SIST EN IEC 62769-103-4:2020
(Main)Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET (IEC 62769-103-4:2020)
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET (IEC 62769-103-4:2020)
This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4,
IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET1).
Feldgeräteintegration (FDI) - Teil 103-4: Profile - PROFINET (IEC 62769-103-4:2020)
Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET (IEC 62769-103-4:2020)
IEC 62769-103-4:2020 est disponible sous forme de IEC 62769-103-4:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
a) prise en charge d’extensions de protocoles génériques, pour une adoption plus rapide d’autres technologies;
b) capacité offerte aux Développeurs de Paquetages d’élaborer des EDD ciblant les systèmes actuels de bases EDD, en exploitant un seul outil de développement.
Vključitev procesne naprave (FDI) - 103-4. del: Profili - PROFINET (IEC 62769-103-4:2020)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 62769-103-4:2020
01-oktober-2020
Nadomešča:
SIST EN 62769-103-4:2015
Vključitev procesne naprave (FDI) - 103-4. del: Profili - PROFINET (IEC 62769-103-
4:2020)
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET (IEC 62769-103-
4:2020)
Feldgeräteintegration (FDI) - Teil 103-4: Profile - PROFINET (IEC 62769-103-4:2020)
Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET (IEC 62769-
103-4:2020)
Ta slovenski standard je istoveten z: EN IEC 62769-103-4:2020
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
SIST EN IEC 62769-103-4:2020 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN IEC 62769-103-4:2020
---------------------- Page: 2 ----------------------
SIST EN IEC 62769-103-4:2020
EUROPEAN STANDARD EN IEC 62769-103-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2020
ICS 25.040.40; 35.100.05 Supersedes EN 62769-103-4:2015 and all of its
amendments and corrigenda (if any)
English Version
Field device integration (FDI) - Part 103-4: Profiles - PROFINET
(IEC 62769-103-4:2020)
Intégration des appareils de terrain (FDI) - Partie 103-4: Feldgeräteintegration (FDI) - Teil 103-4: Profile -
Profils - PROFINET PROFINET
(IEC 62769-103-4:2020) (IEC 62769-103-4:2020)
This European Standard was approved by CENELEC on 2020-06-02. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62769-103-4:2020 E
---------------------- Page: 3 ----------------------
SIST EN IEC 62769-103-4:2020
EN IEC 62769-103-4:2020 (E)
European foreword
The text of document 65E/623/CDV, future edition 2 of IEC 62769-103-4, prepared by SC 65E
"Devices and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement,
control and automation" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62769-103-4:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-03-02
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-06-02
document have to be withdrawn
This document supersedes EN 62769-103-4:2015 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62769-103-4:2020 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61784-1 NOTE Harmonized as EN IEC 61784-1
IEC 61804-4 NOTE Harmonized as EN 61804-4
2
---------------------- Page: 4 ----------------------
SIST EN IEC 62769-103-4:2020
EN IEC 62769-103-4:2020 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61158-5-10 - Industrial communication networks - EN IEC 61158-5-10 -
Fieldbus specifications - Part 5-10:
Application layer service definition - Type
10 elements
IEC 61784-2 - Industrial communication networks - EN IEC 61784-2 -
Profiles - Part 2: Additional fieldbus
profiles for real-time networks based on
ISO/IEC/IEEE 8802-3
IEC 61804 series Function blocks (FB) for process control EN IEC 61804 series
and electronic device description
language (EDDL)
IEC 62541-100 2015 OPC Unified Architecture - Part 100: EN 62541-100 2015
Device Interface
IEC 62769-2 - Field Device Integration (FDI) - Part 2: - -
FDI Client
IEC 62769-4 - Field Device Integration (FDI) - Part 4: - -
FDI Packages
