IEC 62047-38:2021

Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 µm and 500 µm.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.

General Information

• Status: Published
• Publication Date: 22-Jun-2021
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Current Stage: PPUB - Publication issued
• Start Date: 16-Jul-2021
• Completion Date: 23-Jun-2021

Standards Content (Sample)

IEC 62047-38 ®
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 38: Test method for adhesion strength of metal powder paste in MEMS
interconnection
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IEC 62047-38 ®
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 38: Test method for adhesion strength of metal powder paste in MEMS

interconnection
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-9908-1

– 2 – IEC 62047-38:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of a test piece . 6
4.3 Measurement of dimensions . 7
4.4 Evaluation of adhesion strength . 7
5 Testing method and test apparatus . 8
5.1 Test principle . 8
5.2 Test apparatus . 8
5.3 Test procedure . 8
5.4 Test environment . 9
6 Test report . 9
Annex A (informative) Examples of adhesion strength measurement for metal powder
paste . 10
A.1 General . 10
A.2 Adhesion strength measurement . 10
Bibliography . 12

Figure 1 – Circularly patterned test piece for metal powder paste . 7
Figure 2 – Schematic of a testing apparatus . 9
Figure A.1 – Examples of measured force and contact area . 10
Figure A.2 – Examples of maximum contact force, contact area, and adhesion strength . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 38: Test method for adhesion strength of
metal powder paste in MEMS interconnection

FOREWORD
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IEC 62047-38 has been prepared by subcommittee 47F: Micro-electromechanical systems, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47F/378/FDIS 47F/382/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62047-38:2021 © IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
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• amended.
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SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 38: Test method for adhesion strength of
metal powder paste in MEMS interconnection

1 Scope
This part of IEC 62047 specifies a test method for measuring the adhesion strength of metal
powder paste in the electrical interconnection between micro-electromechanical systems
(MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic
conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for
metal powder diameters from 10 µm and 500 µm.
In this test method, a uniaxial compression load is applied to metal powder paste using a
glass lens simulating an actual MEMS device; then, the adhesion strength is measured by
retracting the lens. This test method is proper when the adhesion strength should be analyzed
by considering the actual contact area between the MEMS device and metal powder particles.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• ISO Online browsing platform: available at http://www.iso.org/obp
• IEC Electropedia: available at http://www.electropedia.org/
3.1
contact load
P
L
predetermined force when the lens is contacted with metal powder paste
Note 1 to entry: Contact load is expressed in N.
3.2
maximum pulling force
P
C
maximum of pulling force endurable for a test piece
Note 1 to entry: Maximum pulling force is expressed in N.
3.3
contact area only with metal powder
A
MP
contact area made with metal powder only when the contact load(P ) is applied
L
Note 1 to entry: Contact area only with metal powder is expressed in m .

– 6 – IEC 62047-38:2021 © IEC 2021
3.4
contact area with metal powder paste
A
MPP
contact area made with metal powder paste when the contact load(P ) is applied
L
Note 1 to entry: Contact area with metal powder paste is expressed in m .
3.5
adhesion strength
S
C
maximum pulling force (P ) divided by the contact area
C
Note 1 to entry: Adhesion strength is expressed in N/m .
3.6
separation speed
V
SEP
predetermined speed when the test pieces are retracted from the lens
Note 1 to entry: Separation speed is expressed in μm/s.
3.7
contact radius
a
radius of contact area when the contact area with metal powder paste is assumed to the area
of a circle
Note 1 to entry: Contact radius is expressed in m.
3.8
radius of curvature
R
radius of curvature of the lens, which simulates an actual device
Note 1 to entry: Radius of curvature of the lens is expressed in m.
4 Test piece
4.1 General
The test piece for metal powder paste shall be prepared using the same preparation process
for MEMS interconnection. The circular patterns of a metal powder paste shown in Figure 1 is
formed by screen printing, ink-jet printing, or other deposition techniques. The interface
between the metal powder paste and the substrate and the interface between the metal
powder
...