ISO/IEC 10373-6:2011/Amd 1:2012

Identification cards — Test methods — Part 6: Proximity cards — Amendment 1: Additional PICC classes

Cartes d'identification — Méthodes d'essai — Partie 6: Cartes de proximité — Amendement 1: Classes addtionnelles de PICC

General Information

• Status: Withdrawn
• Publication Date: 18-Apr-2012
• Withdrawal Date: 18-Apr-2012
• ICS: 35.240.15 - Identification cards. Chip cards. Biometrics
• Technical Committee: ISO/IEC JTC 1/SC 17 - Cards and security devices for personal identification
• Drafting Committee: ISO/IEC JTC 1/SC 17/WG 8 - Integrated circuit cards without contacts
• Current Stage: 9599 - Withdrawal of International Standard
• Completion Date: 18-Jul-2016

Relations

• Revised: ISO/IEC 10373-6:2016 - Identification cards — Test methods — Part 6: Proximity cards
• Effective Date: 22-Mar-2014
• Consolidated By: ISO 11553-1:2020 - Safety of machinery — Laser processing machines — Part 1: Laser safety requirements
• Effective Date: 06-Jun-2022
• Amends: ISO/IEC 10373-6:2011 - Identification cards — Test methods — Part 6: Proximity cards
• Effective Date: 04-Dec-2021

Standards Content (Sample)

INTERNATIONAL ISO/IEC
STANDARD 10373-6
Second edition
2011-01-15
AMENDMENT 1
2012-05-01

Identification cards — Test methods —
Part 6:
Proximity cards
AMENDMENT 1: Additional PICC classes
Cartes d'identification — Méthodes d'essai —
Partie 6: Cartes de proximité
AMENDEMENT 1: Classes addtionnelles de PICC




Reference number
ISO/IEC 10373-6:2011/Amd.1:2012(E)
©
ISO/IEC 2012

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ISO/IEC 10373-6:2011/Amd.1:2012(E)

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©  ISO/IEC 2012
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means,
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Published in Switzerland

ii © ISO/IEC 2012 – All rights reserved

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ISO/IEC 10373-6:2011/Amd.1:2012(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are members of
ISO or IEC participate in the development of International Standards through technical committees
established by the respective organization to deal with particular fields of technical activity. ISO and IEC
technical committees collaborate in fields of mutual interest. Other international organizations, governmental
and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information
technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of the joint technical committee is to prepare International Standards. Draft International
Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as
an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
Amendment 1 to ISO/IEC 10373-6:2011 was prepared by Joint Technical Committee
ISO/IEC JTC 1, Information technology, Subcommittee SC 17, Cards and personal identification.

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ISO/IEC 10373-6:2011/Amd.1:2012(E)

Identification cards — Test methods —
Part 6:
Proximity cards
AMENDMENT 1: Additional PICC classes
Page 2, 3.1
Add the following term and definition, and renumber all subsequent definitions:
3.1.5
loading effect
change in PCD antenna current caused by the presence of PICC(s) in the field due to the mutual coupling
modifying the PCD antenna resonance and quality factor

Page 5, 3.2
Add the following symbol between UT_APDU and WUPB(N):
V DC voltage measured at connector CON3 of the Reference PICC
load

Page 6, 5.2
Replace 5.2 and its subclauses by the following:
5.2 Calibration coils
This clause defines the size, thickness and characteristics of the calibration coils 1 and 2.
Calibration coil 1 shall be used only in test PCD assembly 1 and calibration coil 2 shall be used only in test
PCD assembly 2.
5.2.1 Size of the calibration coil card
The calibration coil card shall consist of an area which has the height and width of an ID-1 type defined in
ISO/IEC 7810:2003 containing a single turn coil concentric with the card outline (see Figure 1).
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ISO/IEC 10373-6:2011/Amd.1:2012(E)