IEC 62769-5 - Field Device Integration (FDI) - Part 5: - -
FDI Information Model
IEC 62769-6 - Field Device Integration (FDI) - Part 6: - -
FDI Technology Mapping
IEC 62769-7 - Field Device Integration (FDI) - Part 7: - -
FDI Communication Devices
PI Order No: 2.122 2008 Specification for PROFIBUS - Device - -
Description and Device Integration -
Volume 1: GSD, V5.1, July 2008: GSD
PI Order No.: 2.352 2014 GSDML Specification for PROFINET IO - -
3
---------------------- Page: 5 ----------------------
SIST EN IEC 62769-103-4:2020
---------------------- Page: 6 ----------------------
SIST EN IEC 62769-103-4:2020
IEC 62769-103-4
®
Edition 2.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 103-4: Profiles – PROFINET
Intégration des appareils de terrain (FDI) –
Partie 103-4: Profils – PROFINET
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-8139-0
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 62769-103-4:2020
– 2 – IEC 62769-103-4:2020 © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
3.3 Conventions . 7
3.3.1 EDDL syntax. 7
3.3.2 XML syntax . 7
3.3.3 Capitalizations . 7
4 Profile for PROFINET . 8
4.1 General . 8
4.2 Catalog profile . 8
4.2.1 Protocol support file . 8
4.2.2 CommunicationProfile definition . 9
4.2.3 Profile device . 9
4.2.4 Protocol version information . 9
4.3 Associating a Package with a device . 10
4.3.1 Device type identification mapping . 10
4.3.2 Device type revision mapping . 11
4.4 Information Model mapping . 12
4.4.1 ProtocolType definition . 12
4.4.2 DeviceType mapping . 12
4.4.3 FunctionalGroup identification definition . 13
4.5 Topology elements . 13
4.5.1 ConnectionPoint definition . 13
4.5.2 Communication Device definition . 15
4.5.3 Communication service provider definition . 16
4.5.4 Network definition . 17
4.6 Methods . 17
4.6.1 Methods for FDI Communication Servers . 17
4.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 28
A.1 General . 28
A.2 Network . 28
A.3 ProfinetNetworkT . 28
A.4 ProfinetConnectionPointT . 28
A.5 ProfinetIdentificationT . 29
A.6 MACT . 30
A.7 IPv4T . 30
A.8 IPv6T . 30
A.9 DNSNameT . 30
A.10 Hex4DigitT . 30
Annex B (normative) Transfer service parameters . 31
B.1 General . 31
B.2 sendData . 31
---------------------- Page: 8 ----------------------
SIST EN IEC 62769-103-4:2020
IEC 62769-103-4:2020 © IEC 2020 – 3 –
B.3 receiveData . 31
B.4 TransferSendDataT . 31
B.5 TransferResultDataT . 32
B.6 OperationT . 32
Bibliography . 33
Figure 1 – Version mapping problem . 11
Table 1 – ProtocolSupportFile for FDI Device Packages . 8
Table 2 – ProtocolSupportFile for FDI Communication Packages . 9
Table 3 – Catalog values for profile devices . 9
Table 4 – Version mapping examples . 10
Table 5 – Device identification information mapping . 11
Table 6 – Protocol type Profinet_IO . 12
Table 7 – DeviceType Property mapping . 13
Table 8 – PROFINET identification type definition . 13
Table 9 – ConnectionPoint type for Profinet_IO . 14
Table 10 – Method Connect arguments . 18
Table 11 – Method Disconnect arguments . 18
Table 12 – Method Transfer arguments . 19
Table 13 – Method SetAddress arguments . 20
Table 14 – Method Connect arguments . 22
Table 15 – Method Transfer arguments . 23
Table 16 – Method SetAddress arguments . 25
Table A.1 – Elements of ProfinetNetworkT . 28
Table A.2 – Attributes of ProfinetConnectionPointT . 29
Table A.3 – Elements of ProfinetConnectionPointT . 29
Table A.4 – Attributes of ProfinetIdentificationT . 29
Table B.1 – Attributes of TransferSendDataT . 32
Table B.2 – Attributes of TransferResultDataT . 32
---------------------- Page: 9 ----------------------
SIST EN IEC 62769-103-4:2020
– 4 – IEC 62769-103-4:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 103-4: Profiles – PROFINET
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62769-103-4 has been prepared by subcommittee 65E: Devices and
integration in enterprise systems, of IEC technical committee 65: Industrial-process
measurement, control and automation.
