oSIST prEN IEC 62769-103-4:2022

Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET

IEC 62769-103-4:2023 is available as IEC 62769-103-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]).
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Feldgeräteintegration (FDI) - Teil 103-4: Profile - PROFINET

Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET

IEC 62769-103-4:2023 est disponible sous forme de IEC 62769-103-4:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L'IEC 62769-103-4:2023 spécifie un profil FDI®[1] de l'IEC 62769 pour les profils de communication CP 3/4, CP 3/5 et CP 3/6 (PROFINET[2]) définis dans l'IEC 61784-2.
[1] FDI est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des utilisateurs du présent document et ne signifie nullement que l'IEC approuve le détenteur de la marque ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de la marque. L'utilisation de la marque exige l'autorisation du détenteur de la marque.
[2] PROFINET est l'appellation commerciale du consortium PROFIBUS & PROFINET International, une organisation à but non lucratif. Cette information est donnée à l'intention des utilisateurs du présent rapport technique et ne signifie nullement que l'IEC approuve le détenteur des appellations commerciales ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de l'appellation commerciale. L'utilisation de l'appellation commerciale exige l'autorisation du détenteur de l'appellation commerciale.

Integracija procesne naprave (FDI) - 103-4. del: Profili - PROFINET

General Information

• Status: Not Published
• Public Enquiry End Date: 22-May-2022
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• ICS: 35.240.50 - IT applications in industry
• Technical Committee: MOV - Measuring equipment for electromagnetic quantities
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Jul-2023
• Due Date: 08-Sep-2023
• Ref Project: EN IEC 62769-103-4:2023 - Field Device Integration (FDI)® - Part 103-4: PROFINET

Relations

• Revised: SIST EN IEC 62769-103-4:2020 - Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET (IEC 62769-103-4:2020)
• Effective Date: 09-Nov-2021

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 62769-103-4:2022
01-maj-2022
Integracija procesne naprave (FDI) - 103-4. del: Profili - PROFINET
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET
Ta slovenski standard je istoveten z: prEN IEC 62769-103-4:2022
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
oSIST prEN IEC 62769-103-4:2022 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 62769-103-4:2022
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oSIST prEN IEC 62769-103-4:2022
65E/863/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62769-103-4 ED3
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-03-04 2022-05-27
SUPERSEDES DOCUMENTS:
65E/830/RR
IEC SC 65E : DEVICES AND INTEGRATION IN ENTERPRISE SYSTEMS
SECRETARIAT: SECRETARY:
United States of America Mr Donald (Bob) Lattimer
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY

SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.

Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they

are aware and to provide supporting documentation.
TITLE:
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
PROPOSED STABILITY DATE: 2025
NOTE FROM TC/SC OFFICERS:

Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this

electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.

You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without

permission in writing from IEC.
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1 CONTENTS

3 FOREWORD .......................................................................................................................... 5

4 1 Scope ............................................................................................................................. 7

5 2 Normative references ...................................................................................................... 7

6 3 Terms, definitions, abbreviated terms and acronyms ....................................................... 8

7 3.1 Terms and definitions ............................................................................................. 8

8 3.2 Abbreviated terms and acronyms ........................................................................... 8

9 4 Conventions .................................................................................................................... 8

10 4.1 EDDL syntax .......................................................................................................... 8

11 4.2 XML syntax ............................................................................................................ 8

12 4.3 Capitalizations........................................................................................................ 8

13 5 Profile for PROFINET ...................................................................................................... 9

14 5.1 General .................................................................................................................. 9

15 5.2 Catalog profile ........................................................................................................ 9

16 5.2.1 Protocol support file ........................................................................................ 9

17 5.2.2 CommunicationProfile definition .................................................................... 10

18 5.2.3 Profile device ................................................................................................ 10

19 5.2.4 Protocol version information .......................................................................... 10

20 5.3 Associating a Package with a device .................................................................... 11

21 5.3.1 Device type identification mapping ................................................................ 11

22 5.3.2 Device type revision mapping ........................................................................ 12

23 5.4 Information Model mapping .................................................................................. 13

24 5.4.1 ProtocolType definition ................................................................................. 13

25 5.4.2 DeviceType mapping ..................................................................................... 13

26 5.4.3 FunctionalGroup identification definition ........................................................ 14

27 5.5 Topology elements ............................................................................................... 14

28 5.5.1 ConnectionPoint definition ............................................................................ 14

29 5.5.2 Communication Device definition .................................................................. 16

30 5.5.3 Communication service provider definition .................................................... 17

31 5.5.4 Network definition ......................................................................................... 18

32 5.6 Methods ............................................................................................................... 19

33 5.6.1 Methods for FDI Communication Servers ...................................................... 19

34 5.6.2 Methods for Gateways .................................................................................. 22

