ISO/IEC 10373-6:2001
(Main)Identification cards — Test methods — Part 6: Proximity cards
Identification cards — Test methods — Part 6: Proximity cards
Cartes d'identification — Méthodes d'essai — Partie 6: Cartes de proximité
General Information
Relations
Standards Content (Sample)
INTERNATIONAL ISO/IEC
STANDARD 10373-6
First edition
2001-05-15
Identification cards — Test methods —
Part 6:
Proximity cards
Cartes d'identification — Méthodes d'essai —
Partie 6: Cartes de proximité
Reference number
ISO/IEC 10373-6:2001(E)
©
ISO/IEC 2001
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ISO/IEC 10373-6:2001(E)
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ISO/IEC 10373-6:2001(E)
Contents Page
Foreword.v
1 Scope .1
2 Normative references .1
3 Terms and definitions, abbreviations and symbols.2
3.1 Terms and definitions .2
3.2 Abbreviations and symbols.2
4 Default items applicable to the test methods .3
4.1 Test environment.3
4.2 Pre-conditioning .3
4.3 Default tolerance.3
4.4 Spurious Inductance .3
4.5 Total measurement uncertainty .3
5 Static electricity test.3
5.1 Apparatus .3
5.2 Procedure .4
5.3 Test report .4
6 Test apparatus and test circuits.5
6.1 Calibration coil.5
6.1.1 Size of the Calibration coil card .5
6.1.2 Thickness and material of the Calibration coil card .5
6.1.3 Coil characteristics.5
6.2 Test PCD assembly.6
6.2.1 Test PCD antenna .6
6.2.2 Sense coils .6
6.2.3 Assembly of Test PCD .7
6.3 Reference PICCs.7
6.3.1 Reference PICC for H , H and PCD power .7
min max
6.3.2 Reference PICC for load modulation test.7
6.3.3 Dimensions of the Reference PICCs.8
6.3.4 Thickness of the Reference PICCs board .8
6.3.5 Coil characteristics.8
6.4 Digital sampling oscilloscope .8
7 Functional test - PICC .8
7.1 Purpose.8
7.2 Test procedure.8
7.3 Test report .9
8 Functional test - PCD .9
8.1 PCD field strength.9
8.1.1 Purpose.9
8.1.2 Test procedure.9
8.1.3 Test report .10
8.2 Power transfer PCD to PICC.10
8.2.1 Purpose.10
8.2.2 Test procedure.10
8.2.3 Test report .10
8.3 Modulation index and waveform.10
8.3.1 Purpose.10
8.3.2 Test procedure.10
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ISO/IEC 10373-6:2001(E)
8.3.3 Test report .10
8.4 Load modulation reception (informative only) .11
8.4.1 Purpose.11
8.4.2 Test procedure .11
Annex A (normative) Test PCD Antenna.12
A.1 Test PCD Antenna layout including impedance matching network.12
A.2 Impedance matching network .14
Annex B (informative) Test PCD Antenna tuning.15
Annex C (normative) Sense coil .17
C.1 Sense coil layout.17
C.2 Sense coil assembly.18
Annex D (normative) Reference PICC for field and power measurements .19
Annex E (informative) Reference PICC for load modulation test .20
Annex F (informative) Program for the evaluation of the spectrum.21
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ISO/IEC 10373-6:2001(E)
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission)
form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC
participate in the development of International Standards through technical committees established by the
respective organization to deal with particular fields of technical activity. ISO and IEC technical committees
collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in
liaison with ISO and IEC, also take part in the work.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 3.
In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting.
Publication as an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this part of ISO/IEC 10373 may be the subject of
patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
International Standard ISO/IEC 10373-6 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information
technology, Subcommittee SC 17, Identification cards and related devices.
ISO/IEC 10373 consists of the following parts, under the general title Identification cards — Test methods:
— Part 1: General characteristics tests
— Part 2: Cards with magnetic stripes
— Part 3: Integrated circuit(s) cards with contacts and related interface devices
— Part 4: Close-coupled cards
— Part 5: Optical memory cards
— Part 6: Proximity cards
— Part 7: Vicinity cards
Annexes A, C and D form a normative part of this part of ISO/IEC 10373. Annexes B, E and F are for information
only.
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INTERNATIONAL STANDARD ISO/IEC 10373-6:2001(E)
Identification cards — Test methods —
Part 6:
Proximity cards
1 Scope
This International Standard defines test methods for characteristics of identification cards according to the definition
given in ISO/IEC 7810. Each test method is cross-referenced to one or more base standards, which may be
ISO/IEC 7810 or one or more of the supplementary standards that define the information storage technologies
employed in identification cards applications.
