IEC 62047-15:2015

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre

L'IEC 62047-15:2015 décrit la méthode d'essai de la résistance de collage entre polydiméthylsiloxane (PDMS) et verre. Le caoutchouc de silicone, PDMS, est utilisé pour la réalisation de puces microfluidiques, fabriquées en utilisant des processus de lithographie et de moulage d'empreinte. Le problème de la résistance de collage se pose principalement pour les applications à haute pression, par exemple dans le cas de la conception de certaines pompes péristaltiques, lorsqu'une alimentation en air comprimé hors puce est utilisée pour entraîner les fluides dans des microcanaux créés par une double couche, l'une étant formée par collage entre verre et PDMS moulé d'empreinte et une autre entre PDMS et PDMS. D'autre part, dans le cas des systèmes comportant des microsoupapes pneumatiques, un niveau de collage relativement important entre deux couches moulées d'empreinte de PDMS devient relativement nécessaire. Il existe habituellement un phénomène de fuite et de décollement à l'interface des zones collées, produisant une instabilité et une diminution de la durée de vie des dispositifs MEMS. La présente norme définit les modes opératoires généraux de l'essai de collage de PDMS et puce de verre.

General Information

• Status: Withdrawn
• Publication Date: 04-Mar-2015
• Withdrawal Date: 03-Jan-2018
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: WPUB - Publication withdrawn
• Start Date: 03-Jan-2018
• Completion Date: 04-Jan-2018

Standards Content (Sample)

IEC 62047-15 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 15: Test method of bonding strength between PDMS and glass

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre

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IEC 62047-15 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 15: Test method of bonding strength between PDMS and glass

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-2291-1

– 2 – IEC 62047-15:2015 © IEC 2015

CONTENTS
FOREWORD . 3

1 Scope . 5

2 Normative references . 5

3 Terms and definitions . 5

4 Testing method . 6

4.1 Visual test . 6

4.1.1 General . 6
4.1.2 Equipment . 6
4.1.3 Procedure . 6
4.1.4 Visual test results . 6
4.2 Bonding strength test . 6
4.2.1 General . 6
4.2.2 Sample preparation . 7
4.2.3 Procedure . 7
4.2.4 Result of blister test . 8
4.3 Contact angle measurement . 8
4.3.1 General . 8
4.3.2 Equipment . 8
4.3.3 Procedure . 8
4.3.4 Result of test . 9
4.4 Hermeticity test . 9
4.4.1 General . 9
4.4.2 Equipment . 9
4.4.3 Procedure . 10
4.4.4 Result of test . 10
Bibliography . 11

Figure 1 – Blister mask . 7
Figure 2 – PDMS blister . 8
Figure 3 – Contact angle measurement of water drop on PDMS . 9
Figure 4 – Test set-up for hermeticity . 10

Table 1 − Result of visual test . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 15: Test method of bonding

strength between PDMS and glass

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International Standard IEC 62047-15 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/208/FDIS 47F/213/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted
...