35 Annex A (normative) Topology scan schema ....................................................................... 31

36 A.1 General ................................................................................................................ 31

37 A.2 Target Namespace ............................................................................................... 31

38 A.3 Network ................................................................................................................ 31

39 A.4 ProfinetNetworkT ................................................................................................. 31

40 A.5 ProfinetConnectionPointT ..................................................................................... 32

41 A.6 ProfinetIdentificationT .......................................................................................... 32

42 A.7 MACT ................................................................................................................... 33

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43 A.8 IPv4T ................................................................................................................... 33

44 A.9 IPv6T ................................................................................................................... 34

45 A.10 DNSNameT .......................................................................................................... 34

46 A.11 Hex4DigitT ........................................................................................................... 34

47 Annex B (normative) Transfer service parameters ............................................................... 35

48 B.1 General ................................................................................................................ 35

49 B.2 Target Namespace ............................................................................................... 35

50 B.3 sendData .............................................................................................................. 35

51 B.4 receiveData .......................................................................................................... 35

52 B.5 TransferSendDataT .............................................................................................. 35

53 B.6 TransferResultDataT ............................................................................................ 36

54 B.7 OperationT ........................................................................................................... 36

55 Annex C (informativ) Mapping to PA DIM ............................................................................ 37

56 C.1 General ................................................................................................................ 37

57 C.2 Mapping table ...................................................................................................... 37

58 Bibliography ......................................................................................................................... 38

60 Figure 1 – Version mapping problem .................................................................................... 12

62 Table 1 – ProtocolSupportFile for FDI Device Packages ......................................................... 9

63 Table 2 – ProtocolSupportFile for FDI Communication Packages ........................................... 9

64 Table 3 – Catalog values for profile devices ......................................................................... 10

65 Table 4 – Version mapping examples ................................................................................... 10

66 Table 5 – Device identification information mapping ............................................................. 12

67 Table 6 – Protocol type Profinet_IO ...................................................................................... 13

68 Table 7 – DeviceType Property mapping .............................................................................. 14

69 Table 8 – PROFINET identification type definition ................................................................ 14

70 Table 9 – ConnectionPoint type for Profinet_IO .................................................................... 15

71 Table 10 – Method Connect arguments ................................................................................ 19

72 Table 11 – Method Disconnect arguments ............................................................................ 20

73 Table 12 – Method Transfer arguments ................................................................................ 21

74 Table 13 –Method SetAddress arguments ............................................................................ 22

75 Table 14 – Method Connect arguments ................................................................................ 24

76 Table 15 – Method Transfer arguments ................................................................................ 26

77 Table 16 – Method SetAddress arguments ........................................................................... 28

78 Table A.1 – Elements of ProfinetNetworkT ........................................................................... 31

79 Table A.2 – Attributes of ProfinetConnectionPointT .............................................................. 32

80 Table A.3 – Elements of ProfinetConnectionPointT .............................................................. 32

81 Table A.4 – Attributes of ProfinetIdentificationT .................................................................... 33

82 Table B.1– Attributes of TransferSendDataT ........................................................................ 36

83 Table B.2– Attributes of TransferResultDataT ...................................................................... 36

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84 Table C.1: Mapping from PN standard parametrs to PA DIM ................................................ 37

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87 INTERNATIONAL ELECTROTECHNICAL COMMISSION
88 ____________
90 FIELD DEVICE INTEGRATION (FDI) –
92 Part 103-4: PROFINET
94 FOREWORD

95 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national

96 electrotechnical committees (IEC National Committees). The object of IEC is to promote international co -operation on all

97 questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC

98 publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and

99 Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National

100 Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non -

101 governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the

102 International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two

103 organizations.

104 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus

105 of opinion on the relevant subjects since each technical committee has representation from all interested IEC National

106 Committees.

107 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in

108 that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC

109 cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.

110 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to

111 the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the

112 corresponding national or regional publication shall be clearly indicated in the latter.

113 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment

114 services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by

115 independent certification bodies.

116 6) All users should ensure that they have the latest edition of this publication.

117 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its

118 technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature

119 whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,

120 or reliance upon, this IEC Publication or any other IEC Publications.

121 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable

122 for the correct application of this publication.

123 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC

124 shall not be held responsible for identifying any or all such patent rights.

125 IEC 62769-103-4 has been prepared by subcommittee 65E: Devices and integration in enterprise systems,

126 of IEC technical committee 65: Industrial-process measurement, control and automation. It is an

127 International Standard.

128 This third edition cancels and replaces the second edition published in 2021. This edition constitutes a

129 technical revision.