Figure 1 — Calibration coils 1 and 2
5.2.2 Thickness and material of the calibration coil card
The thickness of the calibration coil card shall be less than that of an ID-1 card. It shall be constructed of a
suitable insulating material.
5.2.3 Coil characteristics
The coil on the calibration coil card shall have one turn. Relative dimensional tolerance shall be ± 2 %.
The outer size of the calibration coil 1 shall be 72 mm × 42 mm with corner radius 5 mm.
2
NOTE 1 The area over which the field is integrated is approximately 3000 mm .
NOTE 2 At 13,56 MHz the approximate inductance is 250 nH and the approximate resistance is 0,4 Ω.
The open circuit calibration factor for the calibration coil 1 is 0,318 V (rms) per A/m (rms) [Equivalent to
900 mV (peak-to-peak) per A/m (rms)].
The outer size of the calibration coil 2 shall be 47 mm × 24 mm with corner radius 2 mm.
2
NOTE 3 The area over which the field is integrated is approximately 1100 mm .
NOTE 4 At 13,56 MHz the approximate inductance is 140 nH and the approximate resistance is 0,3 Ω.
The open circuit calibration factor for the calibration coil 2 is 0,118 V (rms) per A/m (rms) [Equivalent to
333 mV (peak-to-peak) per A/m (rms)].
The coil shall be made as a printed coil on printed circuit board (PCB) plated with 35 µm copper. Track width
shall be 500 µm with a relative tolerance of ± 20 %. The size of the connection pads shall be
1,5 mm × 1,5 mm.
A high impedance oscilloscope probe with an input admittance equivalent to a parallel capacitance C < 14 pF
p
and a parallel resistance R > 9 kΩ at 13,56 MHz shall be used to measure the (open circuit) voltage induced
p
in the coil.
NOTE 5 The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 mm
or coaxial connection.

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ISO/IEC 10373-6:2011/Amd.1:2012(E)
Page 7, 5.3
Replace 5.3 and its subclauses by the following:
5.3 Test PCD assembly
Two test PCD assemblies are defined:
 Test PCD assembly 1 for PICCs of classes 1, 2 and 3 and for PICCs which do not claim compliance with
a class;
 Test PCD assembly 2 for PICCs of classes 4, 5 and 6.
Each test PCD assembly shall consist of a circular test PCD antenna and two parallel sense coils: sense coil a
and sense coil b. The test set-up is shown in Figure 2. The sense coils shall be connected such that the signal
from one coil is in opposite phase to the other. The 10 Ωpotentiometer P1 serves to fine adjust the balance
point when the sense coils are not loaded by a PICC or any magnetically coupled circuit. The capacitive load
of the probe including its parasitic capacitance shall be less than 14 pF.
NOTE 1 The capacitance of the connections and of the oscilloscope probe should be kept to a minimum for
reproducibility.
NOTE 2 In order to avoid any unintended misalignment in case of an unsymmetrical set-up the tuning range of the
potentiometer P1 is only 10 Ω. If the set-up cannot be compensated by the 10 Ω potentiometer P1 the overall symmetry of
the set-up should be checked.
NOTE 3 The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 mm
or coaxial connection.

Sense coil a
+
+
−−
240 
 1 %
Identical length twisted
pairs or coaxial cables
P1
of less than100 mm
10 
Sense coil b
240 
Probe
 1 %
+
+
− −
to
oscilloscope
Test PCD
antenna

Figure 2 — Test set-up (principle)
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ISO/IEC 10373-6:2011/Amd.1:2012(E)
5.3.1 Test PCD antenna
In test PCD assembly 1 the test PCD antenna 1 shall have a diameter of 150 mm.
In test PCD assembly 2 the test PCD antenna 2 shall have a diameter of 100 mm.
Each test PCD antenna construction shall conform to the corresponding drawings in Annex A.
The matching of each test PCD antenna should be accomplished by using an impedance analyzer or a
network analyzer or an LCR meter. If either an impedance analyzer or a network analyzer or an LCR meter is
not available, then the matching may be accomplished with the procedure given in Annex B.
5.3.2 Sense coils
In test PCD assembly 1 the size of the sense coils 1 shall be 100 mm × 70 mm with corner radius 10 mm.
In test PCD assembly 2 the size of the sense coils 2 shall be 60 mm × 47 mm with corner radius 10 mm.
Each sense coil construction shall conform to the corresponding drawings in Annex C.
5.3.3 Assembly of Test PCD
The sense coils 1 and test PCD antenna 1 shall be assembled parallel and with the sense and antenna coils
coaxial and such that the distance between the active conductors is 37,5 mm as shown in Figure 3.
The sense coils 2 and test PCD antenna 2 shall be assembled parallel and with the sense and antenna coils
coaxial and such that the distance between the active conductors is 23 mm as shown in Figure 3.
The dimensional tolerance shall be better than ± 0,5 mm. The distance between the coil in the DUT and the
calibration coil shall be equal with respect to the coil of the test PCD antenna.
NOTE These distances are chosen to offer a strong and homogenous magnetic field in the DUT position.
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ISO/IEC 10373-6:2011/Amd.1:2012(E)

Figure 3 — Test PCD assembly 1 and test PCD assembly 2

Page 10, 5.4.2
Replace the first paragraph with the following:
“The Reference PICCs coils layouts are defined in Annex D. If connectors are used between the coils and the
circuitry, those connectors shall have minimal, if any, effect on the RF measurements.”

