IEC TR 62258-3:2005

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - singulated bare die, - minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

General Information

• Status: Published
• Publication Date: 12-Jun-2005
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: PT 62258 - TC 47/PT 62258
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 06-Aug-2010

Relations

• Revised: IEC TR 62258-3:2010 - Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
• Effective Date: 05-Sep-2023

Standards Content (Sample)

TECHNICAL IEC
REPORT TR 62258-3
First edition
2005-06
Semiconductor die products –
Part 3:
Recommendations for good practice
in handling, packing and storage

Reference number
IEC/TR 62258-3:2005(E)
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TECHNICAL IEC
REPORT TR 62258-3
First edition
2005-06
Semiconductor die products –
Part 3:
Recommendations for good practice
in handling, packing and storage

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X

International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – TR 62258-3  IEC:2005(E)

CONTENTS
FOREWORD.4

INTRODUCTION.6

1 Scope and object.7

2 Normative references .7

3 Terms and definitions .8

4 Handling – Good practice .8
4.1 General .8
4.2 Working environmental controls.8
4.3 General handling precautions.8
4.4 Cleanroom good practice.8
5 Process handling issues .12
5.1 Wafer sawing .12
5.2 Die sorting.13
6 Die and wafer transport and storage media .16
6.1 Wafer carriers and cassettes .16
6.2 In-process carriers and transport systems .17
6.3 Packing for shipment of unsawn wafers.17
6.4 Packing for shipment of sawn wafers.18
6.5 Packing for shipment of single wafers .21
6.6 Packing for shipment of die using trays .21
6.7 Packing for shipment of die using tape-and-reel .25
6.8 Secondary packing for shipment.27
7 Storage good practice .28
7.1 Die and wafer storage .28
7.2 Short-term storage environment and conditions.28
7.3 Storage time limitations .28
7.4 Sawn wafer on wafer frame or ring .29
7.5 Die products in the production area .29
7.6 Die in tape-and-reel.29
7.7 Dry-packed die products.29

8 Traceability good practice.29
8.1 General .29
8.2 Wafer traceability .29
8.3 Die products traceability.29
8.4 Wafer and die back side marking.30
9 Guidelines for long-term storage (die banking) of bare die and wafers.30
9.1 General .30
9.2 Preparing for storage.30
9.3 Damage to die products during long-term storage .31
9.4 Long-term storage environment .31
9.5 Recommended inert atmosphere purity .32
9.6 Chemical contamination .32
9.7 Electrical effects.33

TR 62258-3  IEC:2005(E) – 3 –

9.8 Protection from radiation.33

9.9 Periodic qualification of stored die products .33

10 Good practice for automated handling during assembly .34

10.1 Removal of die from shipping media.34

10.2 Equipment out of service .34

Annex A (informative) Planning checklist .35

Annex B (informative) Material specifications.41

Bibliography .44

Figure 1 – Bevel cut for bare die and flip-chip products.12
Figure 2 – Die eject needle .15
Figure 3 – Wafer jar structure.18
Figure 4 – Film frame.19
Figure 5 – Grip ring.20
Figure 6 – Single waffle pack .22
Figure 7 – Stacked waffle packs.23
Figure 8 – Vacuum-release trays.24
Figure 9 – Corner relief in the cavity of a chip tray.25
Figure 10 – Tape-and-reel packing structure .27
Figure 11 – Packaging material for shipment .27

Table 1 – Example die eject marks.15
Table A.1 – Planning checklist .35

– 4 – TR 62258-3  IEC:2005(E)

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
SEMICONDUCTOR DIE PRODUCTS –
Part 3: Recommendations for good practice

in handling, packing and storage

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-3, which is a technical report, has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/
...