ISO/IEC 22536:2005
(Main)Information technology — Telecommunications and information exchange between systems — Near Field Communication Interface and Protocol (NFCIP-1) — RF interface test methods
Information technology — Telecommunications and information exchange between systems — Near Field Communication Interface and Protocol (NFCIP-1) — RF interface test methods
ISO/IEC 22536:2005 is part of a suite of standards that specify tests for ISO/IEC 18092. It defines test methods for the RF-interface. ISO/IEC 22536:2005 specifies RF-test methods for NFC devices with antennas fitting within the rectangular area of 85 mm by 54 mm. This test standard, the first of two parts, specifies compliance tests for the RF interface of ISO/IEC 18092 devices. The companion test standard specifies protocol tests for ISO/IEC 18092. Ecma purposefully aligned this International Standard with ISO/IEC 10373-6 to allow testing laboratories to reuse equipment and expertise.
Technologies de l'information — Télécommunications et échange d'information entre systèmes — Interface et protocole de communication en champ proche (NFCIP-1) — Méthodes d'essai pour interface RF
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Standards Content (Sample)
INTERNATIONAL ISO/IEC
STANDARD 22536
First edition
2005-07-15
Information technology —
Telecommunications and information
exchange between systems — Near Field
Communication Interface and Protocol
(NFCIP-1) — RF interface test methods
Technologies de l'information — Télécommunications et échange
d'information entre systèmes — Interface et protocole de
communication en champ proche (NFCIP-1) — Méthodes d'essai pour
interface RF
Reference number
ISO/IEC 22536:2005(E)
©
ISO/IEC 2005
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ISO/IEC 22536:2005(E)
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ISO/IEC 22536:2005(E)
Contents Page
Foreword. v
1 Scope. 1
2 Conformance. 1
3 Normative references. 1
4 Conventions and notations . 1
4.1 Representation of numbers . 1
4.2 Names. 2
4.3 Test report. 2
5 Abbreviations and acronyms . 2
6 Default items applicable to the test methods . 3
6.1 Test environment. 3
6.2 Default tolerance. 3
6.3 Spurious Inductance . 3
6.4 Total measurement uncertainty . 3
7 Test Set-up and test circuits. 3
7.1 Calibration coil . 3
7.1.1 Size of the calibration coil . 4
7.1.2 Thickness and material of the calibration coil PCB . 4
7.1.3 Coil characteristics. 4
7.2 Test assembly. 5
7.2.1 Field generating antenna . 5
7.2.2 Sense coils. 5
7.2.3 Arrangement of the test assembly. 6
7.3 Reference devices. 6
7.3.1 Initiator power . 7
7.3.2 Load modulation. 7
7.3.3 Dimensions of the reference device . 7
7.3.4 Thickness of the reference device PCB . 7
7.3.5 Coil characteristics. 7
7.4 Digital sampling oscilloscope . 8
8 Functional Test – Target . 8
8.1 Target RF Level Detection . 8
8.1.1 Purpose. 8
8.1.2 Test procedure. 8
8.1.3 Test report. 8
8.2 Target passive Communication mode. 9
8.2.1 Purpose. 9
8.2.2 Test procedure. 9
8.3 Target active Communication mode. 10
8.3.1 Purpose. 10
8.3.2 Test procedure. 10
8.3.3 Test report. 10
9 Functional Test – Initiator . 11
9.1 Initiator field strength in active and passive Communication mode. 11
9.1.1 Purpose. 11
9.1.2 Test procedure. 11
9.1.3 Test report. 11
9.2 Initiator modulation index and waveform in active and passive Communication mode . 12
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ISO/IEC 22536:2005(E)
9.2.1 Purpose. 12
9.2.2 Test procedure. 12
9.2.3 Test report. 12
9.2.4 Initiator load modulation reception in passive Communication mode . 12
Annex A (normative) Field generating antenna. 13
Annex B (normative) Sense coil. 16
Annex C (normative) Reference device for Initiator power test . 18
Annex D (normative) Test report template. 20
Annex E (informative) Load modulation test . 23
Annex F (informative) Program for evaluation of the spectrum . 25
Bibliography . 30
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ISO/IEC 22536:2005(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are members of
ISO or IEC participate in the development of International Standards through technical committees
established by the respective organization to deal with particular fields of technical activity. ISO and IEC
technical committees collaborate in fields of mutual interest. Other international organizations, governmental
and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information
technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of the joint technical committee is to prepare International Standards. Draft International
Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as
an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
ISO/IEC 22536 was prepared by Ecma International (as ECMA-356) and was adopted, under a special “fast-
track procedure”, by Joint Technical Committee ISO/IEC JTC 1, Information technology, Subcommittee SC 6,
Telecommunications and information exchange between systems, in parallel with its approval by national
bodies of ISO and IEC.
