ISO/IEC 10373-6:2016
(Main)Identification cards — Test methods — Part 6: Proximity cards
Identification cards — Test methods — Part 6: Proximity cards
ISO/IEC 10373-6:2016 defines test methods for characteristics of identification cards according to the definition given in ISO/IEC 7810. Each test method is cross‑referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the supplementary standards that define the information storage technologies employed in identification card applications. NOTE 1 Criteria for acceptability do not form part of ISO/IEC 10373-6 :2016, but will be found in the International Standards mentioned above. NOTE 2 Test methods defined in ISO/IEC 10373-6 :2016 are intended to be performed separately. A given proximity card or object, or proximity coupling device, is not required to pass through all the tests sequentially. ISO/IEC 10373-6:2016 defines test methods which are specific to proximity cards and objects, and proximity coupling devices and proximity extended devices, defined in ISO/IEC 14443‑1, ISO/IEC 14443‑2, ISO/IEC 14443‑3, and ISO/IEC 14443‑4. ISO/IEC 10373‑1 defines test methods which are common to one or more integrated circuit card technologies and other parts deal with other technology‑specific tests.
Cartes d'identification — Méthodes d'essai — Partie 6: Cartes de proximité
General Information
Relations
Standards Content (Sample)
INTERNATIONAL ISO/IEC
STANDARD 10373-6
Third edition
2016-07-15
Identification cards — Test
methods —
Part 6:
Proximity cards
Cartes d’identification — Méthodes d’essai —
Partie 6: Cartes de proximité
Reference number
ISO/IEC 10373-6:2016(E)
©
ISO/IEC 2016
---------------------- Page: 1 ----------------------
ISO/IEC 10373-6:2016(E)
COPYRIGHT PROTECTED DOCUMENT
© ISO/IEC 2016, Published in Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form
or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior
written permission. Permission can be requested from either ISO at the address below or ISO’s member body in the country of
the requester.
ISO copyright office
Ch. de Blandonnet 8 • CP 401
CH-1214 Vernier, Geneva, Switzerland
Tel. +41 22 749 01 11
Fax +41 22 749 09 47
copyright@iso.org
www.iso.org
ii © ISO/IEC 2016 – All rights reserved
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ISO/IEC 10373-6:2016(E)
Contents Page
Foreword. v
1 Scope . 1
2 Normative references . 1
3 Terms, definitions, symbols and abbreviated terms . 2
3.1 Terms and definitions . 2
3.2 Symbols and abbreviated terms . 3
4 Default items applicable to the test methods . 5
4.1 Test environment . 5
4.2 Pre-conditioning . 5
4.3 Default tolerance . 5
4.4 Spurious inductance . 6
4.5 Total measurement uncertainty . 6
5 Apparatus and circuits for test of ISO/IEC 14443-1 and ISO/IEC 14443-2 parameters . 6
5.1 Minimum requirements for measurement instruments . 6
5.1.1 Oscilloscope . 6
5.2 Calibration coils . 6
5.2.1 Size of the calibration coil card . 6
5.2.2 Thickness and material of the calibration coil card . 7
5.2.3 Coil characteristics . 7
5.3 Test PCD assembly . 7
5.3.1 Test PCD antenna . 8
5.3.2 Sense coils . 9
5.3.3 Assembly of Test PCD . 9
5.4 Reference PICC . 10
5.4.1 Dimensions of the Reference PICC . 10
5.4.2 Reference PICC construction . 10
5.4.3 Reference PICC resonance frequency tuning . 12
5.5 EMD test setup . 13
5.5.1 General description . 13
5.5.2 Computation of power versus time . 13
5.5.3 Noise floor precondition test . 14
6 Test of ISO/IEC 14443-1 parameters . 14
6.1 PCD tests . 14
6.1.1 Alternating magnetic field . 14
6.2 PICC tests . 15
6.2.1 Alternating magnetic field . 15
6.2.2 Static electricity test . 16
6.3 PXD tests . 17
7 Test of ISO/IEC 14443-2 parameters . 18
7.1 PCD tests . 18
7.1.1 PCD field strength . 18
7.1.2 Void . 19
7.1.3 Void . 19
7.1.4 Modulation index and waveform . 19
7.1.5 Load modulation reception . 20
7.1.6 PCD EMD immunity test . 21
7.1.7 PCD EMD recovery test . 22
7.2 PICC tests . 23
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ISO/IEC 10373-6:2016(E)
