Connectors for electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors - Tests 28a to 28g

IEC 60512-28-100:2013 specifies the test methods for transmission performance for IEC 60603-7 and IEC 61076-3 series connectors up to 1 000 MHz. It is also suitable for testing lower frequency connectors, however the test methodology specified in the detailed specification for any given connector remains the reference conformance test for that connector. The test methods provided here are:
- insertion loss,
- return loss,
- near-end crosstalk (NEXT),
- far-end crosstalk (FEXT),
- transverse conversion loss (TCL) and
- transverse conversion transfer loss (TCTL). For the transfer impedance (ZT) test, see IEC 60512-26-100. For the coupling attenuation, see IEC 62153-4-12. Keywords: Signal Integrity, Near-end crosstalk, Far-end crosstalk.

Connecteurs pour équipements électroniques - Essais et mesures - Partie 28-100: Essais d'intégrité des signaux jusqu'à 1 000 MHz sur les connecteurs des séries CEI 60603-7 et CEI 61076-3 - Essais 28a à 28g

La CEI 60512-28-100:2013 spécifie les méthodes d'essais pour les performances des transmissions pour des connecteurs conformes aux séries CEI 60603-7 et CEI 61076-3 jusqu'à 1 000 MHz. Elle s'applique également aux essais de connecteurs de plus basses fréquences, mais la méthodologie d'essai spécifiée dans la spécification particulière pour tout connecteur donné reste l'essai de conformité de référence pour le connecteur en question. Les méthodes d'essai spécifiées ici sont:
- perte d'insertion, essai 28a,
- affaiblissement de réflexion, essai 28b,
- paradiaphonie (NEXT), essai 28c,
- télédiaphonie (FEXT), essai 28d,
- perte de conversion transverse (TCL), essai 28f,
- perte de transfert de conversion transverse (TCTL), essai 28g. Pour l'essai d'impédance de transfert (ZT), voir la CEI 60512-26-100, essai 26e. Pour l'affaiblissement de couplage, voir la CEI 62153-4-12. Mots-clés: intégrité des signaux, paradiaphonie, télédiaphonie

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Publication Date
05-Feb-2013
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IEC 60512-28-100


®


Edition 1.0 2013-02



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE


Connectors for electronic equipment – Tests and measurements –
Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and
IEC 61076-3 series connectors – Tests 28a to 28g

Connecteurs pour équipements électroniques – Essais et mesures –
Partie 28-100: Essais d'intégrité des signaux jusqu'à 1 000 MHz sur les
connecteurs des séries CEI 60603-7 et CEI 61076-3 – Essais 28a à 28g


IEC 60512-28-100:2013

---------------------- Page: 1 ----------------------
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IEC 60512-28-100



®



Edition 1.0 2013-02







INTERNATIONAL





STANDARD







NORME



INTERNATIONALE











Connectors for electronic equipment – Tests and measurements –

Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and

IEC 61076-3 series connectors – Tests 28a to 28g




Connecteurs pour équipements électroniques – Essais et mesures –

Partie 28-100: Essais d'intégrité des signaux jusqu'à 1 000 MHz sur les


connecteurs des séries CEI 60603-7 et CEI 61076-3 – Essais 28a à 28g














INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX V


ICS 31.220.10 ISBN 978-2-83220-639-3



Warning! Make sure that you obtained this publication from an authorized distributor.

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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – 60512-28-100 © IEC:2013



CONTENTS

FOREWORD . 5


1 Scope . 7

2 Normative references . 7

3 Terms, definitions and acronyms . 8


3.1 Terms and definitions . 8

3.2 Acronyms . 8

4 Overall test arrangement . 9

4.1 Test instrumentation . 9
4.2 Measurement precautions . 9
4.3 Mixed mode S-parameter nomenclature . 10
4.4 Coaxial cables and interconnect for network analysers . 11
4.5 Requirements for switching matrices . 11
4.6 Test fixture requirements . 12
4.7 Requirements for termination performance at calibration plane. 13
4.8 Reference loads for calibration . 13
4.9 Calibration . 14
4.10 Termination loads for termination of conductor pairs . 14
4.10.1 General . 14
4.10.2 Verification of termination loads . 15
4.11 Termination of screens . 15
4.12 Test specimen and reference planes . 15
4.12.1 General . 15
4.12.2 Interconnections between device under test (DUT) and the
calibration plane . 16
4.13 Overall test setup requirements . 18
5 Connector measurement up to 1 000 MHz . 18
5.1 General . 18
5.2 Insertion loss, Test 28a . 19
5.2.1 Object. 19
5.2.2 Connecting hardware insertion loss . 19
5.2.3 Test method . 19
5.2.4 Test set-up . 19

