IEC 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 18: Méthodes d'essai de flexion des matériaux en couche mince

La CEI 62047-18:2013 spécifie la méthode d'essai de flexion des matériaux en couche mince de longueur et largeur inférieures à 1 mm et d'épaisseur comprise entre 0,1 micrometre et 10 micrometre. La présente Norme Internationale spécifie les essais de flexion et la forme des éprouvettes d'essai pour des éprouvettes d'essai de type en porte-à-faux lisses microminiaturisés, qui garantissent une précision correspondant aux caractéristiques spéciales.

General Information

• Status: Published
• Publication Date: 16-Jul-2013
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Aug-2013
• Completion Date: 17-Jul-2013

Standards Content (Sample)

IEC 62047-18 ®
Edition 1.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 18: Bend testing methods of thin film materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 18: Méthodes d’essai de flexion des matériaux en couche mince

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IEC 62047-18 ®
Edition 1.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 18: Bend testing methods of thin film materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 18: Méthodes d’essai de flexion des matériaux en couche mince

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX M
ICS 31.080.99 ISBN 978-2-8322-0982-0

– 2 – 62047-18 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Symbols and designations . 6
4 Test piece . 6
4.1 Design of test piece . 6
4.2 Preparation of test piece . 7
4.3 Test piece width and thickness . 7
4.4 Storage prior to testing . 7
5 Testing method . 7
5.1 General . 7
5.2 Method for mounting of test piece . 9
5.3 Method for loading. 9
5.4 Speed of testing . 9
5.5 Displacement measurement . 9
5.6 Test environment . 9
5.7 Data analysis . 9
5.8 Material for test pieces . 10
6 Test report . 10
Annex A (informative) Precautions for the test piece/substrate interface . 11
Annex B (informative) Precautions necessary for the force displacement relationship . 12

Figure 1 – Schematically shown test piece with substrate . 6
Figure 2 – Measurement method . 8
Figure A.1 – Finishing angle of substrate contact area with test piece . 11
Figure B.1 – Cantilever type bend test piece of metallic glass in accordance with
IEC 62047-18. 12
Figure B.2 – Typical example of relationship between force and displacement . 13

Table 1 – Symbols and designation of test piece . 6

62047-18 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 18: Bend testing methods of thin film materials

FOREWORD
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International Standard IEC 62047-18 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/155/FDIS 47F/162/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.

– 4 – 62047-18 © IEC:2013
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62047-18 © IEC:2013 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 18: Bend testing methods of thin film materials

1 Scope
This part of IEC 62047 specifies the method for bend testing of thin film materials with a
length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm. Thin
films are used as main structural materials for Micro-electromechanical Systems (abbreviated
as MEMS in this document) and micromachines.
The main structural materials for MEMS, micromachines, etc., have special features, such as
a few micron meter size, material fabrication by deposition, photolithography, and/ or non-
mechanical machining test piece. This International Standard specifies the bend testing and
test piece shape for micro-sized smooth cantile
...