Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 µm and 500 µm.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.

General Information

Status
Published
Publication Date
22-Jun-2021
Current Stage
PPUB - Publication issued
Completion Date
23-Jun-2021
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IEC 62047-38:2021 - Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
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IEC 62047-38
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 38: Test method for adhesion strength of metal powder paste in MEMS
interconnection
IEC 62047-38:2021-06(en)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62047-38
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 38: Test method for adhesion strength of metal powder paste in MEMS
interconnection
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-9908-1

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62047-38:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Test piece ....................................................................................................................... 6

4.1 General ................................................................................................................... 6

4.2 Shape of a test piece .............................................................................................. 6

4.3 Measurement of dimensions ................................................................................... 7

4.4 Evaluation of adhesion strength .............................................................................. 7

5 Testing method and test apparatus .................................................................................. 8

5.1 Test principle .......................................................................................................... 8

5.2 Test apparatus ........................................................................................................ 8

5.3 Test procedure ........................................................................................................ 8

5.4 Test environment .................................................................................................... 9

6 Test report ....................................................................................................................... 9

Annex A (informative) Examples of adhesion strength measurement for metal powder

paste .................................................................................................................................... 10

A.1 General ................................................................................................................. 10

A.2 Adhesion strength measurement ........................................................................... 10

Bibliography .......................................................................................................................... 12

Figure 1 – Circularly patterned test piece for metal powder paste ........................................... 7

Figure 2 – Schematic of a testing apparatus ........................................................................... 9

Figure A.1 – Examples of measured force and contact area .................................................. 10

Figure A.2 – Examples of maximum contact force, contact area, and adhesion strength ....... 11

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IEC 62047-38:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 38: Test method for adhesion strength of
metal powder paste in MEMS interconnection
FOREWORD

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IEC 62047-38 has been prepared by subcommittee 47F: Micro-electromechanical systems, of

IEC technical committee 47: Semiconductor devices. It is an International Standard.

The text of this International Standard is based on the following documents:
FDIS Report on voting
47F/378/FDIS 47F/382/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
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– 4 – IEC 62047-38:2021 © IEC 2021

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,

available at www.iec.ch/members_experts/refdocs. The main document types developed by

IEC are described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 62047 series, published under the general title Semiconductor

devices – Micro-electromechanical devices, can be found on the IEC website.

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IEC 62047-38:2021 © IEC 2021 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 38: Test method for adhesion strength of
metal powder paste in MEMS interconnection
1 Scope

This part of IEC 62047 specifies a test method for measuring the adhesion strength of metal

...

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