TC 119 - Printed Electronics

IEC TR 62899-303-2:2024, which is a Technical Report, lays down the framework for defining standard mechanical dimensions of equipment utilized in the field of printed electronics. While primarily focused on substrate-based printing equipment, the guidelines and standards established in this document also maintain flexibility for application to transient printing equipment. Through this inclusivity, the document seeks to cover a broad spectrum of the industry, ensuring uniformity and adaptability across various printing technologies in the printed electronics domain.

IEC 62899-301-3:2024 defines measurement terms and methods related to the shape errors of printing plate rollers. Measurement terms include radius, total run-out, and three kinds of shape errors of printing plate rollers that are axial deviation, radial deviation, and cross-sectional deviation. The remaining shape error excluding the three errors mentioned above is defined as a residual shape error.
This document applies to printing plate rollers with or without patterns while excluding the pattern area for the measurement.

IEC 62899-302-4:2024 provides measurement methods and specifications for a medium to measure actual inkjet dot placement for printed electronics applications.
NOTE: For this document, a medium is a substrate with (a) certain functional layer(s) to facilitate the ink pinning process (or step). These functional layers are either (a) a liquid absorbing layer or (b) a hydrophilic or hydrophobic layer as shown in Figure 1.

IEC 62899-203:2024 defines terms and specifies standard methods for characterization and evaluation of semiconductor inks and semiconductive layers that are made from semiconductor inks. This edition includes the following significant technical changes with respect to the previous edition:
a) addition of 6.3.1.2.2 - Normalised on-current measurement of the TFT device;
b) in 6.3.2, correction of formula for calculation of permittivity.

IEC 62899-202-8:2024 provides a method for measuring the resistance difference of the printing direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The method described in this document offers a measurement method and conditions for solution processed conductive films, fabricated by coating and printing process.

IEC TR 62899-304-1:2023, which is a technical report, provides technical information relating to surface temperature measurement of the substrate containing the printed patterns and films applicable to the photonic sintering system used in the printed electronics industry.

IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

IEC TR 62899-302-5:2023 provides the significant characteristics, parameters and system properties that are relevant for functional inkjet printing for printed electronics. Where possible, existing measurement standards and specifications are cited.

IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.

IEC TR 62899-550-1:2022(E), which is a Technical Report, provides a framework for evaluating the mechanical and thermal durability of printed and/or flexible electronics components and products. This includes the bending test, torsion test, stretching test, steady heat test as well as the thermal cycle test. These are typical conditions that are easily encountered in daily life for printed and/or flexible electronics components and products.
This document gives guidance for use for technical committees in the preparation of consistent standards relating to the quality assessment of printed and/or flexible electronics components and products. Consistent standards for durability testing will help users, including businesses, developers, vendors, and end users to select suitable methods for durability testing and make consistent test procedures for printed electronics.

IEC 62899-202-4:2021(E) defines the terminology and measurement methods for the properties of stretchable printed layers, such as conductive ink, for forming stretchable conductors by printing, stretchable conductive films obtained from conductive ink, and stretchable printed wiring consisted by conductive ink with insulator.
Stretchable printed layers (conductive and insulating) handled by this document apply to the stretchable electric wiring printed on stretchable substrates, for example fabric integrated wearable devices, skin patchable devices, and so on.

IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable substrates handled by this document apply to substrates subjected to repeated bending with wiring elements demanding a high level of performance, such as fabric integrated wearable devices or skin patchable devices.
This document does not define the required characteristics of the stretchable substrate. It provides test methods to characterize (pre-qualify) the substrates that are intended to be used for printing conductors and insulators for the purposes of manufacturing stretchable layers or structures.

IEC TR 62899-402-4:2021(E), which is a Technical Report, is a preparatory work for the documents dealing with the measurement method of the vertical direction (surface forms) of printed patterns made by printed electronics technology.
The printed pattern of interest in this document is limited to straight lines on substrates with a flat surface. This document focuses on the classification and measurement methods for surface forms from the nanometer scale to the micrometer scale, and suggests the strategy for the subsequent documents.

IEC 62899-503-3:2021(E) specifies a measuring method of contact resistance for printed thin film transistors (TFTs) by the transfer length method (TLM). The method requires the fabrication of a test element group (TEG) with varying channel length (L) between source and drain electrodes. The method is intended for quality assessment of TFT electrode contacts and is suited for determining whether the contact resistance lies within a desired range.

IEC 62899-402-3:2021(E) specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable voids using this document are limited to those that are distinguishable by the optical image measurement.
NOTE In this document, void means an imperfection of pattern observed from a two-dimensional (2D) top-view.

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

IEC 62899-302-3:2021(E) specifies in-flight imaging methods for the measurement of the direction of ink drops jetted from inkjet print-heads using drop watchers. It does not apply to holographic or other interference techniques, or to any method assessing deposited ink drops. It is specific to drop-on-demand type inkjet print-heads (used in printed electronics equipment).

IEC 62899-202-6:2020(E) provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.

IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics.
This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge and distribution edge of edge waviness, which are quite different from those that appear in the printing of graphic arts or from etching processes.

IEC 62899-505:2020(E) specifies mechanical and thermal test methods for the determination of the reliability characteristics of a printed flexible gas sensor, which is operated at relatively low temperature and is composed of a flexible substrate, electrode, and gas sensing layer. The examples of target gas include in-door air pollutants, combustion gas from a fire situation, and industrial flue gas.

IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

IEC 62899-101:2019(E) defines terms used in the field of printed electronics, addressing topics including, but not limited to, materials, printing processes, and print characterization. It focuses on terms that are of particular importance to printed devices. Therefore, terms that are already defined in relation to conventional electronics materials, processes, devices, components or systems that can be used in the field of printed electronics without alteration are not included in this document. Similarly, established terms and definitions in relation to printing technology that apply to the field of printed electronics are not included.

IEC 62899-502-2:2019(E) specifies the combined mechanical and environmental stress test methods for flexible OLED (organic light emitting diode) elements fabricated using the printing method. Mechanical stress tests include the static and cycling vending test, and the dynamic and static rolling test.

IEC 62899-204:2019 (E) defines the terms and specifies the standard methods for characterisation and evaluation. This document is applicable to insulator inks and printed insulating layers that are made from insulator inks used for printed electronics. The insulator inks include dielectric inks.

IEC 62899-202-3:2019(E) defines terms and specifies a standard method for the measurement of the sheet resistance of printed conductive films using a contactless eddy-current method.

IEC 62899-501-1:2019(E) specifies failure modes and mechanical stress test methods for the determination of reliability characteristics of bendable or flexible printed primary cells and secondary cells and batteries as defined in IEC 60050-482:2004, 482-01-01, IEC 60050‑482:2004, 482-01-02, IEC 60050-482:2004, 482-01-03, IEC 60050-482:2004, 482‑01-04 and IEC 60050-482:2004, 482-01-05, respectively.
Important parameters and specifications for primary cells are mentioned in IEC 60086-1 and IEC 60086-2. IEC 61960-3, as well as IEC 61951-1 and IEC 61951-2 define performance tests, designations, markings, dimensions and other requirements for secondary single cells and batteries. IEC 62133-1 and IEC 62133-2 address general safety requirements of secondary cells and batteries.

IEC 62899-201:2016(E) defines the terms and specifies the evaluation method for substrates used in the printing process to form electronic components/devices. This international standard is also applied to the substrates which make surface treatment in order to improve their performance.

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

IEC 62899-203:2018(E) defines terms and specifies standard methods for characterisation and evaluation. This document is applicable to semiconductor inks and semiconductive layers that are made from semiconductor inks.

IEC 62899-403-1:2018(E) specifies commonly-utilized basic design patterns to evaluate printing machines with pattern reproducibility from the view point of printability in the field of printed electronics. These basic patterns consist of several evaluation patterns and register marks. Printability is derived from the evaluation of the reproducibility of these printed patterns produced by the printed machine.

IEC 62899-303-1:2018(E) defines standard mechanical dimensions (especially related to the web size) of equipment for printed electronics. This document covers web-based printing equipment, but it can be used for sheet-based products.

IEC 62899-302-2:2018(E) specifies the method for determining accurate inkjet droplet volume based on images obtained by drop-in-flight measurement systems. It does not apply to imaging systems using interference fringes, such as holography or phase doppler anemometry. This document is not limited to drop-on-demand inkjet systems, but might not be applicable to continuous inkjet or liquid dispensing systems. This document includes a description of the issues concerning such measurements and consideration of the limits to measurement accuracy.

IEC 62899-301-2:2017(E) defines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate masters.
General critical dimensions are defined to evaluate the shape accuracy of features on the plate master. To evaluate the registration accuracy of features on the plate master, the specification for the registration mark for the plate master is specified. Then, common metrology procedures to measure the critical dimensions and the registration accuracy of the plate master are established for device manufacturers, printing master manufacturers and printing master manufacturing equipment vendors. The measurement terms which are measured by agreement between the user and the supplier are measured using the measurement methods given in this document.

IEC 62899-302-1:2017(E) specifies the method for determining inkjet drop speed based on visualized droplet images obtained by a drop analysis system. This measurement standardization is limited to drop-on-demand-type of inkjet and is not applicable to continuous inkjet. This document includes the test process, image processing software algorithm, and analysis of jetting behavior.

IEC 62899-301-1:2017(E) defines measurement terms and methods related to the external dimension of a rigid plate master. Measurement terms include geometrical size such as edge length, edge squareness, edge straightness and thickness, flatness of plate master substrates, and surface roughness of plate master.

IEC 62899-502-1:2017(E) specifies the quality assessment methods, especially the mechanical stress test methods, for reliability assessment.
This document is applicable to flexible OLED elements formed on flexible substrates by printed electronics technology excluding those OLED products, which are intended to be used for lighting purposes.

IEC 62899-402-1:2017(E) specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.

IEC 62899-401:2017(E) provides an introduction to the rest of the IEC 62899-4XX series and explains its modular structure. The IEC 62899-4XX series establishes requirements for the printability of printed electronics. These requirements are stated as measurement of quality, reproducibility, analysis and compliance test methods, as well as measuring methods for environmental conditions.
The IEC 62899-4XX series specifies the measurements and the requirements of both the quality and the reproducibility of printed patterns as the result of the interaction of printing media, inks, substrate, and environmental conditions.

IEC TR 62899-250:2016(E), which is a Technical Report (TR), explores a new technological field to establish standardization activities in TC 119 (Printed electronics) in particular, and to contribute to the development and market expansion of wearable smart device (WSD) technology.

IEC 62899-202:2016(E) defines the terms and specifies the standard methods for characterisation and evaluation. This International Standard is applicable to conductive inks and conductive layer that are made from conductive inks.