EN 62435-5:2017
(Main)Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.
Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse
Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5: Dispositifs de puces et plaquettes
L’IEC 62435-5:2017 est applicable au stockage de longue durée des dispositifs de puces et plaquettes et établit le régime et les conditions de stockage pour les puces nues singularisées et les plaquettes partielles ou complètes de puces incluant les puces avec ajout de structures telles que des couches de redistribution et des billes ou des perles de soudure ou d’autres métallisations. La présente partie donne également des lignes directrices pour les exigences spéciales et l’encapsulation primaire destinée à contenir la puce ou les plaquettes à des fins de manipulation. Elle s’utilise habituellement conjointement avec l'IEC 62435-1:2017 pour tout stockage de longue durée de dispositifs dont la durée peut être supérieure à 12 mois, pour un produit destiné à être stocké pendant une durée prolongée.
Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških elementov - 5. del: Elementi na čipih in rezinah (IEC 62435-5:2017)
Ta del standarda IEC 62435 se uporablja za dolgoročno skladiščenje elementov na čipih in rezinah ter določa poseben režim skladiščenja in pogoje za singularne čipe brez ohišja in delne ali celotne rezine čipov, vključno s čipi z dodanimi strukturami, kot so prerazporeditveni sloji in kroglice ali izbokline oz. druga metalizacija. Ta del zagotavlja tudi smernice za posebne zahteve in primarno embalažo, ki vsebuje čipe ali rezine, za namene ravnanja z njimi. Običajno se ta del uporablja skupaj s standardom IEC 62435-1 za dolgoročno skladiščenje poljubne naprave, ki je lahko daljše od 12 mesecev za izdelke, ki so načrtovani za dolgoročno skladiščenje.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-junij-2017
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Electronic components - Long-term storage of electronic semiconductor devices - Part 5:
Die and wafer devices (IEC 62435-5:2017)
Composants électroniques - Stockage de longue durée des dispositifs électroniques à
semiconducteurs - Partie 5: Dispositifs de puces et plaquettes
Ta slovenski standard je istoveten z: EN 62435-5:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 62435-5
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2017
ICS 31.020
English Version
Electronic components - Long-term storage of electronic
semiconductor devices - Part 5: Die and wafer devices
(IEC 62435-5:2017)
Composants électroniques - Stockage de longue durée des Elektronische Bauteile - Langzeitlagerung elektronischer
dispositifs électroniques à semiconducteurs - Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse
Partie 5: Dispositifs de puces et plaquettes (IEC 62435-5:2017)
(IEC 62435-5:2017)
This European Standard was approved by CENELEC on 2017-02-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62435-5:2017 E
European foreword
The text of document 47/2328/FDIS, future edition 1 of IEC 62435-5, prepared by
IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved
by CENELEC as EN 62435-5:2017.
The following dates are fixed:
(dop) 2017-11-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-02-24
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62435-5:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-17 NOTE Harmonized as EN 60068-2-17.
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 60749-3 NOTE Harmonized as EN 60749-3.
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1.
IEC 60749-21 NOTE Harmonized as EN 60749-21.
IEC 60749-22 NOTE Harmonized as EN 60749-22.
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1.
IEC 61340-2-1 NOTE Harmonized as EN 61340-2-1.
IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3.
IEC 62435-1 NOTE Harmonized as EN 62435-1.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year
IEC 62435-2 - Electronic components - Long-term EN 62435-2 -
storage of electronic semiconductor
devices -
Part 2: Deterioration mechanisms
IEC 62435-5 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 5: Die and wafer devices
Composants électroniques – Stockage de longue durée des dispositifs
électroniques à semiconducteurs –
Partie 5: Dispositifs de puces et plaquettes
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-3837-0
– 2 – IEC 62435-5:2017 © IEC 2017
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 9
4 Storage requirements . 9
4.1 General . 9
4.2 Assembly data . 9
4.3 Prerequisite for storage. 9
4.4 Damage to die products during long-term storage . 9
4.5 Mechanical storage conditions . 10
4.6 Long-term storage environment . 10
4.7 Recommended inert atmosphere purity . 11
4.8 Chemical contamination . 11
4.9 Vacuum packing . 11
4.9.1 General . 11
4.9.2 Vacuum dry pack . 11
4.10 Positive pressure systems for packing . 11
4.11 Use of packing material having sacrificial properties . 11
4.12 Use of bio-degradable material . 12
4.13 Plasma cleaning . 12
4.14 Electrical effects . 12
4.15 Protection from radiation . 12
4.16 Periodic qualification of stored die products . 12
5 Long-term storage failure mechanisms . 13
6 LTS concerns, method, verification and limitations . 13
6.1 General . 13
6.2 Wafers . 13
6.3 Bare dice . 14
7 Deterioration mechanisms specific to bare die and wafers . 15
7.1 Wire bondability . 15
7.2 Staining . 15
7.3 Topside delamination . 16
8 Specific handling concerns . 16
8.1 Die on wafer film frames . 16
8.2 Devices and dice embossed or punched tape storage . 16
8.3 Handling damage . 16
Annex A (informative) Audit checklist . 17
Bibliography . 20
IEC 62435-5:2017 © IEC 2017 – 3 –
Table 1 – LTS exposure concerns for wafers . 14
Table 2 – LTS exposure concerns for bare dice . 15
Table A.1 – Planning checklist . 17
– 4 – IEC 62435-5:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –
Part 5: Die and wafer devices
FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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6) All users should ensure that they have
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