130 This edition includes the following significant technical changes with respect to the previous edition:

131 a) added DeviceType to ProfinetIdentificationT;
132 b) 1798added namespace to Annex A and Annex B;
133 c) added mapping rule for Device type when running in profile mode;
134 d) replaced GSD file with GSDML file, detailing of device type mapping;
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135 e) added mapping to PA DIM.
136 The text of this International Standard is based on the following documents:
Draft Report on voting
XX/XX/FDIS XX/XX/RVD
137

138 Full information on the voting for its approval can be found in the report on voting indicated in the above

139 table.

140 The language used for the development of this International Standard is English.

141 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in accordance

142 with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available at

143 www.iec.ch/members_experts/refdocs. The main document types developed by IEC are described in

144 greater detail at www.iec.ch/standardsdev/publications.

145 The committee has decided that the contents of this document will remain unchanged until the stability

146 date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific

147 document. At this date, the document will be
148 • reconfirmed,
149 • withdrawn,
150 • replaced by a revised edition, or
151 • amended.
152
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153 FIELD DEVICE INTEGRATION (FDI) –
154 PROFILES –
155
156 Part 103-4: PROFINET
157
158
159
160 1 Scope

161 This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5

162 and IEC 61784-2_CP3/6 (PROFINET ).
163 2 Normative references

164 The following documents, in whole or in part, are normatively referenced in this document and are

165 indispensable for its application. For dated references, only the edition cited applies. For undated

166 references, the latest edition of the referenced document (including any amendments) applies.

167 IEC 61158-5-10, Industrial communication networks – Fieldbus specifications – Part 5-10: Application

168 layer service definition – Type 10 elements

169 IEC 61784-2, Industrial communication networks – Profiles – Part 2: Additional fieldbus profiles for real-

170 time networks based on ISO/IEC 8802-3

171 IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device Description

172 Language (EDDL)
173 IEC 62541-100:2015, OPC Unified Architecture – Part 100: OPC UA for Devices
174 IEC 62769-2, Field Device Integration (FDI) – Part 2: FDI Client
175 IEC 62769-4, Field Device Integration (FDI) – Part 4: FDI Packages
176 IEC 62769-5, Field Device Integration (FDI) – Part 5: FDI Information Model
177 IEC 62769-6, Field Device Integration (FDI) – Part 6: FDI Technology Mapping

178 IEC 62769-7, Field Device Integration (FDI) – Part 7: FDI Communication Devices

179 PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device Integration –

180 Volume 1: GSD, V5.1, July 2008: GSD; available at

181 PI Order No.: 2.352:2014, GSDML Specification for PROFINET IO; available at

PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the

convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products.

Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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182 3 Terms, definitions, abbreviated terms and acronyms
183 3.1 Terms and definitions

184 For the purposes of this document, the terms and definitions given in IEC 61158-5-10, IEC 61784-2,

185 IEC 61804 (all parts), IEC 62541-100, IEC 62769-2, IEC 62769-4, IEC 62769-5, IEC 62769-6, IEC 62769-

186 7 and PI Order No.: 2.352:2014 apply.
187 3.2 Abbreviated terms and acronyms

188 For the purposes of this document, the following abbreviated terms and acronyms apply:

DCP Discovery and basic configuration protocol (see IEC 61158-5-10)
DNS Domain name system
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804 (all parts))
GSD General station description (see PI Order No.: 2.122:2008)
GSDML GSD markup language (see PI Order No.: 2.352:2014)
IP Internet protocol (RFC 791)
UIP User Interface plug-in
UUID Universal unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
189 4 Conventions
190 4.1 EDDL syntax

191 This part of IEC 62769 specifies content for the EDD component that is part of FDI Communication

192 Packages. The specification content using EDDL syntax uses the font Courier New. The EDDL syntax

193 is used for method signature, variable, data structure and component declarations.

194 4.2 XML syntax

195 XML syntax examples use the font Courier New. The XML syntax is used to describe XML document

196 schema.
197 Example:
198 4.3 Capitalizations

199 The IEC 62769 series uses capitalized terms to emphasize that these terms have an FDI specific meaning.

200 Some of these terms using an acronym as a prefix for example
201 • FDI Client, or
202 • FDI Server.
203 Some of these terms are compound terms such as:
204 • Communication Servers, or
205 • Profile for Package.
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206 Parameter names or attributes are concatenated to a single term, where the original terms starting in this

207 term with a capital letter such as:
208 • ProtocolSupportFile, or
209 • ProtocolType.

