IEC 62047-11:2013

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material's melting temperature.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode d'essai pour les coefficients de dilatation thermique linéaire des matériaux autonomes pour systèmes microélectromécaniques

La CEI 62047-11:2013 définit la méthode d'essai pour mesurer les coefficients de dilatation thermique linéaire (CLTE) de matériaux de systèmes micro-électromécaniques (MEMS) solides autonomes minces (métalliques, céramiques, polymères, etc.) dont la longueur est comprise entre 0,1 mm et 1 mm, la largeur entre 10 micrometre et 1 mm et l'épaisseur entre 0,1 micrometre et 1 mm, qui sont les matériaux structurels principaux utilisés pour les MEMS, les micromachines et autres. Cette méthode d'essai peut s'appliquer à la mesure des CLTE dans la gamme de températures allant de la température ambiante jusqu'à 30 % de la température de fusion du matériau.

General Information

• Status: Published
• Publication Date: 16-Jul-2013
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Aug-2013
• Completion Date: 17-Jul-2013

Standards Content (Sample)

IEC 62047-11 ®
Edition 1.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 11: Test method for coefficients of linear thermal expansion of free-standing
materials for micro-electromechanical systems

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 11: Méthode d'essai pour les coefficients de dilatation thermique linéaire
des matériaux autonomes pour systèmes microélectromécaniques

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IEC 62047-11 ®
Edition 1.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 11: Test method for coefficients of linear thermal expansion of free-standing

materials for micro-electromechanical systems

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 11: Méthode d'essai pour les coefficients de dilatation thermique linéaire

des matériaux autonomes pour systèmes microélectromécaniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.080.99 ISBN 978-2-8322-0965-3

– 2 – 62047-11 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative References . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Test piece thickness . 6
4.4 In-plane type test piece . 7
4.5 Out-of-plane type test piece . 7
5 Testing method and test apparatus . 7
5.1 Measurement principle . 7
5.1.1 General . 7
5.1.2 In-plane method . 8
5.1.3 Out-of-plane method . 8
5.2 Test apparatus . 9
5.2.1 General . 9
5.2.2 In-plane method . 9
5.2.3 Out-of-plane method . 9
5.3 Temperature measurement . 9
5.4 In-plane test piece handling . 9
5.5 Thermal strain measurement . 10
5.6 Heating speed . 10
5.7 Data analysis . 10
5.7.1 General . 10
5.7.2 Terminal-based calculation . 10
5.7.3 Slope calculation by linear least squares method . 10
6 Test report . 10
Annex A (informative) Test piece fabrication . 12
Annex B (informative) Test piece handling example . 13
Annex C (informative) Test piece releasing process . 14
Annex D (informative) Out-of-plane test setup and test piece example . 15
Annex E (informative) Data analysis example in in-plane test method . 16
Annex F (informative) Data analysis example in out-of-plane test method . 17
Bibliography . 19

Figure 1 – Thin film test piece . 6
Figure 2 – CLTE measurement principles. 8
Figure A.1 – Schematic test piece fabrication process . 12
Figure B.1 – Auxiliary jigs and a specimen example . 13
Figure C.1 – Schematic illustration showing the test piece releasing process . 14
Figure D.1 – Example of test setup and test piece . 15
Figure E.1 – Example of CLTE measurement with an aluminium test piece . 16
Figure F.1 – Example of CLTE measurement with a gold test piece . 18

Table 1 – Symbols and designations . 5

62047-11 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 11: Test method for coefficients of linear thermal expansion
of free-standing materials for micro-electromechanical systems

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