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INTERNATIONAL STANDARD ISO/IEC 22536:2005(E)
Information technology — Telecommunications and information
exchange between systems — Near Field Communication
Interface and Protocol (NFCIP-1) — RF interface test methods
1 Scope
This International Standard is part of a suite of standards that specify tests for ISO/IEC 18092. It defines test
methods for the RF-interface. This International Standard specifies RF-test methods for NFC devices with
antennas fitting within the rectangular area of 85 mm by 54 mm.
This test standard, the first of two parts, specifies compliance tests for the RF interface of ISO/IEC 18092
devices. The companion test standard specifies protocol tests for ISO/IEC 18092.
Ecma purposefully aligned this International Standard with ISO/IEC 10373-6 to allow testing laboratories to
reuse equipment and expertise.
2 Conformance
A system implementing ISO/IEC 18092 is in conformance with this International Standard if it meets all the
mandatory requirements specified herein.
3 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO/IEC 18092:2004, Information technology — Telecommunications and information exchange between
systems — Near Field Communication — Interface and Protocol (NFCIP-1)
4 Conventions and notations
4.1 Representation of numbers
The following conventions and notations apply in this document unless otherwise stated.
⎯ Letters and digits in parentheses represent numbers in hexadecimal notation.
⎯ The value of a bit is denoted by ZERO or ONE.
⎯ Numbers in binary notation and bit patterns are represented by strings of digits 0 and 1 shown with the
most significant bit to the left. Within such strings, X may be used to indicate that the value of a bit is not
specified within the string.
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ISO/IEC 22536:2005(E)
4.2 Names
The names of basic elements, e.g. specific fields, are written with a capital initial letter.
4.3 Test report
The test report Includes the number of passed tests versus the total number of tests, the number of different
samples and the date of the tests, see Annex D.
5 Abbreviations and acronyms
ar Reference device width
br Reference device height
ch Calibration coil height
cw Calibration coil width
cr Calibration coil corner radius
dis Distance between field generating antenna and sense coils
DFT Discrete Fourier Transformation
DUT Device under test
fc Frequency of the operating field
fs Frequency of subcarrier at 106 kbit/s in passive communication mode
H Maximum field strength of the Initiator antenna field
max
H Minimum field strength of the Initiator antenna field
min
H Minimum field strength for the RF level detector
Threshold
L Inductance of the calibration coil
Calcoil
L Inductance of the reference device
Refcoil
lx Length of test assembly connection cable
lya Field generating and sense coil PCB width
lyb Field generating and sense coil PCB height
lyd Field generating coil diameter
lyw Field generating coil track width
NFC Near Field Communication
nr Number of turns of reference device
oh Calibration coil outline height
ow Calibration coil outline width
PCB Printed Circuit Board
RF Radio Frequency
R Resistance of the calibration coil
Calcoil
R Resistance of the reference device
Refcoil
rs Sense coil corner radius
sa Sense coil width
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ISO/IEC 22536:2005(E)
sb Sense coil height
sr Reference device track spacing
wr Reference device track width
6 Default items applicable to the test methods
6.1 Test environment
Unless otherwise specified, testing shall take place in an environment of temperature 23°C ± 3°C (73°F ± 5°F)
and of relative humidity 40 % to 60 %.
