IEC 62047-22:2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 22: Méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples

L'IEC 62047-22:2014 spécifie une méthode d'essai de traction en vue de mesurer les propriétés électromécaniques des matériaux des systèmes microélectromécaniques (MEMS, Micro-Electromechanical Systems) de couches minces conductrices collés sur des substrats souples non conducteurs. Les structures en couches minces sur des substrats souples sont largement utilisées dans les MEMS, les produits grand public, et les électroniques montés sur support souple. Le comportement électrique des couches sur substrats souples diffère de celui des couches et substrats indépendants du fait des interactions liées aux interfaces. Différentes combinaisons de substrats souples et de couches minces influent souvent de diverses manières sur les résultats d'essai en fonction des conditions d'essais et de l'adhérence liée aux interfaces. L'épaisseur souhaitée d'un matériau MEMS mince est 50 fois plus mince que celle d'un substrat souple, alors que d'autres dimensions sont similaires les unes aux autres.

General Information

• Status: Published
• Publication Date: 18-Jun-2014
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Drafting Committee: WG 1 - TC 47/SC 47F/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 30-Jun-2014
• Completion Date: 19-Jun-2014

Standards Content (Sample)

IEC 62047-22 ®
Edition 1.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 22: Electromechanical tensile test method for conductive thin films on
flexible substrates
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 22: Méthode d'essai de traction électromécanique pour les couches
minces conductrices sur des substrats souples

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IEC 62047-22 ®
Edition 1.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 22: Electromechanical tensile test method for conductive thin films on

flexible substrates
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 22: Méthode d'essai de traction électromécanique pour les couches

minces conductrices sur des substrats souples

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX K
ICS 31.080.99 ISBN 978-2-8322-1649-1

– 2 – IEC 62047-22:2014 © IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, symbols and designations . 5
3.1 Terms and definitions. 5
3.2 Symbols and designations . 6
4 Test piece . 6
4.1 General . 6
4.2 Shape of a test piece . 6
4.3 Measurement of dimensions . 7
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure. 9
5.4 Test environment . 9
6 Test report . 9

Figure 1 – Bilayered test piece. 6
Figure 2 – Schematic of an electromechanical test machine . 8
Figure 3 – Electromechanical tensile grip . 9

Table 1 – Symbols and designations of a test piece . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 22: Electromechanical tensile test method
for conductive thin films on flexible substrates

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International Standard IEC 62047-22 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/186/FDIS 47F/190/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62047-22:2014 © IEC 2014
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
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SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 22: Electromechanical tensile test method
for conductive thin films on flexible substrates

1 Scope
This part of IEC 62047 specifies a tensile test method to measure electromechanical
properties of conductive thin
...