IEC TR 62899-303-2:2024
(Main)Printed electronics - Part 303-2: Equipment - Sheet to sheet printing - Mechanical dimensions
Printed electronics - Part 303-2: Equipment - Sheet to sheet printing - Mechanical dimensions
IEC TR 62899-303-2:2024, which is a Technical Report, lays down the framework for defining standard mechanical dimensions of equipment utilized in the field of printed electronics. While primarily focused on substrate-based printing equipment, the guidelines and standards established in this document also maintain flexibility for application to transient printing equipment. Through this inclusivity, the document seeks to cover a broad spectrum of the industry, ensuring uniformity and adaptability across various printing technologies in the printed electronics domain.
General Information
Standards Content (Sample)
IEC TR 62899-303-2 ®
Edition 1.0 2024-10
TECHNICAL
REPORT
Printed electronics –
Part 303-2: Equipment – Sheet to sheet printing – Mechanical dimensions
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IEC TR 62899-303-2 ®
Edition 1.0 2024-10
TECHNICAL
REPORT
Printed electronics –
Part 303-2: Equipment – Sheet to sheet printing – Mechanical dimensions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 19.080; 37.100.10 ISBN 978-2-8322-9902-9
– 2 – IEC TR 62899-303-2:2024 © IEC 2024
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mechanical dimensions . 7
4.1 General . 7
4.2 Overview of printing equipment for printed electronics . 7
4.3 Maximum substrate length and width, without shuttle . 9
4.4 Minimum substrate length and width without shuttle . 9
4.5 Maximum printable length and width without shuttle . 9
4.6 Shuttle width . 10
4.7 Shuttle, gap and repeat lengths . 11
4.7.1 General . 11
4.7.2 Shuttle length . 11
4.7.3 Gap length . 11
4.7.4 Repeat length . 11
4.8 Thickness . 13
4.9 Maximum substrate length and width on shuttle . 13
4.10 Minimum substrate length and width on shuttle . 14
4.11 Maximum printable length and width . 14
5 Example of the specification of the printing equipment. 16
Annex A (informative) Examples of similar dimensions . 17
A.1 Examples of Si-wafer . 17
A.2 Examples of sheet of paper (ISO 216 [3]). 18
Bibliography . 19
Figure 1 – Overview of S2S printing system . 8
Figure 2 – Maximum substrate width and length without shuttle . 9
Figure 3 – Minimum substrate width and length without shuttle . 9
Figure 4 – Example of maximum printable width and length without shuttle . 10
Figure 5 – Example of mechanical dimensions of shuttle . 10
Figure 6 – Examples of shuttle length . 12
Figure 7 – Example of shuttle thickness . 13
Figure 8 – Example of shuttle width and length, and maximum substrate width and
length . 13
Figure 9 – Example of shuttle width and length, and minimum substrate width and
length . 14
Figure 10 – Example of maximum printable width and length . 15
Figure A.1 – Example of mechanical dimensions for Si-wafer. 17
Table 1 – Example of the specification of printing equipment . 16
Table A.1 – Example of mechanical dimensions . 17
Table A.2 – Part of A series format of sheet of paper . 18
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 303-2: Equipment – Sheet-to-sheet printing –
Mechanical dimensions
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
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IEC TR 62899-303-2 has been prepared by IEC technical committee 119: Printed Electronics.
It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
119/504/DTR 119/513/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.
– 4 – IEC TR 62899-303-2:2024 © IEC 2024
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
INTRODUCTION
The field of printed electronics represents an exciting frontier in modern technology, having
recently progressed from experimental stages to actual commercial production. This
advancement underscores the need for scalable industrial equipment to manufacture a large
volume of products efficiently.
Unlike traditional electronic products, the nascent world of printed electronics lacks universally
accepted standards for the mechanical dimensions of the final products or devices. This
absence presents a unique challenge in an industry with a rich history of over 1 000 years,
where 'printing' commonly refers to 'image printing' or simply 'print.'
Historically, international standards have been instrumental in shaping the printing industry.
These standards, defining aspects like paper size and the input and output dimensions of the
printing process, have streamlined production and mitigated complications arising from
unknown or variable sizes.
Embracing this established tradition of standardization, IEC TC 119 is initiating a document to
delineate standard mechanical dimensions for input and output from printed electronics
equipment. The intention behind this standardization is to provide a cohesive framework,
enhancing interoperability and efficiency, mirroring the success achieved in traditional printing
processes. This initiative marks a significant step towards integrating printed electronics into
the broader landscape of
...
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