This second edition cancels and replaces the first edition published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system under
a single development tool.
---------------------- Page: 10 ----------------------
SIST EN IEC 62769-103-4:2020
IEC 62769-103-4:2020 © IEC 2020 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
65E/686A/RVC
65E/623/CDV
65E/686/RVC
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62769 series, published under the general title Field Device
Integration (FDI), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
---------------------- Page: 11 ----------------------
SIST EN IEC 62769-103-4:2020
– 6 – IEC 62769-103-4:2020 © IEC 2020
FIELD DEVICE INTEGRATION (FDI) –
Part 103-4: Profiles – PROFINET
1 Scope
This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4,
1
IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET ).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61158-5-10, Industrial communication networks - Fieldbus specifications - Part 5-10:
Application layer service definition - Type 10 elements
IEC 61784-2, Industrial communication networks - Profiles - Part 2: Additional fieldbus profiles
for real-time networks based on ISO/IEC/IEEE 8802-3
IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device
Description Language (EDDL)
IEC 62541-100:2015, OPC Unified Architecture - Part 100: Device Interface
IEC 62769-2, Field Device Integration (FDI) - Part 2: FDI Client
IEC 62769-4, Field Device Integration (FDI) - Part 4: FDI Packages
IEC 62769-5, Field Device Integration (FDI) - Part 5: FDI Information Model
IEC 62769-6, Field Device Integration (FDI) - Part 6: FDI Technology Mapping
IEC 62769-7, Field Device Integration (FDI) - Part 7: FDI Communication Devices
PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device
Integration – Volume 1: GSD, V5.1, July 2008: GSD; available at
PI Order No.: 2.352:2014, GSDML Specification for PROFINET IO; available at
___________
1 PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information
is given for the convenience of users of this document and does not constitute an endorsement by IEC of the
trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade
name requires permission of the trade name holder.
---------------------- Page: 12 ----------------------
SIST EN IEC 62769-103-4:2020
IEC 62769-103-4:2020 © IEC 2020 – 7 –
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61158-5-10,
IEC 61784-2, IEC 61804 (all parts), IEC 62541-100, IEC 62769-2, IEC 62769-4, IEC 62769-5,
IEC 62769-6, IEC 62769-7 and PI Order No.: 2.352:2014 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms
For the purposes of this document, the following abbreviated terms and acronyms apply:
DCP Discovery and basic configuration protocol (according to IEC 61158-5-10)
DNS Domain name system
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804)
GSD General station description (see PI Order No.: 2.122:2008)
GSDML GSD markup language (see PI Order No.: 2.352:2014)
IP Internet protocol (IETF RFC 791)
UIP User Interface plug-in
UUID Universal unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
3.3 Conventions
3.3.1 EDDL syntax
This part of IEC 62769 specifies content for the EDD component that is part of FDI
Communication Packages. The specification content using EDDL syntax uses the font Courier
New. The EDDL syntax is used for method signature, variable, data structure and component
declarations.
3.3.2 XML syntax
XML syntax examples use the font Courier New. The XML syntax is used to describe XML
document schema.
Example:
3.3.3 Capitalizations
IEC 62769 (all parts) uses capitalized terms to emphasize that these terms have an FDI specific
meaning.
Some of these terms using an acronym as a prefix for example
• FDI Client, or
• FDI Server.
---------------------- Page: 13 ----------------------
SIST EN IEC 62769-103-4:2020
– 8 – IEC 62769-103-4:2020 © IEC 2020
Some of these terms are compound terms such as:
• Communication Servers, or
• Profile for Package.
Parameter names or attributes are concatenated to a single term, where the original terms
starting in this term with a capital letter such as:
• ProtocolSupportFile, or
• ProtocolType.