7.2.1 PICC transmission . 23
7.2.2 PICC EMD level and low EMD time test . 25
7.2.3 PICC reception . 26
7.2.4 PICC resonance frequency (informative) . 27
7.2.5 PICC maximum loading effect . 28
7.3 Test methods for bit rates of 3fc/4, fc, 3fc/2 and 2fc from PCD to PICC . 29
7.4 PXD tests . 29
8 Test of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters . 29
8.1 PCD tests . 29
8.2 PICC tests . 29
8.3 PXD tests . 29
8.3.1 PCD and PICC Modes . 29
8.3.2 Automatic mode alternation . 29
Annex A (normative) Test PCD antennas . 34
Annex B (informative) Test PCD Antenna tuning . 43
Annex C (normative) Sense coil . 45
Annex D (normative) Reference PICCs . 48
Annex E (normative) Modulation index and waveform analysis tool . 56
Annex F (informative) Program for the evaluation of the spectrum . 111
Annex G (normative) Additional PICC test methods . 117
Annex H (normative) Additional PCD test methods . 179
Annex I (normative) High bit rate selection test methods for PCD . 218
Annex J (informative) Program for EMD level measurements . 232
Annex K (normative) Test methods for bit rates of 3fc/4, fc, 3fc/2 and 2fc from PCD to PICC . 245
Annex L (normative) Frame with error correction test methods . 331
Bibliography . 340
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ISO/IEC 10373-6:2016(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are
members of ISO or IEC participate in the development of International Standards through technical
committees established by the respective organization to deal with particular fields of technical activity.
ISO and IEC technical committees collaborate in fields of mutual interest. Other international
organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the
work. In the field of information technology, ISO and IEC have established a joint technical committee,
ISO/IEC JTC 1.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the
different types of document should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent
rights. Details of any patent rights identified during the development of the document will be in the
Introduction and/or on the ISO list of patent declarations received (see www.iso.org/patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation on the meaning of ISO specific terms and expressions related to conformity
assessment, as well as information about ISO's adherence to the WTO principles in the Technical
Barriers to Trade (TBT) see the following URL: Foreword - Supplementary information
The committee responsible for this document is ISO/IEC JTC 1, Information technology, Subcommittee
SC 17, Cards and personal identification.
This third edition cancels and replaces the second edition (ISO/IEC 10373-6:2011), which has been
technically revised.
It also incorporates the Amendments ISO/IEC 10373-6:2011/Amd 1:2012, ISO/IEC 10373-6:2011/Amd
2:2012, ISO/IEC 10373-6:2011/Amd 3:2012, ISO/IEC 10373-6:2011/Amd 4:2012, and the Technical
Corrigendum ISO/IEC 10373-6:2011/Cor 1:2013.
ISO/IEC 10373 consists of the following parts, under the general title Identification cards — Test
methods:
— Part 1: General characteristics
— Part 2: Cards with magnetic stripes
— Part 3: Integrated circuit cards with contacts and related interface devices
— Part 5: Optical memory cards
— Part 6: Proximity cards
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ISO/IEC 10373-6:2016(E)
— Part 7: Vicinity cards
— Part 8: USB-ICC
— Part 9: Optical memory cards — Holographic recording method
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INTERNATIONAL STANDARD ISO/IEC 10373-6:2016(E)
Identification cards — Test methods — Part 6: Proximity cards
1 Scope
ISO/IEC 10373 defines test methods for characteristics of identification cards according to the definition
given in ISO/IEC 7810. Each test method is cross-referenced to one or more base standards, which can be
ISO/IEC 7810 or one or more of the supplementary standards that define the information storage
technologies employed in identification card applications.
