Application of fixed capacitors in electronic equipment - Part 1: Aluminium electrolytic capacitors

IEC TR 63362-1:2022(E) establishes guidelines for the application and use of aluminium electrolytic capacitors in electronic equipment.
The information given in this document applies to capacitors with non-solid electrolyte but can, in its appropriate clauses, apply to capacitors with solid electrolyte as well.
Electrolytic capacitors in general – and aluminium electrolytic capacitors in particular – are an exception in the capacitor field because of the components’ close interaction of physics and chemistry. Therefore, aluminium electrolytic capacitors show, in various aspects, a technical behaviour unaccustomed to the user. That could easily lead to misapplications and even to endangering of persons and goods. The aim of this document is to minimize these risks by providing detailed information on the specific peculiarities of the component.
This first edition cancels and replaces CLC/TR 50454 published in 2008. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
Complete technical revision, details of cleaning processes and failure modes added.
Inclusion of parts of JEITA RCR 2367D.

General Information

Status
Published
Publication Date
17-Feb-2022
Current Stage
PPUB - Publication issued
Start Date
14-Mar-2022
Completion Date
18-Feb-2022
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IEC TR 63362-1 ®
Edition 1.0 2022-02
TECHNICAL
REPORT
colour
inside
Application of fixed capacitors in electronic equipment –
Part 1: Aluminium electrolytic capacitors
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IEC TR 63362-1 ®
Edition 1.0 2022-02
TECHNICAL
REPORT
colour
inside
Application of fixed capacitors in electronic equipment –

Part 1: Aluminium electrolytic capacitors

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.060.50 ISBN 978-2-8322-1078-4

– 2 – IEC TR 63362-1:2022 © IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Protection measures – insulation . 8
5 General application limits . 9
5.1 Polarity – Reverse voltage . 9
5.2 Voltage . 9
5.2.1 General . 9
5.2.2 Rated voltage . 9
5.2.3 Surge voltage . 9
5.2.4 Transient voltages . 9
5.3 Temperature range . 9
5.4 Ripple current . 10
5.5 Charge – Discharge . 10
6 Storage, transportation, and operation . 10
7 External pressure (not relevant for capacitors with solid electrolyte) . 11
7.1 Low air pressure . 11
7.2 High air pressure . 11
8 Self-recharge phenomenon (dielectric absorption) . 11
9 Flammability (passive and active) . 11
9.1 General . 11
9.2 Passive flammability . 11
9.3 Active flammability . 12
10 Internal pressure and pressure relief device . 12
11 Working electrolytes and contact with an electrolyte . 12
12 Parallel and series connection of capacitors . 13
12.1 General . 13
12.2 Voltage sharing between devices . 13
12.3 Circuit configuration . 13
12.4 Balancing resistors for voltage sharing . 14
12.4.1 General . 14
12.4.2 Voltage sharing analysis . 15
12.4.3 Resistor tolerance . 16
12.4.4 Choice of resistor value . 16
12.5 Component failure. 17
13 Clearance and creepage distances . 17
13.1 Distances inside the capacitor . 17
13.2 Distances outside the capacitor . 17
14 Capacitor mounting . 18
14.1 General conditions for mounting . 18
14.1.1 Mounting position . 18
14.1.2 Polarity indication . 18
14.1.3 Hole/pad distance . 18
14.1.4 Position of the pressure relief device . 18

14.1.5 Board holes under the insulation . 19
14.1.6 Double-sided printed circuit boards . 19
14.1.7 Case polarity . 19
14.2 Component preparation. 19
14.3 Mounting . 19
14.3.1 Discharging . 19
14.3.2 Ratings and polarity . 19
14.3.3 Lead stress . 19
14.3.4 Fixing torque . 19
14.3.5 Capacitor fixing . 20
14.4 Soldering . 20
14.4.1 Preheat temperature . 20
14.4.2 Soldering temperature and duration . 20
14.4.3 Care after soldering . 20
14.5 Transport and handling of assembled devices . 20
15 Cleaning solvents and processes . 20
15.1 General . 20
15.2 Cleaning solvents . 20
15.2.1 Halogenated solvents (e.g. CFC) . 20
15.2.2 Halogenated hydrocarbons . 21
15.2.3 Aqueous solutions . 21
15.2.4 Alcohols . 21
15.2.5 Alkaline solvents . 21
15.2.6 Other cleaning solvents . 21
15.3 Cleaning of circuit board . 21
15.3.1 Cleaning processes . 21
15.3.2 Process control during cleaning . 22
15.3.3 Process control after cleaning . 22
15.3.4 Other precautions . 22
16 Potting and gluing . 22
16.1 General . 22
16.2 Potting and gluing materials . 23
16.3 Curing process . 23
17 Selection of capacitors and failure mechanisms during overload . 23
17.1 Selection . 23
17.1.1 General . 23
17.1.2 Selection based on operating conditions . 23
17.1.3 Selection based on shapes and assembly conditions . 23
17.2 Failure mechanisms during overload (especially details under overvoltage
load conditions) . 24
17.2.1 Overview . 24
17.2.2 Failure mechanisms - details . 24
18 Disposal of capacitors . 25
Bibliography . 26

Figure 1 – Individual balancing resistors . 13
Figure 2 – Common centre connection . 14
Figure 3 – Group-balancing resistors . 14

– 4 – IEC TR 63362-1:2022 © IEC 2022
Figure 4 – Voltage sharing analysis . 15
Figure 5 – Degradation mechanisms . 24

Table 1 – B
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