Parameter names or attributes can also be constructed by using an underscore character to
concatenate two or more terms such as:
• PROFILE_ID, or
• Profinet_PA_Network.
4 Profile for PROFINET
4.1 General
This profile document to the FDI specification in IEC 62769 specifies the protocol specifics
needed for FDI Packages describing Communication Servers, Gateways and Devices.
For Communication Servers this document defines also protocol specifics as these need to be
considered in the Communication Servers hosted Information Model.
4.2 Catalog profile
4.2.1 Protocol support file
4.2.1.1 FDI Device Package
A GSD file is a mandatory Attachment for FDI Device Packages representing PROFINET IO
devices.
Protocol specific attachments are mentioned in the Package Catalog as defined in
IEC 62769-5. A communication feature list mark-up language (GSDML) file according to PI
Order No.: 2.352:2014 is a mandatory attachment for FDI Device Packages representing
PROFINET devices. Table 1 specifies the parameters of ProtocolSupportFile in the FDI Device
Package.
Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/xml
Root Namespace Empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.352:2014
4.2.1.2 FDI Communication Package
A GSDML file as specified in ISO 15745 4:2003/AMD1:2006, is an optional attachment for FDI
Communication Packages representing PROFINET IO devices. Table 2 specifies the
parameters of ProtocolSupportFile for FDI Communication Packages.
---------------------- Page: 14 ----------------------
SIST EN IEC 62769-103-4:2020
IEC 62769-103-4:2020 © IEC 2020 – 9 –
Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type text/xml
Root Namespace Empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.352:2014
4.2.2 CommunicationProfile definition
IEC 62769-4 defines a CommunicationProfileT string for the Catalog XML schema. The
PROFINET specific value shall be "profinet_io".
4.2.3 Profile device
A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server
to leverage a generic device description, if a specific one is not available. The definitions in
Table 3 focus on catalog content that is vendor independent.
Table 3 – Catalog values for profile devices
Element Attribute Content
PackageType — Profile
Manufacturer — Empty
DeviceModel — Allowed profile identifier values (PROFILE_ID) are provided by
PROFIBUS & PROFINET International (PI). PI provides and
maintains a XML file (Profile_ID_Table) containing the assignment of
PROFILE_ID to profiles.
It is available at
The file can be downloaded by any engineering or service tool
whenever it's connected to the Internet.
NOTE More information is provided in PI Order No.: 3.502 (I&M
Profile) and related profile definitions referred therein.
The string format shall
...
SLOVENSKI STANDARD
oSIST prEN IEC 62769-103-4:2018
01-december-2018
9NOMXþLWHYSURFHVQHQDSUDYH )', GHO 3URILOL352),1(7
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
Feldgeräteintegration (FDI) - Teil 103-4: Profile - PROFINET
Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET
Ta slovenski standard je istoveten z: prEN IEC 62769-103-4:2018
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
oSIST prEN IEC 62769-103-4:2018 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
oSIST prEN IEC 62769-103-4:2018
---------------------- Page: 2 ----------------------
oSIST prEN IEC 62769-103-4:2018
65E/623/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62769-103-4 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2018-10-05 2018-12-28
SUPERSEDES DOCUMENTS:
65E/542/RR
IEC SC 65E : DEVICES AND INTEGRATION IN ENTERPRISE SYSTEMS
SECRETARIAT: SECRETARY:
United States of America Mr Donald (Bob) Lattimer
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
TITLE:
Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
PROPOSED STABILITY DATE: 2023
NOTE FROM TC/SC OFFICERS:
Copyright © 2018 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
---------------------- Page: 3 ----------------------
oSIST prEN IEC 62769-103-4:2018
---------------------- Page: 4 ----------------------
oSIST prEN IEC 62769-103-4:2018
IEC CDV 62769-103-4 © IEC 2018 – 2 – 65E/623/CDV
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
3.3 Conventions . 7