NOTE 1 Criteria for acceptability do not form part of ISO/IEC 10373, but will be found in the International
Standards mentioned above.
NOTE 2 Test methods defined in this part of ISO/IEC 10373 are intended to be performed separately. A given
proximity card or object, or proximity coupling device, is not required to pass through all the tests sequentially.
This part of ISO/IEC 10373 defines test methods which are specific to proximity cards and objects, and
proximity coupling devices and proximity extended devices, defined in ISO/IEC 14443-1,
ISO/IEC 14443-2, ISO/IEC 14443-3, and ISO/IEC 14443-4.
ISO/IEC 10373-1 defines test methods which are common to one or more integrated circuit card
technologies and other parts deal with other technology-specific tests.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
ISO/IEC 7810, Identification cards — Physical characteristics
ISO/IEC 14443-1:2016, Identification cards — Contactless integrated circuit cards — Proximity cards —
Part 1: Physical characteristics
ISO/IEC 14443-2:2016, Identification cards — Contactless integrated circuit cards — Proximity cards —
Part 2: Radio frequency power and signal interface
ISO/IEC 14443-3:2016, Identification cards — Contactless integrated circuit cards — Proximity cards —
Part 3: Initialization and anticollision
ISO/IEC 14443-4:2016, Identification cards — Contactless integrated circuit cards — Proximity cards —
Part 4: Transmission protocol
IEC 61000-4-2:2008, Electromagnetic compatibility (EMC) — Part 4-2: Testing and measurement
techniques — Electrostatic discharge immunity test
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ISO/IEC 10373-6:2016(E)
3 Terms, definitions, symbols and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO/IEC 14443-1, ISO/IEC 14443-2,
ISO/IEC 14443-3, and ISO/IEC 14443-4, and the following apply.
NOTE Elements in bold square brackets [ ] are optional definitions.
3.1.1
base standard
standard which the test method is used to verify conformance to
3.1.2
CascadeLevels
number of cascade levels of the PICC
3.1.3
Command Set
set describing the PICC commands during initialization and anticollision
Note 1 to entry: See ISO/IEC 14443-3:2016, 6.4 for PICC Type A and ISO/IEC 14443-3:2016, 7.5 for PICC Type B.
3.1.4
loading effect
change in PCD antenna current caused by the presence of PICC(s) in the field due to the mutual coupling
modifying the PCD antenna resonance and quality factor
3.1.5
mute
no response within a specified timeout, e.g. expiration of FWT
3.1.6
PICC states
different PICC states during initialization and anticollision
Note 1 to entry: See ISO/IEC 14443-3:2016, 6.3 for PICC Type A and ISO/IEC 14443-3:2016, 7.4 for PICC Type B.
3.1.7
scenario
defined typical protocol and application specific communication to be used with the test methods defined
in this part of ISO/IEC 10373
3.1.8
Test Initial State
TIS
element from PICC states that is the PICC state before performing a specific PICC command from
Command Set
3.1.9
test method
method for testing characteristics of identification cards for the purpose of confirming their compliance
with International Standards
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ISO/IEC 10373-6:2016(E)
3.1.10
Test Target State
TTS
element from PICC states that is the PICC state after performing a specific PICC command from Command
Set
3.2 Symbols and abbreviated terms
(xxxxx)b Data bit representations
'XY' Hexadecimal notation, equal to XY in base 16
ATA(cid) Answer to ATTRIB, i.e. (mbli+cid CRC_B), with mbli an arbitrary hex
value (see ISO/IEC 14443-3:2016, 7.11)
ATTRIB(cid, fsdi) Default ATTRIB command with PUPI from ATQB, CID = cid and
Maximum Frame Size Code value = fsdi, i.e. ('1D' PUPI cid fsdi '01 00'
CRC_B)
DUT Device under test
ESD Electrostatic Discharge
I(c) (inf [,CID = cid] ISO/IEC 14443-4 I-block with chaining bit c∈{1,0}, block number
n
[,NAD = nad] [,~CRC]) n∈{1,0} and information field inf. By default no CID and no NAD will be
transmitted. If CID = cid∈{0.15} is specified, it will be transmitted as
second parameter. If NAD = nad∈{0.'FF'} is specified, it will be
transmitted as third parameter (or second parameter if no CID is
transmitted). If the literal '~CRC' is not specified, a valid CRC
corresponding to the type of the PICC will be transmitted by default (i.e.
