEC 60721 series latest editions, particularly with the actualization of climate conditions;
- new requirements added to reflect market requirements on environmental issues;
- improvement on terminology and overall editorial improvement.

  • Standard
    25 pages
    English and French language
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IEC 61587-1:2016: specifies environmental requirements, test set-up, as well as safety aspects for empty enclosures, i.e., cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units under indoor condition use and transportation. The purpose of this standard is to establish defined levels of physical performance in order to meet certain requirements of storage, transport and final location conditions. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units, but it does not apply to electronic equipment. This fourth edition cancels and replaces the third edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: total overhaul of Clause 7 "Mechanical tests" and compatibility with IEC 61587-5. Key words: Indoor use, Transportation Requirements, Cabinets, Racks, Chassis Racks

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    48 pages
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