NOTE 1 Criteria for acceptability do not form part of this International Standard but will be found in the International
Standards mentioned above.
NOTE 2 Test methods described in this International Standard are intended to be performed separately. A given card is not
required to pass through all the tests sequentially.
This part of ISO/IEC 10373 deals with test methods which are specific to contactless integrated circuit(s) card
technology (Proximity cards). ISO/IEC 10373-1, General characteristics, deals with test methods which are
common to one or more ICC technologies and other parts deal with other technology-specific tests.
Unless otherwise specified, the tests in this part of ISO/IEC 10373 shall be applied exclusively to Proximity cards
defined in ISO/IEC 14443-1 and ISO/IEC 14443-2.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of
this part of ISO 10373. For dated references, subsequent amendments to, or revisions of, any of these publications
do not apply. However, parties to agreements based on this part of ISO 10373 are encouraged to investigate the
possibility of applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of ISO and IEC maintain
registers of currently valid International Standards.
ISO/IEC 7810:1995, Identification cards — Physical characteristics.
ISO/IEC 14443-1, Identification cards — Contactless integrated circuit(s) cards — Proximity cards — Part 1:
Physical characteristics.
ISO/IEC 14443-2, Identification cards — Contactless integrated circuit(s) cards — Proximity cards — Part 2: Radio
frequency power and signal interface.
ISO/IEC 14443-3, Identification cards — Contactless integrated circuit(s) cards — Proximity cards — Part 3:
Initialization and anticollision.
IEC 61000-4-2: 1995, Electromagnetic compatibility (EMC) — Part 4: Testing and measurement techniques —
Section 2: Electrostatic discharge immunity test.
BIPM, IEC, IFCC, ISO, IUPAC, IUPAP, OIML, 1993, Guide to the Expression of Uncertainty in Measurement (Gum).
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ISO/IEC 10373-6:2001(E)
3 Terms and definitions, abbreviations and symbols
For the purposes of this part of ISO/IEC 10373, the following terms and definitions and abbreviations apply.
3.1 Terms and definitions
3.1.1
base standard
standard which the test method is used to verify conformance to
3.1.2
testably functional
surviving the action of some potentially destructive influence to the extent that any integrated circuit(s) present in
1)
the card continues to show a response as defined in ISO/IEC 14443-3 which conforms to the base standard
NOTE If other technologies exist on the same card they shall be testably functional in accordance with their respective
standard.
3.1.3
test method
method for testing characteristics of identification cards for the purpose of confirming their compliance with
International Standards
3.2 Abbreviations and symbols
DUT Device under test
ESD Electrostatic Discharge
fc Frequency of the operating field
fs Frequency of the subcarrier
H Maximum fieldstrength of the PCD antenna field
max
H Minimum fieldstrength of the PCD antenna field
min
PCD Proximity Coupling Device
PICC Proximity Card
1) This International Standard does not define any test to establish the complete functioning of integrated circuit(s) cards. The
test methods require only that the minimum functionality (testably functional) be verified. This may, in appropriate
circumstances, be supplemented by further, application specific functionality criteria which are not available in the general case.
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ISO/IEC 10373-6:2001(E)
4 Default items applicable to the test methods
4.1 Test environment
Unless otherwise specified, testing shall take place in an environment of temperature 23 �C� 3 �C(73 �F� 5 �F)
and of relative humidity 40 % to 60 %.
4.2 Pre-conditioning
Where pre-conditioning is required by the test method, the identification cards to be tested shall be conditioned to
the test environment for a period of 24 h before testing.
4.3 Default tolerance
Unless otherwise specified, a default tolerance of � 5 % shall be applied to the quantity values given to specify the
characteristics of the test equipment (e.g. linear dimensions) and the test method procedures (e.g. test equipment
adjustments).
4.4 Spurious Inductance
Resistors and capacitors should have negligible inductance.
4.5 Total measurement uncertainty
The total measurement uncertainty for each quantity determined by these test methods shall be stated in the test
report.
Basic information is given in Gum, 1993.
5 Static electricity test
The purpose of this test is to check the behaviour of the card IC in relation to electrostatic discharge (ESD)
exposure in the test sample. The card under test is exposed to a simulated electrostatic discharge (ESD, human
body model) and its basic operation checked following the exposure.
Discharge tip
ESD gun
PICC
0,5 mm thick insulating support
Horizontal coupling
conductive plane on wooden
table, standing on ground
reference plane
Figure 1 — ESD test circuit
5.1 Apparatus
Refer to IEC 61000-4-2:1995.