CRC_A or CRC_B)
IUT Implementation Under Test (ISO/IEC 9646); within the scope of this
part of ISO/IEC 10373, IUT represents the PCD under the test
LT Lower Tester (ISO/IEC 9646), the PICC-emulation part of the PCD-test-
apparatus
m Modulation index
Mute No response within a specified timeout
N/A Not applicable
PPS(cid, dri, dsi) Default PPS request with CID = cid, DRI = dri and DSI = dsi,
i.e. ('D' + cid '11' dsi × 4 + dri CRC_A)
R(ACK [,CID = cid] [,~CRC]) ISO/IEC 14443-4 R(ACK) block with block number n. The definition of
n
the optional CID and ~CRC symbols is as described in the I(c) block
n
above
R(NAK [,CID = cid][,~CRC]) ISO/IEC 14443-4 R(NAK) block with block number n. The definition of
n
the optional CID and ~CRC symbols is as described in the I(c) block
n
above
RATS(cid, fsdi) Default RATS command with CID = cid and FSDI value = fsdi
i.e. ('E0' fsdi × 16 + cid CRC_A)
READY(I) READY state in cascade level I, I ∈ {1, 2, 3}; e.g. READY(2) is a PICC
cascade level 2
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ISO/IEC 10373-6:2016(E)
READY*(I) READY* state in cascade level I, I ∈ {1, 2, 3}; e.g. READY*(2) is a PICC
cascade level 2
REQB(N) REQB command with N as defined in ISO/IEC 14443-3:2016, 7.7
S(WTX)(WTXM ISO/IEC 14443-4 S(WTX) block with parameter WTXM. The definition
[,CID = cid][,~CRC]) of the optional CID and ~CRC symbols is as described in the I(c) block
n
above
S(DESELECT [,CID = cid] ISO/IEC 14443-4 S(DESELECT) block. The definition of the optional CID
[,~CRC]) and ~CRC symbols is as described in the I(c) block above
n
SAK(cascade) the SELECT(I) answer with the cascade bit (bit 3) set to (1)b
SAK(complete) the SELECT(I) answer with the cascade bit (bit 3) set to (0)b
SEL(c) Select code of level c (i.e. SEL(1) = '93', SEL(2) = '95', SEL(3) = '97')
SELECT(I) SELECT command of cascade level I, i.e.
SELECT(1) = ( '93 70' UIDTX BCC CRC_A)
1
SELECT(2) = ( '95 70' UIDTX BCC CRC_A)
2
SELECT(3) = ( '97 70' UIDTX BCC CRC_A)
3
SLOTMARKER(n) Slot-MARKER command with slot number n, i.e. (16 × (n − 1) + 5 CRC_B)
TB-PDU Transmission Block Protocol Data Unit, which consists of either I-block,
R-block or S-block
TEST_COMMAND1(1) Default test command consisting of one unchained I-block
NOTE This command depends on the negotiated maximum frame size
value of the PICC.
TEST_COMMAND1(n), n > 1 Default test command consisting of n chained I-blocks (PCD chaining)
NOTE This command depends on the negotiated maximum frame size
value of the PICC.
TEST_COMMAND1(n) INF field of k'th I-block chain of TEST_COMMAND1(n)
k
NOTE This command depends on the negotiated maximum frame size
value of the PICC.
TEST_COMMAND2(n), n > 1 Default test command which expects a response consisting of n chained
I-blocks
NOTE This command depends on the negotiated maximum frame size
value of the PCD.