3.3.1 EDDL syntax . 7
3.3.2 XML syntax . 7
3.3.3 Capitalizations . 7
4 Profile for PROFINET . 8
4.1 General . 8
4.2 Catalog profile . 8
4.2.1 Protocol support file . 8
4.2.2 CommunicationProfile definition . 9
4.2.3 Profile device . 9
4.2.4 Protocol version information . 9
4.3 Associating a Package with a device . 10
4.3.1 Device type identification mapping . 10
4.3.2 Device type revision mapping . 11
4.4 Information Model mapping . 12
4.4.1 ProtocolType definition . 12
4.4.2 DeviceType mapping . 12
4.4.3 FunctionalGroup identification definition . 13
4.5 Topology elements . 13
4.5.1 ConnectionPoint definition . 13
4.5.2 Communication Device definition . 15
4.5.3 Communication service provider definition. 16
4.5.4 Network definition . 17
4.6 Methods . 17
4.6.1 Methods for FDI Communication Servers . 17
4.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 29
A.1 General . 29
A.2 Network . 29
A.3 ProfinetNetworkT . 29
A.4 ProfinetConnectionPointT . 29
A.5 ProfinetIdentificationT . 30
A.6 MACT . 30
A.7 IPv4T. 31
A.8 IPv6T. 31
---------------------- Page: 5 ----------------------
oSIST prEN IEC 62769-103-4:2018
65E/623/CDV – 3 – IEC CDV 62769-103-4 © IEC 2018
A.9 DNSNameT . 31
A.10 Hex4DigitT . 31
Annex B (normative) Transfer service parameters . 32
B.1 General . 32
B.2 sendData . 32
B.3 receiveData . 32
B.4 TransferSendDataT . 32
B.5 TransferResultDataT . 33
B.6 OperationT . 33
Bibliography . 34
Figure 1 – Version mapping problem . 11
Table 1 – ProtocolSupportFile for FDI Device Packages . 8
Table 2 – ProtocolSupportFile for FDI Communication Packages. 9
Table 3 – Catalog values for profile devices . 9
Table 4 – Version mapping examples . 9
Table 5 – Device identification information mapping . 11
Table 6 – Protocol type Profinet_IO . 12
Table 7 – DeviceType Property mapping . 13
Table 8 – PROFINET identification type definition . 13
Table 9 – ConnectionPoint type for Profinet_IO . 14
Table 10 – Method Connect arguments . 18
Table 11 – Method Disconnect arguments . 19
Table 12 – Method Transfer arguments . 20
Table 13 –Method SetAddress arguments . 21
Table 14 – Method Connect arguments . 23
Table 15 – Method Transfer arguments . 25
Table 16 – Method SetAddress arguments . 26
Table A.1 – Elements of ProfinetNetworkT . 29
Table A.2 – Attributes of ProfinetConnectionPointT . 30
Table A.3 – Elements of ProfinetConnectionPointT . 30
Table A.4 – Attributes of ProfinetIdentificationT . 30
Table B.1– Attributes of TransferSendDataT. 33
Table B.2– Attributes of TransferResultDataT . 33
---------------------- Page: 6 ----------------------
oSIST prEN IEC 62769-103-4:2018
IEC CDV 62769-103-4 © IEC 2018 – 4 – 65E/623/CDV
1 INTERNATIONAL ELECTROTECHNICAL COMMISSION
2 ____________
3
4 FIELD DEVICE INTEGRATION (FDI) –
5
6 Part 103-4: Profiles – PROFINET
7
8 FOREWORD
9 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
10 national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-
11 operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
12 addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
13 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation
14 is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
15 participate in this preparatory work. International, governmental and non-governmental organizations liaising with
16 the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
17 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
18 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
19 consensus of opinion on the relevant subjects since each technical committee has representation from all
20 interested IEC National Committees.
21 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
22 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
23 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
24 misinterpretation by any end user.
25 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
26 transparently to the maximum extent possible in their national and regional publications. Any divergence between
27 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
28 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
29 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
30 services carried out by independent certification bodies.