6.2 Default tolerance
Unless otherwise specified, a tolerance of ± 5 % shall be applied to the values given to specify the
characteristics of the test equipment (e.g. linear dimensions) and the test method procedures (e.g. test
equipment adjustments).
6.3 Spurious Inductance
Resistors and capacitors shall have negligible inductance.
6.4 Total measurement uncertainty
The measurement uncertainty shall be recorded.
NOTE Basic information is given in “ISO Guide to the Expression of Uncertainty in Measurement“, ISBN 92-67-
10188-9, 1993.
7 Test Set-up and test circuits
The test set-up includes:
• Calibration coil
• Test assembly
• Reference devices
• Digital sampling oscilloscope
These are described in the following clauses.
This test set-up applies to NFCIP-1 devices with antennas fitting within the rectangular area of 85 mm by
54 mm.
7.1 Calibration coil
This clause defines the size, thickness and other characteristics of the calibration coil.
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ISO/IEC 22536:2005(E)
7.1.1 Size of the calibration coil
The calibration coil shall be integrated in a PCB that consists of an area, which has the height and width
defined in Table 1 containing a single turn coil concentric with the calibration coil outline. Figure 1 illustrates
the calibration coil.
Outline ow x oh
Coil corner radius cr
Connections
Coil cw x ch
1 turn
Figure 1 — Calibration coil
7.1.2 Thickness and material of the calibration coil PCB
The thickness of the calibration coil PCB shall be 0,76 mm ±10 %. It shall be constructed of a suitable
insulating material.
7.1.3 Coil characteristics
The coil shall have one turn. The outer size of the coil shall have a corner radius cr as defined in Table 1.
The coil is made as a printed coil on a PCB plated with 35 µm copper. Track width shall be 500 µm ± 20 %.
The size of the connection pads shall be 1,5 mm by 1,5 mm.
Table 1 — Definition of calibration coil
Name Symbol Value
Outline width ow 85 mm (+/-2 %)
Outline height oh 54 mm (+/-2 %)
Coil width cw 72 mm (+/-2 %)
Coil height ch 42 mm (+/-2 %)
Coil corner radius cr 5 mm (+/-2 %)
NOTE At 13,56 MHz the approximate inductance L is 250 nH and the approximate resistance is R
Calcoil Calcoil
0,4 Ohm.
A high impedance oscilloscope probe (e.g. >1 MOhm, <14 pF) shall be used to measure the (open circuit)
voltage in the coil. The resonant frequency of the whole set (calibration coil, connecting leads and probe) shall
be above 60 MHz.
The open circuit calibration factor for this coil is 0,32 Volts (rms) per A/m (rms) [Equivalent to 900 mV (peak-
to-peak) per A/m (rms)].
NOTE A parasitic capacitance of the probe assembly of less than 35 pF normally ensures a resonant frequency for
the whole set of greater than 60 MHz.
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ISO/IEC 22536:2005(E)
NOTE The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 mm
or alternatively use a coaxial connection.
7.2 Test assembly
The test assembly for load modulation consists of a field generating antenna and two parallel sense coils:
sense coil a and sense coil b. The test assembly set-up is shown in Figure 2. The sense coils are connected
such that the signal from one coil is in opposite phase to the other. The potentiometer P1 serves to fine adjust
the balance point when the sense coils are not loaded by a Target or any magnetically coupled circuit. The
capacitive load of the probe including its parasitic capacitance shall be less than 14 pF.
NOTE The capacitance of the connections and oscilloscope probe should be kept to a minimum for reproducibility.