TEST_COMMAND3 Default test command consisting of one I-block which needs more than
FWT time for execution
TEST_RESPONSE1(n) INF field of the response to TEST_COMMAND1(n)
NOTE This response is assumed to be always unchained.
TEST_RESPONSE2(n) Response to TEST_COMMAND2(n)
NOTE This response depends on the negotiated maximum frame size
value of the PCD.
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ISO/IEC 10373-6:2016(E)
TEST_RESPONSE2(n) INF field of k'th I-block chain of TEST_RESPONSE2(n)
k
NOTE This response depends on the negotiated maximum frame size
value of the PCD.
TEST_RESPONSE3 Response I-block to TEST_COMMAND3
NOTE This response is always assumed to be unchained.
TM-PDU Test Management Protocol Data Unit (ISO/IEC 9646-1, PDU)
t Start of PICC transmission
START
UIDTX Transmitted UID 32-bit data at cascade level I (see Table 1)
I
UT Upper Tester (ISO/IEC 9646), the master part of the PCD-test-apparatus
UT_APDU Upper Tester Application Protocol Data Unit: a packet of data to be sent
by the PCD to the LT through the RF interface
V DC voltage measured at connector CON3 of the Reference PICC
load
WUPB(N) WUPB command with N as defined in ISO/IEC 14443-3:2016, 7.7
~X Bit sequence consisting of the inverted bits of bit sequence X or any
other bit sequence different from X
X[[a.b]] Bit subsequence of bit sequence X consisting of the bits between
position a and b included. If a > b then the sequence is empty
X[[n]] Bit at position n of bit sequence X. First bit is at position 1
X[n] Byte at position n of bit sequence X. First byte is at position 1
(i.e. X[n] = X[[(n − 1) × 8 + 1.n × 8]])
Table 1 — Mapping from UID to UIDTX
Cascade level Single UID PICC Double UID PICC Triple UID PICC
UIDTX1 UID0 UID1 UID2 UID3 '88' UID0 UID1 UID2 '88' UID0 UID1 UID2
UIDTX2 — UID3 UID4 UID5 UID6 '88' UID3 UID4 UID5
UIDTX — — UID6 UID7 UID8 UID9
3
4 Default items applicable to the test methods
4.1 Test environment
Unless otherwise specified, testing shall take place in an environment of temperature 23 °C ± 3 °C
(73 °F ± 5 °F) and of relative humidity 40 % to 60 %.
4.2 Pre-conditioning
No environmental pre-conditioning of PICCs or PCDs is required by the test methods in this part of
ISO/IEC 10373.
4.3 Default tolerance
Unless otherwise specified, a default tolerance of ±5 % shall be applied to the quantity values given to
specify the characteristics of the test equipment (e.g. linear dimensions) and the test method procedures
(e.g. test equipment adjustments).
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ISO/IEC 10373-6:2016(E)
4.4 Spurious inductance
Resistors and capacitors should have negligible inductance.
4.5 Total measurement uncertainty
The total measurement uncertainty for each quantity determined by these test methods shall be stated in
the test report.
Basic information is given in ISO/IEC Guide 98-3.
5 Apparatus and circuits for test of ISO/IEC 14443-1 and ISO/IEC 14443-2
parameters
This Clause defines the test apparatus and test circuits for verifying the operation of a PICC or a PCD
according to ISO/IEC 14443-1 and ISO/IEC 14443-2. The test apparatus includes the following:
— measurement instruments (see 5.1);
— calibration coil (see 5.2);
— Test PCD assembly (see 5.3);
— Reference PICC (see 5.4);
— EMD test setup (see 5.5).
These are described in the following clauses.
5.1 Minimum requirements for measurement instruments
5.1.1 Oscilloscope
The digital sampling oscilloscope shall be capable of sampling at a rate of at least 500 million samples per
second with a resolution of at least 8 bits at optimum scaling and shall have an overall minimum
bandwidth of 250 MHz. The oscilloscope should have the capability to output the sampled data as a text
file to facilitate mathematical and other operations such as windowing on the sampled data using
software programs (see Annex E and Annex F).