31 6) All users should ensure that they have the latest edition of this publication.
32 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
33 members of its technical committees and IEC National Committees for any personal injury, property damage or
34 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
35 arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
36 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
37 indispensable for the correct application of this publication.
38 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
39 rights. IEC shall not be held responsible for identifying any or all such patent rights.
40 International Standard IEC 62769-103-4 has been prepared by subcommittee 65E: Devices and
41 integration in enterprise systems, of IEC technical committee 65: Industrial-process
42 measurement, control and automation.
43 This second edition cancels and replaces the first edition published in 2015. This edition
44 constitutes a technical revision.
45 This edition includes the following significant technical changes with respect to the previous
46 edition:
47 a) support for generic protocol extension for faster adoption of other technologies;
48 b) support for Package Developers to build EDDs targeted for today’s EDD bases system under
49 a single development tool;
50 The text of this International Standard is based on the following documents:
---------------------- Page: 7 ----------------------
oSIST prEN IEC 62769-103-4:2018
65E/623/CDV – 5 – IEC CDV 62769-103-4 © IEC 2018
FDIS Report on voting
65E/XX/FDIS 65E/XX/RVD
51
52 Full information on the voting for the approval of this International Standard can be found in the
53 report on voting indicated in the above table.
54 This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
55 The committee has decided that the contents of this document will remain unchanged until the
56 stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
57 the specific document. At this date, the document will be
58 • reconfirmed,
59 • withdrawn,
60 • replaced by a revised edition, or
61 • amended.
62
63 The National Committees are requested to note that for this document the stability date
64 is 2023.
65 THIS TEXT IS INCLUDED FOR THE INFORMATION OF THE NATIONAL COMMITTEES AND WILL BE DELETED
66 AT THE PUBLICATION STAGE.
67
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
68
---------------------- Page: 8 ----------------------
oSIST prEN IEC 62769-103-4:2018
IEC CDV 62769-103-4 © IEC 2018 – 6 – 65E/623/CDV
69 FIELD DEVICE INTEGRATION (FDI) –
70
71 Part 103-1: Profiles – PROFINET
72
73 1 Scope
74 This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4,
1
75 IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET ).
76 2 Normative references
77 The following documents are referred to in the text in such a way that some or all of their content
78 constitutes requirements of this document. For dated references, only the edition cited applies.
79 For undated references, the latest edition of the referenced document (including any
80 amendments) applies.
81 IEC 61158-5-10, Industrial communication networks – Fieldbus specifications – Part 5-10:
82 Application layer service definition – Type 10 elements
83 IEC 61784-2, Industrial communication networks – Profiles – Part 2: Additional fieldbus profiles
84 for real-time networks based on ISO/IEC 8802-3
85 IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device Description
86 Language (EDDL)
87 IEC 62541-100:–, OPC Unified Architecture – Part 100: OPC UA for Devices
88 IEC Error! Unknown document property name.-2, Field Device Integration (FDI) – Part 2: FDI
89 Client
90 IEC Error! Unknown document property name.-4, Field Device Integration (FDI) – Part 4: FDI
91 Packages
92 IEC Error! Unknown document property name.-5, Field Device Integration (FDI) – Part 5: FDI
93 Information Model
94 IEC Error! Unknown document property name.-6, Field Device Integration (FDI) – Part 6: FDI
95 Technology Mapping
96 IEC Error! Unknown document property name.-7, Field Device Integration (FDI) – Part 7: FDI
97 Communication Devices
98 PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device
99 Integration – Volume 1: GSD, V5.1, July 2008: GSD; available at
100 PI Order No.: 2.352:2014, GSDML Specification for PROFINET IO; available at
101
1
PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for
the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any
of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade
name holder.