+ +
sense coil b
240 Ohm
- -
+/- 1%
P1
identical length twisted
pairs or coaxial cable of
10 Ohm
less than lx mm
240 Ohm
+/-1%
probe
+ +
sense coil a
- -
Field generating
to
antenna
oscilloscope
Figure 2 — Test assembly set-up (principle)
NOTE In order to avoid any unintended misalignment in case of an unsymmetrical set-up, the tuning range of the
potentiometer P1 is only 10 Ohms. If the set-up cannot be compensated by the potentiometer P1 the symmetry of the set-
up should be checked.
NOTE The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 mm
or alternatively use a coaxial connection.
7.2.1 Field generating antenna
The field generating antenna shall have a diameter and a construction as specified in Annex A. To match the
impedance of the antenna to the antenna output driver a matching circuit as defined in Annex A2 shall be
used. The antenna shall be tuned to 50 Ohm by the matching circuit using suitable measurement equipment
such as an impedance analyser or a measurement bridge.
7.2.2 Sense coils
The size and the sense coil layout and assembly are specified in Annex B.
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ISO/IEC 22536:2005(E)
7.2.3 Arrangement of the test assembly
The sense coils and field generating antenna are assembled parallel and with the sense and antenna coils
coaxial and such that the distance between the active conductors has the value dis in Table 2. The distance
between the coil in the DUT and the calibration coil shall be equal with respect to the coil of the field
generating antenna. There shall be a 3 mm air space between the DUT and sense coil a in order to avoid
parasitic effects such as detuning by closer spacing or ambiguous results due to noise and other
environmental effects. The antenna of the DUT shall be placed in parallel to the sense coils.
dis dis
Active
conductors
DUT
3mm air
Calibration coil
spacing
Sense coil b
Field
Sense coil a
generating
antenna
Figure 3 — Test assembly
Table 2 — Definition of test assembly
Name Symbol Value
Distance dis 37,5 mm
Sense coil connection
lx 100 mm
cable length (max.)
7.3 Reference devices
Reference devices are used to measure:
⎯ The Initiator power: to verify that the Initiator generates a field with a field strength within the range of
H and H (under conditions of loading by a Target).
min max
⎯ The load modulation: to verify that the Target exerts at least the minimum load modulation.
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ISO/IEC 22536:2005(E)
7.3.1 Initiator power
The schematic for the Initiator power test is shown in Annex C. Power dissipation can be set by resistor R1 or
R2 respectively in order to measure H and H . The resonant frequency can be adjusted with C2.
max min
7.3.2 Load modulation
A schematic for the load modulation test is shown in Annex E. This reference device is calibrated by using the
test assembly as follows:
The reference device is placed in the position of the DUT. The load modulation signal amplitude is measured
as described in 8.2. This amplitude shall be the minimum amplitude at all values of field strength required by
ISO/IEC 18092.
7.3.3 Dimensions of the reference device
Figure 4 illustrates a reference device with coil outline dimensions of 85 by 54 mm and a test circuit, which
emulates the required Target functions. The schematics of the circuits are described in Annex C and Annex E.
These circuits shall be connected to the coil in such a way that it can be inserted into the test assembly
without causing interference to the test.
outer dimensions 85 by
Coil
Circuitry
54 mm
172 mm
Figure 4 — Reference device
7.3.4 Thickness of the reference device PCB
The thickness of the reference device PCB shall be 0,76 mm ± 10 %.
7.3.5 Coil characteristics
The coil of the reference device shall have nr turns and shall be concentric with the area outline.
The outer size of the coil shall be ar by br.
The coil is printed on PCB plated with 35 µm copper.
The coil width shall be wr and spacing shall be sr.
Table 3 — Reference device for Initiator power test and load modulation test
Name Symbol Value
Number of turns nr 4
Coil outline width
ar 72 mm (± 2 %)
Coil outline height
br 42 mm (± 2 %)
Track width
wr 500 µm (± 20 %)
Track spacing
sr 500 µm (± 20 %)
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ISO/IEC 22536:2005(E)
NOTE At 13,56 MHz the nominal inductance L is 3,5 µH and the nominal resistance R is 1 Ohm.