210 Parameter names or attributes can also be constructed by using an underscore character to concatenate

211 two or more terms such as:
212 • PROFILE_ID, or
213 • Profinet_PA_Network
214 5 Profile for PROFINET
215 5.1 General

216 This profile document to the FDI specification in IEC 62769 specifies the protocol specifics needed for FDI

217 Packages describing Communication Servers, Gateways and Devices.

218 For Communication Servers this document defines also protocol specifics as these need to be considered

219 in the Communication Servers hosted Information Model.
220 5.2 Catalog profile
221 5.2.1 Protocol support file
222 5.2.1.1 FDI Device Package

223 A GSDML file is a mandatory Attachment for FDI Device Packages representing PROFINET IO devices.

224 Protocol specific attachments are mentioned in the Package Catalog as defined in

225 IEC 62769-5. A communication feature list mark-up language (GSDML) file according to PI Order No.:

226 2.352:2014 is a mandatory attachment for FDI Device Packages representing PROFINET devices. Table 1

227 specifies the parameters of ProtocolSupportFile in the FDI Device Package.
228 Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/xml
Root Namespace Empty

Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol

Filename According to PI Order No.: 2.352:2014.
229
230 5.2.1.2 FDI Communication Package

231 A GSDML file as specified in ISO 15745 4:2003, Amd1, is an optional attachment for FDI Communication

232 Packages representing PROFINET IO devices. Table 2 specifies the parameters of ProtocolSupportFile

233 for FDI Communication Packages.
234 Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type text/xml
Root Namespace Empty
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Parameter Description

Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol

Filename According to PI Order No.: 2.352:2014
235
236 5.2.2 CommunicationProfile definition

237 IEC 62769-4 defines a CommunicationProfileT string for the Catalog XML schema. The PROFINET

238 specific value shall be "profinet_io".
239 5.2.3 Profile device

240 A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server to leverage

241 a generic device description, if a specific one is not available. The definitions in Table 3 focus on catalog

242 content that is vendor independent.
243 Table 3 – Catalog values for profile devices
Element Attribute Content
PackageType — Profile
Manufacturer — Empty

DeviceModel — Allowed profile identifier values (PROFILE_ID) are provided by PROFIBUS

& PROFINET International (PI). PI provides and maintains a XML file
(Profile_ID_Table) containing the assignment of PROFILE_ID to profiles.
It is available at
The file can be downloaded by any engineering or service tool whenever it's
connected to the Internet.
NOTE More information is provided in PI Order No.: 3.502 (I&M Profile) and
related profile definitions referred therein.
The string format shall be hexadecimal starting with 0x, e.g. ‘0x3D00’.
244
245 5.2.4 Protocol version information

246 IEC 62769-4 defines an element type named InterfaceT for the Catalog XML schema. The element type

247 InterfaceT contains an element named Version which is supposed to provide version information about

248 the applied communication protocol profile. The value has to follow the IEC 62769-4 defined version

249 information schema defined in the element type VersionT. Table 4 describes how to apply the currently

250 known protocol versions defined by the non-profit consortium PROFIBUS & PROFINET International. The

251 general rule is to apply the value “0” for parts of the version information according to IEC 62769-4 that are

252 not used in currently known protocol versions.
253 Table 4 – Version mapping examples
Protocol / Version InterfaceT Version value
PROFINET Version 2.3 2.3.0

NOTE 1 This Table is just an example since this document cannot foresee how future

protocol versions will be defined.
NOTE 2 The currently known PROFINET protocol revision information provides major
and minor version information. Leading zeros are not considered in version value
evaluation since only the actual decimal values are relevant.
254
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255 5.3 Associating a Package with a device
256 5.3.1 Device type identification mapping

257 The purpose of a device type identification mapping is to enable FDI host systems to compare the scan

258 result against the topology representation in the Information Model. FDI host systems shall also be enabled

259 to determine the FDI Device Package that fits for a device entry contained in the scan result. This will

260 enable the user of an FDI host system to synchronize the Information Model with the actual installation.

261 The communication server implemented scan service (defined in 5.6.1.7) provides a scan result through

262 an XML document (schema defined in Annex A).

263 The Gateway implemented scan service (defined in 5.6.2.7) provides a scan result by means of the

264 Information Model that contains data structures created from EDD content as specified in 5.6.2.7.

265 Common for both ways of presenting the scan result is that scan results contain device type identification

266 and device instance identification.

267 FDI host systems comparing the actual network topology configuration against the topology representation

268 in the Information Model shall be enabled to handle the following situations:

269 a) The physical Device instance identified at a specific device address is not logically present in the

270 Information model (as Instance): Enable the FDI Host system to find the appropriate FDI Device

271 package according to the device catalogue information.

272 b) The physical Device instance identified by the device address is logically present in the Information

273 Model (as Instance): Enable the FDI Host system to compare the device type information presented in

274 the scan result (see the identification in Clause A.6 and 5.6.2.7) and the device type specific

275 information of the Instance present in the Information Model.

276 The FDI Device package contains device type identification information that can be compared to the scan

277 result based on the Catalog Schema in IEC 62769-4 which defines the X
...