IEC 62047-1:2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices. This edition includes the following significant technical changes with respect to the previous edition:
a) removal of ten terms;
b) revision of twelve terms;
c) addition of sixteen new terms.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1: Termes et définitions

L'IEC 62047-1:2016 définit des termes pour les dispositifs microélectromécaniques en incluant le procédé de production de ces dispositifs. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) retrait de dix termes;
b) révision de douze termes;
c) ajout de seize nouveaux termes.

General Information

• Status: Published
• Publication Date: 05-Jan-2016
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jan-2016
• Completion Date: 06-Jan-2016

Relations

• Revises: IEC 62047-1:2005 - Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62047-1 ®
Edition 2.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 1: Terms and definitions
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 1: Termes et définitions

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IEC 62047-1 ®
Edition 2.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –

Part 1: Terms and definitions
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 1: Termes et définitions

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-3099-2

– 2 – IEC 62047-1:2016 © IEC 2016
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Terms and definitions . 5
2.1 General terms and definitions . 5
2.2 Terms and definitions relating to science and engineering . 6
2.3 Terms and definitions relating to materials science . 7
2.4 Terms and definitions relating to functional element . 7
2.5 Terms and definitions relating to machining technology . 12
2.6 Terms and definitions relating to bonding and assembling technology . 19
2.7 Terms and definitions relating to measurement technology . 21
2.8 Terms and definitions relating to application technology . 23
Annex A (informative) Standpoint and criteria in editing this glossary . 27
A.1 Guidelines for selecting terms . 27
A.2 Guidelines for writing the definitions . 27
A.3 Guidelines for writing the notes . 27
Annex B (informative) Clause cross-references of IEC 62047-1:2005 and IEC 62047-
1:2015 . 28
Bibliography . 32

Table B.1 – Clause cross-reference of IEC 62047-1: 2005 and IEC 62047-1:2015 . 28

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 1: Terms and definitions
FOREWORD
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International Standard IEC 62047-1 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) removal of ten terms;
b) revision of twelve terms;
c) addition of sixteen new terms.

– 4 – IEC 62047-1:2016 © IEC 2016
The text of this standard is based on the following documents:
FDIS Report on voting
47F/232/FDIS 47F/238/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 1: Terms and definitions
1 Scope
This part of IEC 62047 defines terms for micro-electromechanical devices including the
process of production of such devices.
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.1 General terms and definitions
2.1.1
micro-electromechanical device
microsized device, in which sensors, actuators, transducers, resonators, oscillators,
mechanical components and/or electric circuits are integrated
Note 1 to entry: Related technologies are extremely diverse from fundamental technologies such as design,
material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit, and
evaluation to basic science such as micro-science and engineering as well as thermodynamics and tribology in a
micro-scale. If the devices constitute a system, it is sometimes called as MEMS which is an acronym standing for
"micro-electromechanical systems"
...