Refcoil Refcoil
7.4 Digital sampling oscilloscope
The digital sampling oscilloscope shall be capable of sampling at a rate of at least 100 million samples per
second with a resolution of at least 8 bits at optimum scaling.
NOTE The oscilloscope should have the capability to output the sampled data as a text file to facilitate mathematical
and other operations such as windowing on the sampled data using external software programmes (Annex F).
8 Functional Test – Target
8.1 Target RF Level Detection
8.1.1 Purpose
The purpose of this test is to verify that the NFCIP-1 device detects an external RF field with a fieldstrength in
the range of H up to H .
Threshold max
8.1.2 Test procedure
The test circuit of Figure 2 and the test assembly of Figure 3 are used.
Step 1:
The RF power delivered by the signal generator to the field generating antenna shall be adjusted to the
required field strength in the range of 0 up to H as measured by the calibration coil without any Target.
max
The output of the test circuit of Figure 2 is connected to a digital sampling oscilloscope. The potentiometer P1
shall be trimmed to minimise the residual carrier. This signal shall be at least 40 dB lower than the signal
obtained by shorting one sense coil so that it can be used to detect if the DUT switches on the RF field.
Step 2:
The NFC device under test shall be placed in the DUT position, concentric with sense coil a. The DUT shall be
set into Initiator mode.
The signal generator shall start to generate a non-modulated RF-field at the frequency f . The field strength
c
shall be increased linear in the range from 0 up to H . H is the maximum field strength without any
max max
Target.
The test shall verify if the Initiator correctly switches on its RF-field:
• If the field strength is below H the Initiator switches on its own RF-field.
Threshold
• For field strength equal or higher than H the Initiator does not switch on its own RF- field.
Threshold
8.1.3 Test report
The test report shall indicate whether the DUT behaves correctly according to the procedure described in
8.1.2.
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ISO/IEC 22536:2005(E)
8.2 Target passive Communication mode
8.2.1 Purpose
The purpose of these tests is to determine the amplitude of the Target’s load modulation signal while varying
the field strength in the range of H and H as defined in the test procedure in 8.2.2.
min max
8.2.2 Test procedure
ISO/IEC 18092 specifies 3 different data rates for the passive communication mode. The test for the Target in
the passive communication mode shall be performed at 106 kbit/s, 212 kbit/s and 424 kbit/s.
8.2.2.1 Test procedure for 106 kbit/s
The load modulation test circuit of Figure 2 and the test assembly of Figure 3 are used
Step 1:
The RF power delivered by the signal generator to the field generating antenna shall be adjusted to the
required field strength and modulation waveforms as measured by the calibration coil without any Target.
The output of the load modulation test circuit of Figure 2 is connected to a digital sampling oscilloscope. The
potentiometer P1 shall be set to minimise the residual carrier. This signal shall be at least 40 dB lower than
the signal obtained by shorting one sense coil.
Step 2:
The Target under test shall be placed in the DUT position, concentric with sense coil a. A SENS_REQ
command sequence as defined in ISO/IEC 18092 shall be sent to the DUT to obtain a SENS_RES response.
NOTE Care should be taken to apply a proper synchronization method for low amplitude load modulation.
Exactly two subcarrier cycles of the sampled modulation waveform shall be Fourier transformed. A discrete
Fourier transformation with a scaling such that a pure sinusoidal signal results in its peak magnitude shall be
used. To minimize transient effects, a subcarrier cycle immediately following a non-modulating period must be
avoided.
The amplitudes of the upper sideband at fc+fs and the lower sideband fc-fs and the applied fields and
modulations shall be measured in this test.
8.2.2.2 Test report at 106 kbit/s
If the amplitudes of the upper sideband fc+fs and the lower sideband fc-fs respectively are above the values
specified in ISO/IEC 18092 then this
...
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