NOTE The overall bandwidth is the combination of oscilloscope and probing system bandwidth.
5.2 Calibration coils
This subclause defines the size, thickness and characteristics of the calibration coils 1 and 2.
Calibration coil 1 shall be used only in Test PCD assembly 1 and calibration coil 2 shall be used only in
Test PCD assembly 2.
5.2.1 Size of the calibration coil card
The calibration coil card shall consist of an area which has the height and widt
...
FINAL
INTERNATIONAL ISO/IEC
DRAFT
STANDARD FDIS
10373-6
ISO/IEC JTC 1/SC 17
Identification cards — Test
Secretariat: BSI
methods —
Voting begins on:
2016-03-03
Part 6:
Voting terminates on:
Proximity cards
2016-05-03
Cartes d’identification — Méthodes d’essai —
Partie 6: Cartes de proximité
RECIPIENTS OF THIS DRAFT ARE INVITED TO
SUBMIT, WITH THEIR COMMENTS, NOTIFICATION
OF ANY RELEVANT PATENT RIGHTS OF WHICH
THEY ARE AWARE AND TO PROVIDE SUPPOR TING
DOCUMENTATION.
IN ADDITION TO THEIR EVALUATION AS
Reference number
BEING ACCEPTABLE FOR INDUSTRIAL, TECHNO-
ISO/IEC FDIS 10373-6:2016(E)
LOGICAL, COMMERCIAL AND USER PURPOSES,
DRAFT INTERNATIONAL STANDARDS MAY ON
OCCASION HAVE TO BE CONSIDERED IN THE
LIGHT OF THEIR POTENTIAL TO BECOME STAN-
DARDS TO WHICH REFERENCE MAY BE MADE IN
©
NATIONAL REGULATIONS. ISO/IEC 2016
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ISO/IEC FDIS 10373-6:2016(E)
COPYRIGHT PROTECTED DOCUMENT
© ISO/IEC 2016, Published in Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form
or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior
written permission. Permission can be requested from either ISO at the address below or ISO’s member body in the country of
the requester.
ISO copyright office
Ch. de Blandonnet 8 • CP 401
CH-1214 Vernier, Geneva, Switzerland
Tel. +41 22 749 01 11
Fax +41 22 749 09 47
copyright@iso.org
www.iso.org
ii © ISO/IEC 2016 – All rights reserved
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Error! Reference source not found.
Contents
1 Scope . Error! Bookmark not defined.
2 Normative references . Error! Bookmark not defined.
3 Terms, definitions, symbols and abbreviated terms . 2
3.1 Terms and definitions . 2
3.2 Symbols and abbreviated terms . 3
4 Default items applicable to the test methods . 5
4.1 Test environment . 5
4.2 Pre-conditioning . 5
4.3 Default tolerance . 5
4.4 Spurious inductance . 6
4.5 Total measurement uncertainty . 6
5 Apparatus and circuits for test of ISO/IEC 14443-1 and ISO/IEC 14443-2 parameters . 6
5.1 Minimum requirements for measurement instruments . 6
5.1.1 Oscilloscope . 6
5.2 Calibration coils . 6
5.2.1 Size of the calibration coil card . 6
5.2.2 Thickness and material of the calibration coil card . 7
5.2.3 Coil characteristics . 7
5.3 Test PCD assembly . 8
5.3.1 Test PCD antenna . 8
5.3.2 Sense coils . 9
5.3.3 Assembly of Test PCD . 9
5.4 Reference PICC . 10
5.4.1 Dimensions of the Reference PICC . 10
5.4.2 Reference PICC construction . 11
5.4.3 Reference PICC resonance frequency tuning . 12
5.5 EMD test setup . 13
5.5.1 General description . 13
5.5.2 Computation of power versus time . 13
5.5.3 Noise floor precondition test . 14
6 Test of ISO/IEC 14443-1 parameters . 15
6.1 PCD tests . 15
6.1.1 Alternating magnetic field . 15
6.2 PICC tests . 15
6.2.1 Alternating magnetic field . 15
6.2.2 Static electricity test . 16
6.3 PXD tests . 18
7 Test of ISO/IEC 14443-2 parameters . 18
7.1 PCD tests . 18
7.1.1 PCD field strength . 18
7.1.2 Void . 19
7.1.3 Void . 19
7.1.4 Modulation index and waveform . 19
7.1.5 Load modulation reception . 20
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Error! Reference source not found.
