Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 µm and 500 µm.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.

General Information

Status
Published
Publication Date
22-Jun-2021
Current Stage
PPUB - Publication issued
Start Date
16-Jul-2021
Completion Date
23-Jun-2021
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IEC 62047-38:2021 - Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
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IEC 62047-38
®

Edition 1.0 2021-06
INTERNATIONAL
STANDARD

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inside


Semiconductor devices – Micro-electromechanical devices –
Part 38: Test method for adhesion strength of metal powder paste in MEMS
interconnection
IEC 62047-38:2021-06(en)

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IEC 62047-38

®


Edition 1.0 2021-06




INTERNATIONAL



STANDARD








colour

inside










Semiconductor devices – Micro-electromechanical devices –

Part 38: Test method for adhesion strength of metal powder paste in MEMS

interconnection

























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.99 ISBN 978-2-8322-9908-1




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– 2 – IEC 62047-38:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of a test piece . 6
4.3 Measurement of dimensions . 7
4.4 Evaluation of adhesion strength . 7
5 Testing method and test apparatus . 8
5.1 Test principle . 8
5.2 Test apparatus .
...

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