SIST
SIST HD 307.3.1 S1:1998
(Main)Specification for solventless polymerisable resinous compounds used for electrical insulation -- Part 3: Specifications for individual materials -- Sheet 1: Unfilled epoxy resinous compounds
Specification for solventless polymerisable resinous compounds used for electrical insulation -- Part 3: Specifications for individual materials -- Sheet 1: Unfilled epoxy resinous compounds
Applies to unfilled epoxy resinous compounds in the cured form for classes EP-U-1 to 6. Specifies mechanical, electrical and thermal requirements.
Bestimmungen für Reaktionsharzmassen und -formstoffe in der Elektrotechnik -- Teil 3: Bestimmungen für besondere Stoffe -- Blatt 1: Ungefüllte Epoxidharzformstoffe
Spécification relative aux composés résineux polymérisables sans solvant utilisés comme isolants électriques -- Partie 3: Spécifications pour matériaux particuliers -- Feuille 1: Composés résineux époxydés sans charge
S'applique aux composés résineux époxydes sans charge des classes EP-U-1 à 6. Spécifie les exigences mécaniques, électriques et thermiques.
Specification for solventless polymerisable resinous compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 1: Unfilled epoxy resinous compounds (IEC 60455-3-1:1981)
General Information
Status
Withdrawn
Publication Date
30-Sep-1998
Withdrawal Date
11-Mar-2009
Technical Committee
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
06-Mar-2009
Due Date
29-Mar-2009
Completion Date
12-Mar-2009
Relations
Effective Date
13-May-2010
Effective Date
07-Jun-2022
Questions, Comments and Discussion
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