7.1.6 PCD EMD immunity test . 21
7.1.7 PCD EMD recovery test . 22
7.2 PICC tests . 24
7.2.1 PICC transmission . 24
7.2.2 PICC EMD level and low EMD time test . 25
7.2.3 PICC reception . 26
7.2.4 PICC resonance frequency (informative) . 28
7.2.5 PICC maximum loading effect . 28
7.3 Test methods for bit rates of 3fc/4, fc, 3fc/2 and 2fc from PCD to PICC . 29
7.4 PXD tests . 29
8 Test of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters . 29
8.1 PCD tests . 29
8.2 PICC tests . 30
8.3 PXD tests . 30
8.3.1 PCD and PICC Modes . 30
8.3.2 Automatic mode alternation . 30
Annex A (normative) Test PCD antennas . 35
A.1 Test PCD antenna 1 layout including impedance matching network . 35
A.2 Impedance matching network . 38
A.2.1 Impedance matching network for a bit rate of fc/128. 39
A.2.2 Impedance matching network for bit rates higher than fc/128 . 40
A.3 Test PCD antenna 2 . 40
A.3.1 Test PCD antenna 2 layout including impedance matching network . 40
A.3.2 Impedance matching network 2 . 43
Annex B (informative) Test PCD Antenna tuning . 44
Annex C (normative) Sense coil . 46
C.1 Sense coil layout . 46
C.1.1 Sense coil 1 layout . 46
C.1.2 Sense coil 2 layout . 47
C.2 Sense coil assembly . 49
Annex D (normative) Reference PICCs . 50
D.1 Reference PICC 1 coil layouts . 50
D.2 Reference PICC 2 coil layouts . 51
D.3 Reference PICC 3 coil layouts . 52
D.4 Reference PICC 4 coil layouts . 53
D.5 Reference PICC 5 coil layouts . 54
D.6 Reference PICC 6 coil layouts . 55
Annex E (normative) Modulation index and waveform analysis tool . 56
E.1 Overview . 56
E.2 Sampling . 57
E.2.1 Sampling for bit rates of fc/128, fc/64, fc/32 and fc/16 . 57
E.2.2 Sampling for bit rates of fc/8, fc/4 and fc/2 . 57
E.3 Filtering . 58
E.3.1 Filtering for bit rates of fc/128, fc/64, fc/32 and fc/16 . 58
E.3.2 Filtering for bit rates of fc/8, fc/4 and fc/2 . 59
E.4 Envelope generation . 59
E.5 Envelope smoothing . 59
E.5.1 Envelope smoothing for bit rates of fc/128, fc/64, fc/32 and fc/16 . 59
E.5.2 Envelope smoothing for bit rates of fc/8, fc/4 and fc/2 . 60
E.6 Modulation index determination . 60
E.7 Timing determination . 61
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E.8 Overshoot and undershoot determination . 61
E.9 Program of the modulation index and waveform analysis tool (informative) . 61
E.9.1 structures.h . 61
E.9.2 fftrm.h . 62
E.9.3 fftrm.c . 63
E.9.4 hilbert.h . 67
E.9.5 hilbert.c . 67
E.9.6 functs.c . 75
Annex F (informative) Program for the evaluation of the spectrum . 112
Annex G (normative) Additional PICC test methods . 118
G.1 PICC-test-apparatus and accessories . 118
G.1.1 Emulating the I/O protocol . 118
G.1.2 Generating the I/O character timing in reception mode . 118
G.1.3 Measuring and monitoring the RF I/O protocol . 118
G.1.4 Protocol Analysis . 118
G.1.5 RFU fields and values . 118
G.1.6 Measuring timing . 119
G.2 General considerations . 119
G.2.1 Use of test commands (possible additional PICC responses) . 119