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ISO/IEC 10373-6:2001(E)
a) Main specifications of the ESD generator
� energy storage capacitance: 150 pF � 10 %
� discharge resistance: 330 Ohm � 10 %
� charging resistance: between 50 MOhm and 100 MOhm
� rise time: 0,7 to 1 ns
b) Selected specifications from the optional items
� type of equipment: table top equipment
� discharge method: direct and contact discharge to the equipment under test
� discharge electrodes of the ESD generator: Round tip probe of 8 mm diameter (to avoid breaking the
surface label layer of card).
5.2 Procedure
Connect the ground pin of the apparatus to the conductive plate upon which the card is placed.
Apply the discharge successively in normal polarity to each of the 20 test zones shown in figure 2. Then repeat the
same procedure with reversed polarity. Allow a cool-down period between successive pulses of at least 10 s.
WARNING — If the card includes contacts, the contacts shall be face up and the zone which includes
contacts shall not be exposed to this discharge.
Check that the card remains testably functional (see clause 3) at the end of the test.
12 34 5
67 8 9 10
11 12 13 14 15
16 17 18 19 20
Figure 2 — Test zones on card for ESD test
5.3 Test report
The test report shall state whether or not the card remains testably functional.
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ISO/IEC 10373-6:2001(E)
6 Test apparatus and test circuits
This clause defines the test apparatus and test circuits for verifying the operation of a PICC or a PCD according to
ISO/IEC 14443-2. The test apparatus includes:
� Calibration coil (see 6.1)
� Test PCD assembly (see 6.2)
� Reference PICCs (see 6.3)
� Digital sampling oscilloscope (see 6.4)
These are described in the following clauses.
6.1 Calibration coil
This clause defines the size, thickness and characteristics of the calibration coil.
6.1.1 Size of the Calibration coil card
The calibration coil card shall consist of an area which has the height and width of an ID-1 type defined in ISO/IEC
7810 containing a single turn coil concentric with the card outline.
ISO/IEC 7810 ID-1 outline
Coil 72 mm x 42 mm
connections
1turn
Figure 3 — Calibration coil
6.1.2 Thickness and material of the Calibration coil card
The thickness of the calibration coil card shall be 0,76 mm � 10 %. It shall be constructed of a suitable insulating
material.
6.1.3 Coil characteristics
The coil on the calibration coil card shall have one turn. The outer size of the coil shall be 72 mm � 42 mm with
corner radius 5 mm. Relative dimensional tolerance shall be� 2%.
2
NOTE The area over which the field is integrated is approximately 3000 mm .
The coil shall be made as a printed coil on PCB plated with 35µm copper. Track width shall be 500µm with a
relative tolerance of � 20 %. The size of the connection pads shall be 1,5 mm � 1,5 mm.
NOTE At 13,56 MHz the approximate inductance is 200 nH and the approximate resistance is 0,25 Ohm.
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ISO/IEC 10373-6:2001(E)
A high impedance oscilloscope probe (e.g. > 1MOhm, < 14pF) shall be used to measure the (open circuit) voltage
induced in the coil. The resonance frequency of the calibration coil and connecting leads shall be above 60 MHz.
NOTE A parasitic capacitance of the probe assembly of less than 35 pF normally ensures a resonant frequency for the
whole set of greater than 60 MHz.
The open circuit calibration factor for this coil is 0,32 Volts (rms) per A/m (rms). [Equivalent to 900 mV (peak-to-
peak) per A/m (rms)]
6.2 Test PCD assembly
The test PCD assembly shall consist of a 150 mm diameter PCD antenna and two parallel sense coils: sense coil a
and sense coil b. The test set-up is shown in figure 4. The sense coils shall be connected such that the signal from
one coil is in opposite phase to the other. The 50 Ohm potentiometer P1 serves to fine adjust the balance point
when the sense coils are not loaded by a PICC or any magnetically coupled circuit. The capacitive load of the
probe including its parasitic capacitance shall be less than 14 pF.
NOTE The capacitance of the connections and of the oscilloscope probe should be kept to a minimum for reproducibility.
+ +
sense coil b
220 Ohm
- -
P1
identical length
twisted pairs of less
50 Ohm
than 100 mm
220 Ohm
PCD
probe
antenna
+ +
sense coil a
- -
to
oscilloscope
Figure 4 — Test set-up (principle)
6.2.1 Test PCD antenna
The Test PCD antenna shall have a diameter of 150 mm and its construction shall conform to the drawings in
Annex A. The tuning of the antenna may be accomplished with the procedure given in Annex B.
6.2.2 Sense coils
Thesizeof the sensecoils shall be 100 mm � 70 mm. The sense coil construction shall conform to the drawings in
Annex C.