---------------------- Page: 9 ----------------------
oSIST prEN IEC 62769-103-4:2018
65E/623/CDV – 7 – IEC CDV 62769-103-4 © IEC 2018
102 3 Terms, definitions, abbreviated terms and conventions
103 3.1 Terms and definitions
104 For the purposes of this document, the terms and definitions given in IEC 61158-5-10, IEC
105 61784-2, IEC 61804 series, IEC 62541-100, IEC 62769-2, IEC 62769-4, IEC 62769-5,
106 IEC 62769-6, IEC 62769-7 and PI Order No.: 2.352:2014 apply.
107 3.2 Abbreviated terms
108 For the purposes of this document, the following abbreviated terms and acronyms apply:
DCP Discovery and basic configuration protocol (according to IEC 61158-
5-10)
DNS Domain name system
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804)
GSD General station description (see PI Order No.: 2.122:2008)
GSDML GSD markup language (see PI Order No.: 2.352:2014)
IP Internet protocol (RFC 791)
UIP User Interface plug-in
UUID Universal unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
109 3.3 Conventions
110 3.3.1 EDDL syntax
111 This part of IEC 62769 specifies content for the EDD component that is part of FDI
112 Communication Packages. The specification content using EDDL syntax uses the font Courier
113 New. The EDDL syntax is used for method signature, variable, data structure and component
114 declarations.
115 3.3.2 XML syntax
116 XML syntax examples use the font Courier New. The XML syntax is used to describe XML
117 document schema.
118 Example:
119 3.3.3 Capitalizations
120 The IEC 62769 series uses capitalized terms to emphasize that these terms have an FDI specific
121 meaning.
122 Some of these terms using an acronym as a prefix for example
123 • FDI Client, or
124 • FDI Server.
125 Some of these terms are compound terms such as:
126 • Communication Servers, or
---------------------- Page: 10 ----------------------
oSIST prEN IEC 62769-103-4:2018
IEC CDV 62769-103-4 © IEC 2018 – 8 – 65E/623/CDV
127 • Profile for Package.
128 Parameter names or attributes are concatenated to a single term, where the original terms
129 starting in this term with a capital letter such as:
130 • ProtocolSupportFile, or
131 • ProtocolType.
132 Parameter names or attributes can also be constructed by using an underscore character to
133 concatenate two or more terms such as:
134 • PROFILE_ID, or
135 • Profinet_PA_Network
136 4 Profile for PROFINET
137 4.1 General
138 This profile document to the FDI specification in IEC 62769 specifies the protocol specifics
139 needed for FDI Packages describing Communication Servers, Gateways and Devices.
140 For Communication Servers this document defines also protocol specifics as these need to be
141 considered in the Communication Servers hosted Information Model.
142 4.2 Catalog profile
143 4.2.1 Protocol support file
144 4.2.1.1 FDI Device Package
145 A GSD file is a mandatory Attachment for FDI Device Packages representing PROFINET IO
146 devices.
147 Protocol specific attachments are mentioned in the Package Catalog as defined in
148 IEC Error! Unknown document property name.-5. A communication feature list mark-up
149 language (GSDML) file according to PI Order No.: 2.352:2014 is a mandatory attachment for FDI
150 Device Packages representing PROFINET devices. Table 1 specifies the parameters of
151 ProtocolSupportFile in the FDI Device Package.
152 Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/xml
Root Namespace Empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.352:2014.
153
154 4.2.1.2 FDI Communication Package
155 A GSDML file as specified in ISO 15745 4:2003, Amd1, is an optional attachment for FDI
156 Communication Packages representing PROFINET IO devices. Table 2 specifies the parameters
157 of ProtocolSupportFile for FDI Communication Packages.
---------------------- Page: 11 ----------------------
oSIST prEN IEC 62769-103-4:2018
65E/623/CDV – 9 – IEC CDV 62769-103-4 © IEC 2018
158 Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type text/xml
Root Namespace Empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.352:2014
159
160 4.2.2 CommunicationProfile definition
161 IEC Error! Unknown document property name.-4 defines a CommunicationProfileT string for
162 the Catalog XML schema. The PROFINET specific value shall be "profinet_io".
