Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a test piece of layered MEMS device, and the interfacial adhesion energy is measured from the critical bending moment for the steady state cracking in the weakest interface. This test method applies to MEMS devices with thin film layers deposited on semiconductor substrates. The total thickness of the thin film layers should be 100 times less than the thickness of a supporting substrate (typically a silicon wafer piece).

General Information

Status
Published
Publication Date
04-Apr-2019
Current Stage
PPUB - Publication issued
Completion Date
05-Apr-2019
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IEC 62047-31
Edition 1.0 2019-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 31: Four-point bending test method for interfacial adhesion energy of
layered MEMS materials
IEC 62047-31:2019-04(en)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62047-31
Edition 1.0 2019-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 31: Four-point bending test method for interfacial adhesion energy of
layered MEMS materials
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-6717-2

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62047-31:2019 © IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms, definitions, symbols and designations .................................................................. 5

3.1 Terms and definitions .............................................................................................. 5

3.2 Symbols and designations ...................................................................................... 6

4 Test piece ....................................................................................................................... 6

4.1 General ................................................................................................................... 6

4.2 Shape of a test piece .............................................................................................. 6

4.3 Measurement of dimensions ................................................................................... 7

4.4 Evaluation of energy release rate ............................................................................ 7

5 Testing method and test apparatus .................................................................................. 7

5.1 Test principle .......................................................................................................... 7

5.2 Test machine .......................................................................................................... 8

5.3 Test procedure ........................................................................................................ 8

5.4 Test environment .................................................................................................... 9

6 Test report ....................................................................................................................... 9

Annex A (informative) Failure modes during the four-point bending test ............................... 10

A.1 General ................................................................................................................. 10

A.2 Some failure modes .............................................................................................. 10

Bibliography .......................................................................................................................... 12

Figure 1 – Four-point bending test piece ................................................................................. 6

Figure 2 – Picture of a four-point bending fixture ..................................................................... 9

Figure A.1 – Several failure modes during the four-point bending test ................................... 11

Table 1 – Symbols and designations of a test piece ................................................................ 6

---------------------- Page: 4 ----------------------
IEC 62047-31:2019 © IEC 2019 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 31: Four-point bending test method for interfacial
adhesion energy of layered MEMS materials
FOREWORD

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International Standard IEC 62047-31 has been prepared by subcommittee 47F: Micro-

electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47F/326/FDIS 47F/331RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 5 ----------------------
– 4 – IEC 62047-31:2019 © IEC 2019

A list of all parts in the IEC 62047 series, published under the general title Semiconductor

devices – Micro-electromechanical devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

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colour printer.
---------------------- Page: 6 ----------------------
IEC 62047-31:2019 © IEC 2019 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 31: Four-point bending test method for interfacial
adhesion energy of layered MEMS materials
1 Scope

This part of IEC 62047 specifies a four-point bending test method for measuring interfacial

adhesion energy of the weakest interface in the layered micro-electromechanical systems

(MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are

many layered material interfaces, and their adhesion energies are critical to the reliability of

the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a

test piece of layered MEMS device, and the interfacial adhesion energy is measured from the

critical bending moment for the steady state cracking in the weakest interface. This test

method applies to MEMS devices with thin film layers deposited on semiconductor substrates.

The total thickness of the thin film layers should be 100 times less than the thickness of a

supporting substrate (typically a silicon wafer piece).
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
There are no normative references in this document.
3 Te
...

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