Page 11, 5.4.3
Replace “6 V” by “V ” in steps f), g) and i) and in NOTE.
load

Page 12, 6.2.1.2
Replace step a) with the following:
a) Adjust the RF power delivered by the signal generator to the test PCD antenna to a field strength of the
average level specified in ISO/IEC 14443-1:2008, 4.4 as measured by the calibration coil.
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ISO/IEC 10373-6:2011/Amd.1:2012(E)
Page 13 of ISO/IEC 10373-6:2011, 6.2.1.2
Replace step d) with the following:
d) Adjust the RF power delivered by the signal generator to the test PCD antenna to a field strength of the
maximum level specified in ISO/IEC 14443-1:2008, 4.4 as measured by the calibration coil.

Page 13, 6.2.1.2
Replace step f) with the following:
f) Apply for 5 min an ASK 100 % modulation to this field with the following duty cycle:
 5 s at 0 A/m (rms);
 25 s at the maximum level specified in ISO/IEC 14443-1:2008, 4.4.

Page 14, 7.1
Replace the first sentence with the following paragraphs, table and note:
“All the PCD tests described below will be done in the operating volumes as defined by the PCD manufacturer
for each supported class.
All PCD tests of ISO/IEC 14443-2 parameters shall be performed using Reference PICCs 1, 2 and 3 and
optionally other Reference PICCs corresponding to the optional classes supported by the PCD, with the
relevant parameters and test PCD assembly as defined in Table 3.
Table 3 — Classes parameters
Class Reference PICC V R2 R2 Test PCD assembly
load min max
1 1 6 V 870 Ω 1070 Ω Test PCD assembly 1
2 2 4,5 V 1030 Ω 1260 Ω Test PCD assembly 1
3 3 4,5 V 1080 Ω 1320 Ω Test PCD assembly 1
4 4 4,5 V 990 Ω 1210 Ω Test PCD assembly 2
5 5 4,5 V 960 Ω 1170 Ω Test PCD assembly 2
6 6 4,5 V 900 Ω 1100 Ω Test PCD assembly 2

NOTE V may be harmonized to 4,5 V for all classes in future revisions of ISO/IEC 10373-6.”
load

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ISO/IEC 10373-6:2011/Amd.1:2012(E)
Page 15, 7.1.1
Add the following paragraph at the end of the subclause:
“The maximum and minimum field strength values to be used with each Reference PICC are given in
1)
ISO/IEC 14443-2:2010/Amd.2:— , Table 1.”

Page 15, 7.1.1.2
Replace items a) to d) in the Procedure for H test with the following:
min
a) Tune the Reference PICC to 13,56 MHz as described in 5.4.3.
b) Place the Reference PICC into the DUT position on the Test PCD assembly producing the H operating
min
condition on the calibration coil. Check that the jumper J1 is set to position 'b' and that a DC voltage of
V as defined in Table 3 is measured at connector CON3. Alternatively, the jumper J1 may be set to
load
position 'c' and the voltage on CON2 is adjusted to obtain a DC voltage of V as defined in Table 3 at
load
connector CON3. In both cases, the operating field condition shall be verified by monitoring the voltage
on the calibration coil and adjusted if necessary.
WARNING — R2 value should be between R2 and R2 as defined in Table 3Check this range
min max
at least once before using the alternative method.
c) Position the Reference PICC within the defined operating volume of the PCD under test. The DC voltage
at CON3 shall exceed V as defined in Table 3.
load

Page 15, 7.1.1.3
Replace the paragraph with the following:
“The test report shall confirm the operating volume in which the DC voltage measured at CON3 for R2 or
variable load resistor adjusted to H and H field strength fulfils the requirements defined in steps d) of the
min max
two procedures of 7.1.1.2.”

Page 15, 7.1.2
Delete 7.1.2 and its subclauses.

Page 16, 7.1.3
Delete 7.1.3 and its subclauses.


1)
To be
...