5.2.5 Procedure . 19
5.2.6 Test report . 20
5.2.7 Accuracy . 20
5.3 Return loss, Test 28b . 20
5.3.1 Object. 20
5.3.2 Connecting hardware return loss . 20
5.3.3 Test method . 20
5.3.4 Test set-up . 21
5.3.5 Procedure . 21
5.3.6 Test report . 21
5.3.7 Accuracy . 21
5.4 Near-end crosstalk (NEXT), Test 28c . 21
5.4.1 Object. 21
5.4.2 Connecting hardware NEXT . 21

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60512-28-100 © IEC:2013 – 3 –


5.4.3 Test method . 21

5.4.4 Test set-up . 22

5.4.5 Procedure . 22

5.4.6 Test report . 23

5.4.7 Accuracy . 23

5.5 Far-end crosstalk (FEXT), Test 28d . 23

5.5.1 Object. 23

5.5.2 Connecting hardware FEXT . 23

5.5.3 Test method . 23

5.5.4 Test set-up . 23

5.5.5 Procedure . 24
5.5.6 Test report . 24
5.5.7 Accuracy . 24
5.6 Transfer impedance (Z ), Test 28e . 25
T
5.7 Transverse conversion loss (TCL), Test 28f. 25
5.7.1 Object. 25
5.7.2 Connecting hardware TCL . 25
5.7.3 Test method . 25
5.7.4 Test set-up . 25
5.7.5 Procedure . 25
5.7.6 Test report . 26
5.7.7 Accuracy . 26
5.8 Transverse conversion transfer loss (TCTL), Test 28g . 26
5.8.1 Object. 26
5.8.2 Connecting hardware TCTL . 26
5.8.3 Test method . 27
5.8.4 Test set-up . 27
5.8.5 Procedure . 27
5.8.6 Test report . 27
5.8.7 Accuracy . 27
5.9 Coupling attenuation . 28
Annex A (informative) Example derivation of mixed mode parameters using the modal
decomposition technique . 29
Annex B (informative) Test pins – Dimensions and references . 32
Bibliography . 33


Figure 1 – Diagram of a single ended 4 port device . 10
Figure 2 – Diagram of a balanced 2 port device . 10
Figure 4 – Calibration of reference loads . 14
Figure 5 – Resistor termination networks . 15
Figure 6 – Definition of reference planes . 16
Figure 7 – Insertion loss and TCTL measurement . 20
Figure 8 – NEXT measurement . 22
Figure 9 – FEXT measurement . 24
Figure 10 – Return loss and TCL measurement . 25
Figure A.1 – Voltage and current on balanced DUT. 29
Figure A.2 – Voltage and current on unbalanced DUT . 30

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Figure B.1 – Example of pin and fixed connector dimensions . 32




Table 1 – Mixed mode S-parameter nomenclature . 11

Table 2 – Switch performance recommendations . 12

Table 3 – Test fixture requirements . 13


Table 4 – Requirements for terminations at calibration plane . 13

Table 5 – Interconnection DM return loss requirements. 18

Table 6 – Overall test setup requirements . 18

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60512-28-100 © IEC:2013 – 5 –


INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



CONNECTORS FOR ELECTRONIC EQUIPMENT –

TESTS AND MEASUREMENTS –



Part 28-100: Signal integrity tests up to 1 000 MHz

on IEC 60603-7 and IEC 61076-3 series connectors –

Tests 28a to 28g




FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60512-28-100 has been prepared by subcommittee 48B:
Connectors, of IEC technical committee 48: Electromechanical components and mechanical
structures for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/2322/FDIS 48B/2332/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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A list of all parts of IEC 60512 series, under the general title Connectors for electronic

equipment – Tests and measurements, can be found on the IEC website.


The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be


• reconfirmed,

• withdrawn,

• replaced by a revised edition, or

• amended.

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60512-28-100 © IEC:2013 – 7 –


CONNECTORS FOR ELECTRONIC EQUIPMENT –

TESTS AND MEASUREMENTS –



Part 28-100: Signal integrity tests up to 1 000 MHz

on IEC 60603-7 and IEC 61076-3 series connectors –

Tests 28a to 28g








1 Scope
This part of IEC 60512 specifies the test methods for transmission performance for
IEC 60603-7 and IEC 61076-3 series connectors up to 1 000 MHz. It is also suitable for
testing lower frequency connectors, however the test methodology specified in the detailed
specification for any given connector remains the reference conformance test for that
connector.
The test methods provided here are:
– insertion loss, test 28a;
– return loss, test 28b;
– near-end crosstalk (NEXT) test 28c;
– far-end crosstalk (FEXT), test 28d;
– transverse conversion loss (TCL), test 28f;
– transverse conversion transfer loss (TCTL), test 28g.
For the transfer impedance (ZT) test, see IEC 60512-26-100, test 26e.
For the coupling attenuation, see IEC 62153-4-12.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.