163 4.2.3 Profile device
164 A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server to
165 leverage a generic device description, if a specific one is not available. The definitions in Table 3
166 focus on catalog content that is vendor independent.
167 Table 3 – Catalog values for profile devices
Element Attribute Content
PackageType — Profile
Manufacturer — Empty
DeviceModel — Allowed profile identifier values (PROFILE_ID) are provided by PROFIBUS
& PROFINET International (PI). PI provides and maintains a XML file
(Profile_ID_Table) containing the assignment of PROFILE_ID to profiles.
It is available at
The file can be downloaded by any engineering or service tool whenever
it's connected to the Internet.
NOTE More information is provided in PI Order No.: 3.502 (I&M Profile)
and related profile definitions referred therein.
The string format shall be hexadecimal starting with 0x, e.g. ‘0x3D00’.
168
169 4.2.4 Protocol version information
170 IEC Error! Unknown document property name.-4 defines an element type named InterfaceT
171 for the Catalog XML schema. The element type InterfaceT contains an element named Version
172 which is supposed to provide version information about the applied communication protocol
173 profile. The value has to follow the IEC Error! Unknown document property name.-4 defined
174 version information schema defined in the element type VersionT. Table 4describes how to apply
175 the currently known protocol versions defined by the non-profit consortium PROFIBUS & PROFINET
176 International. The general rule is to apply the value “0” for parts of the version information according to
177 IEC Error! Unknown document property name.-4 that are not used in currently known protocol
178 versions.
179 Table 4 – Version mapping examples
Protocol / Version InterfaceT Version value
PROFINET Version 2.3 2.3.0
NOTE 1 This Table is just an example since this document cannot foresee how future
protocol versions will be defined.
---------------------- Page: 12 ----------------------
oSIST prEN IEC 62769-103-4:2018
IEC CDV 62769-103-4 © IEC 2018 – 10 – 65E/623/CDV
Protocol / Version InterfaceT Version value
NOTE 2 The currently known PROFINET protocol revision information provides major
and minor version information. Leading zeros are not considered in version value
evaluation since only the actual decimal values are relevant.
180
181 4.3 Associating a Package with a device
182 4.3.1 Device type identification mapping
183 The purpose of a device type identification mapping is to enable FDI host systems to compare
184 the scan result against the topology representation in the Information Model. FDI host systems
185 shall also be enabled to determine the FDI Device Package that fits for a device entry contained
186 in the scan result. This will enable the user of an FDI host system to synchronize the Information
187 Model with the actual installation.
188 The communication server implemented scan service (defined in 4.6.1.7) provides a scan result
189 through an XML document (schema defined in Annex A).
190 The Gateway implemented scan service (defined in 4.6.2.7) provides a scan result by means of
191 the Information Model that contains data structures created from EDD content as specified in
192 4.6.2.7.
193 Common for both ways of presenting the scan result is that scan results contain device type
194 identification and device instance identification.
195 FDI host systems comparing the actual network topology configuration against the topology
196 representation in the Information Model shall be enabled to handle the following situations:
197 c) The physical Device instance identified at a specific device address is not logically present in
198 the Information model (as Instance): Enable the FDI Host system to find the appropriate FDI
199 Device package according to the device catalogue information.
200 d) The physical Device instance identified by the device address is logically present in the
201 Information Model (as Instance): Enable the FDI Host system to compare the device type
202 information presented in the scan result (see the identification in Clause A.5 and 4.6.2.7) and
203 the device type specific information of the Instance present in the Information Model.
204 The FDI Device package contains device type identification information that can be compared to
205 the scan result based on the Catalog Schema in IEC Error! Unknown document property
206 name.-4 which defines the XML element (simple) type “DeviceModel” and “Manufacturer”. Both
207 types are used in (complex) element types “Protocol” and “RegDeviceType”.
208 As a result of the FDI Package deployment the FDI Package information is then present in the
209 Information Model as specified FunctionalGroup Identification containing VendorID and DeviceID
210 (see 4.4.3).
211 The mapping between different device identification data sources is describe
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.