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ISO/IEC 10373-6:2001(E)
6.2.3 Assembly of Test PCD
The sense coils and Test PCD antenna shall be assembled parallel and with the sense and antenna coils coaxial
and such that the distance between the active conductors is 37,5 mm as in figure 5. The distance between the coil
in the DUT and the calibration coil shall be equal with respect to the coil of the test PCD antenna.
NOTE These distances are chosen to represent the typical operating distance of the PICC.
37,5 mm 37,5 mm
active
conductors
DUT
Calibration coil
sensenssee ccoiloil bb
sense coil a PCD
antenna
Figure 5 — Test PCD assembly
6.3 Reference PICCs
Reference PICCs are defined:
� to test H and H produced by a PCD (under conditions of loading by a PICC)
min max
� to test the ability of a PCD to power a PICC
� to detect the minimum load modulation signal from the PICC.
6.3.1 Reference PICC for H , H and PCD power
min max
The schematic is shown in Annex D. Resistor R1 or R2 may be selected by means of jumper J1. Resonant
frequency can be adjusted with C2.
6.3.2 Reference PICC for load modulation test
The suggested schematic for the load modulation test is shown in Annex E. The load modulation can be chosen to
be resistive or capacitive.
This Reference PICC is calibrated by using the Test PCD assembly as follows:
Place the Reference PICC in the position of the DUT. Measure the load modulation signal amplitude as described
in 7.2. This amplitude should correspond to the minimum amplitude at values of field strength required by the base
standard.
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ISO/IEC 10373-6:2001(E)
6.3.3 Dimensions of the Reference PICCs
The Reference PICCs shall consist of an area containing the coils which has the height and width defined in
ISO/IEC 7810 for ID-1 type. An area external to this, containing the circuitry which emulates the required PICC
functions, shall be appended in such a way as to allow insertion into the test set-ups described below and so as to
cause no interference to the tests. The dimensions shall be as in figure 6.
outline ISO/IEC 7810
ID-1 type
Coil
Circuitry
172 mm
Figure 6 — Reference PICC dimensions
6.3.4 Thickness of the Reference PICCs board
The thickness of the Reference PICCs active area shall be 0,76 mm � 10 %.
6.3.5 Coil characteristics
The coil in the active area of the Reference PICCs shall have 4 turns and shall be concentric with the area outline.
The outer size of the coils shall be 72 mm � 42 mm with a relative tolerance of � 2%.
The coil shall be printed on PCB plated with 35µm copper.
Track width and spacing shall be 500µm with a relative tolerance of � 20 %.
6.4 Digital sampling oscilloscope
The digital sampling oscilloscope shall be capable of sampling at a rate of at least 100 million samples per second
with a resolution of at least 8 bits at optimum scaling. The oscilloscope should have the capability to output the
sampled data as a text file to facilitate mathematical and other operations such as windowing on the sampled data
using external software programmes (see Annex F).
7 Functional test - PICC
7.1 Purpose
The purpose of this test is to determine the amplitude of the PICC load modulation signal within the operating field
range [H , H ] as specified in the base standard. Also the functionality of the PICC for Type A and Type B within
min max
their corresponding modulation ranges as defined in the base standard shall be determined.
7.2 Test procedure
Step 1: The load modulation test circuit of figure 4 and the Test PCD assembly of figure 5 are used.
Adjust the RF power delivered by the signal generator to the test PCD antenna to the required field strength as
measured by the calibration coil. Connect the output of the load modulation test circuit of figure 4 to a digital
sampling oscilloscope. The 50 Ohm potentiometer shall be trimmed to minimise the residual carrier. This signal
shall be at least 40 dB lower than the signal obtained by shorting one sense coil.
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ISO/IEC 10373-6:2001(E)
Step 2: The PICC under test shall be placed in the DUT position, concentric with sense coil a. The RF drive into the
test PCD antenna shall be re-adjusted to the required field strength.
Display a segment of at least two cycles of the waveform of the subcarrier load modulation on the digital sampling
oscilloscope and store the sampled data in a file for analysis by a computer software programme (see Annex F).
NOTE Care should be taken to apply a proper synchronization method for low amplitude load modulation.
Fourier transform exactly two subcarrier cycles of the sampled modulation waveform using suitable computer
software. Use a discrete Fourier transformation with a scaling such that a pure sinusoidal signal results in its peak
magnitude. To minimize transient effects, avoid a subcarrier cycle immediately following a non-modulating period.
The resulting peak amplitudes of the upper and lower sidebands at fc + fs and fc� fs shall be above the value
defined in the base standard.
A REQA or a REQB
...
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