ISO 11093-9:2019

Paper and board — Testing of cores — Part 9: Determination of flat crush resistance

This part of ISO 11093 specifies a method for the determination of the maximum flat crush resistance of wound paper and board cores. NOTE If the wall thickness of the core is less than 5 mm, the breaking point is not detectable.

Papier et carton — Essais des mandrins — Partie 9: Détermination de la résistance à l'écrasement à plat

General Information

• Status: Published
• Publication Date: 04-Mar-2019
• ICS: 85.060 - Paper and board
• Technical Committee: ISO/TC 6 - Paper, board and pulps
• Drafting Committee: ISO/TC 6/WG 7 - Cores for reels of paper
• Current Stage: 9060 - Close of review
• Start Date: 02-Sep-2029

Relations

• Revises: ISO 11093-9:2006 - Paper and board — Testing of cores — Part 9: Determination of flat crush resistance
• Effective Date: 16-Jun-2018

Standards Content (Sample)

INTERNATIONAL ISO
STANDARD 11093-9
Third edition
2019-03
Paper and board — Testing of cores —
Part 9:
Determination of flat crush resistance
Papier et carton — Essais des mandrins —
Partie 9: Détermination de la résistance à l'écrasement à plat
Reference number
ISO 11093-9:2019(E)
©
ISO 2019

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ISO 11093-9:2019(E)

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ii © ISO 2019 – All rights reserved

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ISO 11093-9:2019(E)

Contents Page
Foreword .iv
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 1
5 Apparatus . 2
6 Preparation . 2
6.1 Sampling . 2
6.2 Number of test pieces . 2
6.3 Size of test piece . 2
6.4 Conditioning . 2
7 Procedure. 2
8 Calculation . 3
9 Test report . 3
© ISO 2019 – All rights reserved iii

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ISO 11093-9:2019(E)

Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
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