G.2.2 Relationship of test methods versus base standard requirement . 120
G.3 Test method for initialization of the PICC Type A . 121
G.3.1 Introduction . 121
G.3.2 Scenario G.1: Polling . 121
G.3.3 Testing of the PICC Type A state transitions . 122
G.3.4 Scenario G.13: Handling of Type A anticollision . 141
G.3.5 Handling of RATS . 142
G.3.6 Handling of PPS request . 143
G.3.7 Scenario G.20: Handling of FSD . 144
G.4 Test method for initialization of the PICC Type B . 144
G.4.1 Introduction . 144
G.4.2 Scenario G.21: Polling . 145
G.4.3 Scenario G.22: PICC Reception . 145
G.4.4 Testing of the PICC Type B state transitions . 146
G.4.5 Scenario G.28: Handling of Type B anticollision. 156
G.4.6 Handling of ATTRIB . 158
G.4.7 Scenario G.31: Handling of Maximum Frame Size . 159
G.5 Test methods for logical operation of the PICC Type A or Type B. 160
G.5.1 Introduction . 160
G.5.2 PICC reaction to ISO/IEC 14443-4 Scenarios . 160
G.5.3 Handling of PICC error detection . 167
G.5.4 PICC reaction on CID . 168
G.5.5 PICC reaction on NAD . 171
G.5.6 PICC reaction on S(PARAMETERS) blocks . 172
G.5.7 PICC supporting Type A and Type B . 173
G.6 Reported results . 174
Annex H (normative) Additional PCD test methods . 178
H.1 PCD-test-apparatus and accessories. 178
H.1.1 Test method . 178
H.1.2 PCD-test-apparatus structure . 178
H.1.3 PCD-test-apparatus interface . 179
H.1.4 Emulating the I/O protocol . 179
H.1.5 Generating the I/O character timing in transmission mode . 179
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H.1.6 Measuring and monitoring the RF I/O protocol . 180
H.1.7 Protocol analysis . 180
H.1.8 Protocol activation procedure . 180
H.1.9 Scenario . 181
H.1.10 UT, LT and PCD behavior . 181
H.1.11 Relationship of test methods versus base standard requirement . 182
H.2 Type A specific test methods . 183
H.2.1 Frame Delay Time PICC to PCD . 183
H.2.2 Request Guard Time . 183
H.2.3 Handling of bit collision during ATQA . 184
H.2.4 Handling of anticollision loop . 184
H.2.5 Handling of RATS and ATS . 189
H.2.6 Handling of PPS response. 191
H.2.7 Frame size selection mechanism . 191
H.2.8 Handling of Start-up Frame Guard Time . 192
H.2.9 Handling of the CID during activation by the PCD . 193
H.3 Type B specific test methods . 194
H.3.1 I/O transmission timing . 194
H.3.2 Frame size selection mechanism . 195
H.3.3 Handling of the CID during activation by the PCD . 196
H.4 Test method for logical operations of the PCD . 198
H.4.1 Handling of the polling loop . 198
H.4.2 Reaction of the PCD to request for waiting time extension . 198
H.4.3 Error detection and recovery . 201
H.4.4 Handling of NAD during chaining . 210
H.5 Continuous monitoring of packets sent by the PCD . 210
H.5.1 RFU fields . 211
H.5.2 RFU values . 211
H.5.3 R-block . 211
H.5.4 S-block . 211
H.5.5 PCB . 211
H.5.6 Type A initialization frames . 211
H.5.7 Apparatus . 211
H.5.8 Proc ed ure . 211
H.5.9 Test report .
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