IEC 60050-581, International Electrotechnical Vocabulary (IEV) – Part 581: Electromechanical
components for electronic equipment
IEC 60512-1, Connectors for electronic equipment – Tests and measurements – Part 1:
General
IEC 60512-26-100:2008, Connectors for electronic equipment – Tests and measurements –
Part 26-100: Measurement setup, test and reference arrangement and measurements for
connectors according to IEC 60603-7 – Tests 26a to 26g
IEC 60603-7 (all parts), Connectors for electronic equipment
IEC 61076-1, Connectors for electronic equipment – Product requirements – Part 1: Generic
specification

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– 8 – 60512-28-100 © IEC:2013


IEC 61076-3-104, Connectors for electronic equipment – Product requirements –

Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data

transmissions with frequencies up to 1 000 MHz


IEC 61076-3-110, Connectors for electronic equipment – Product requirements –

Part 3-110: Detail specification for shielded, free and fixed connectors for data transmission

with frequencies up to 1 000 MHz


IEC 61156 (all parts), Multicore and symmetrical pair/quad cables for digital communications


IEC 61156-6, Multicore and symmetrical pair/quad cables for digital communications – Part 6:

Symmetrical pair/quad cables with transmission characteristics up to 1 000 MHz – Work area
wiring – Sectional specification
IEC 61169-16, Radio-frequency connectors – Part 16: RF coaxial connectors with inner
diameter of outer conductor 7 mm (0,276 in) with screw coupling – Characteristic impedance
50 ohms (75 ohms) (Type N)
IEC 62153-4-12, Metallic communication cable test methods – Part 4-12: Electromagnetic
compatibility (EMC) – Coupling attenuation or screening attenuation of connecting hardware –
Absorbing clamp method
ISO/IEC 11801, Information technology – Generic cabling for customer premises
3 Terms, definitions and acronyms
3.1 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 60050(581), IEC 61076-1,
IEC 60512-1, IEC 60603-7, IEC 61076-3-104 and IEC 61076-3-110 as well as the following,
apply.
3.1.1
mixed mode (parameter or measurement)
parameters or measurements containing differential mode, common mode, and intermodal
S-matrices
3.1.2
intermodal (parameter or measurement)
a parameter or measurement that either sources on the common mode and measures on the
differential mode or, sources on the differential mode and measures on the common mode

3.2 Acronyms
For ease of reference acronyms used in this document are given below.
CM common mode
DM differential mode
DUT device under test
FEXT far-end crosstalk loss
IEC International Electrotechnical Commission
LCL longitudinal conversion loss
LCTL longitudinal conversion transfer loss
NEXT near-end crosstalk loss
TCL transverse conversion loss

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60512-28-100 © IEC:2013 – 9 –


TCTL transverse conversion transfer loss

SE single ended


Z transfer impedance
T


4 Overall test arrangement


4.1 Test instrumentation


All test instrumentation shall be capable of performing measurements over the frequency

range of 1 MHz to 1 000 MHz.

The test procedures hereby described require the use of a vector network analyser. The
analyser should have the capability of full 2-port calibrations. The analyser shall cover the
frequency range of 1 MHz to 1 000 MHz at least.
Measurements are to be taken using a mixed mode test set-up, which is often referred to as
an unbalanced, modal decomposition or balun-less setup. This allows measurements of
balanced devices without use of an RF balun in the signal path.
Such a configuration also allows testing with either a common or differential mode stimulus
and responses, ensuring that intermodal parameters can be measured without reconnection.
A 16 port network analyser is required to measure all combinations of a 4 pair device without
external switching, however the network analyser shall have a minimum of 2 ports (including
one bi-directional port) to enable the data to be collated and calculated.
It should be noted that the use of a 2 port analyser will involve successive repositioning of the
measurement port in order to measure any given parameter.
A 4 port network analyser is recommended as a practical minimum number of ports, as this
will allow the measurement of the full 16 term mixed mode S-parameter matrix on a given pair
combination without switching or reconnection in one direction.
In order to minimise the reconnection of the DUT for each pair combination the use of an
RF switching unit is also recommended.
Each conductor of the pair or pair combination under test shall be connected to a separate
port of the network analyser, and results are processed either by internal analysis within the
network analyser or by an external application.

Reference loads and through connections are needed for the calibration of the set-up.
Requirements for the reference loads are given in 4.8. Termination loads are needed for
termination of pairs, used and unused, which are not terminated by the network analyser.
Requirements for the termination loads are given in 4.7 and 4.10.
4.2 Measurement precautions
To ensure a high degree of reliability for transmission measurements, the following
precautions are required.
a) Consistent and stable resistor loads shall be used throughout the test sequence.
b) Cable and adapter discontinuities, as introduced by physical flexing, sharp bends and
restraints shall be avoided
...

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