SIST EN 60512-27-100:2012

Connectors for electronic equipment - Tests and measurements - Part 27-100: Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors - Tests 27a to 27g

This part of IEC 60512 specifies the test methods for transmission performance for IEC 60603-7 series connectors up to 500 MHz. It is also suitable for testing lower frequency connectors if they meet the requirements of the detail specifications and of this standard. The test methods provided here are: - insertion loss, test 27a; - return loss, test 27b; - near-end crosstalk (NEXT) test 27c; - far-end crosstalk (FEXT), test 27d; - transverse conversion loss (TCL), test 27f; - transverse conversion transfer loss (TCTL), test 27g; For the transfer impedance (Zt) test, see IEC 60512-26-100, test 26e. For the coupling attenuation, see IEC 62153-4-12.

Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 27-100: Signalintegritätsprüfungen bis 500 MHz an Steckverbindern der Reihe IEC 60603-7 - Prüfungen 27a bis 27g

Connecteurs pour équipements électroniques - Essais et mesures - Partie 27-100: Essais d'intégrité des signaux jusqu'à 500 MHz sur les connecteurs de la série CEI 60603-7 - Essais 27a à 27g

La CEI 60512-27-100:2011 spécifie les méthodes d'essai relatives aux performances de transmission des connecteurs de la série CEI 60603-7 jusqu'à 500 MHz. Elle est également applicable aux essais réalisés sur des connecteurs à fréquences plus basses s'ils satisfont aux exigences des spécifications particulières et de la présente norme.  Les méthodes d'essai spécifiées sont:  - perte d'insertion,  - affaiblissement de réflexion,  - paradiaphonie (NEXT),  - télédiaphonie (FEXT),  - perte de conversion transverse (TCL),  - perte de transfert de conversion transverse (TCTL). Pour l'essai d'impédance de transfert (Zt), voir la CEI 60512-26-100 et pour l'affaiblissement de couplage, voir la CEI 62153-4-12.

Konektorji za elektronsko opremo - Preskusi in meritve - 27-100. del: Preskušanje neokrnjenosti signalov do 500 MHz na konektorjih serije IEC 60603-7 - Preskusi od 27a do 27g

Ta del standarda IEC 60512 določa preskusne metode za lastnosti prenosa na konektorjih serije IEC 60603-7 do 500 MHz. Prav tako je primeren za preskušanje konektorjev z nižjimi frekvencami, če ustrezajo zahtevam podrobnih specifikacij in tega standarda. Tukaj so podane naslednje preskusne metode: – dodano dušenje, preskus 27a; – povratno dušenje, preskus 27b; – bližnji presluh (NEXT), preskus 27c; – daljni presluh (FEXT), preskus 27d; – prečno dušenje pretvorbe (TCL), preskus 27f; – prečno dušenje pretvorbe prenosa (TCTL), preskus 27g. Za preskus impedance prenosa (Zt) glejte IEC 60512-26-100, preskus 26e. Za slabljenje stikov glejte IEC 62153-4-12.

General Information

• Status: Published
• Publication Date: 22-Mar-2012
• ICS: 31.220.10 - Plug-and-socket devices. Connectors
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 20-Mar-2012
• Due Date: 25-May-2012
• Completion Date: 23-Mar-2012
• Ref Project: EN 60512-27-100:2012 - Connectors for electronic equipment - Tests and measurements - Part 27-100: Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors - Tests 27a to 27g

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60512-27-100:2012
01-maj-2012
Konektorji za elektronsko opremo - Preskusi in meritve - 27-100. del: Preskušanje
neokrnjenosti signalov do 500 MHz na konektorjih serije IEC 60603-7 - Preskusi od
27a do 27g
Connectors for electronic equipment - Tests and measurements - Part 27-100: Signal
integrity tests up to 500 MHz on IEC 60603-7 series connectors - Tests 27a to 27g
Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 27-100:
Signalintegritätsprüfungen bis 500 MHz an Steckverbindern der Reihe IEC 60603-7 -
Prüfungen 27a bis 27g
Connecteurs pour équipements électroniques - Essais et mesures - Partie 27-100:
Essais d'intégrité des signaux jusqu'à 500 MHz sur les connecteurs de la série CEI
60603-7 - Essais 27a à 27g
Ta slovenski standard je istoveten z: EN 60512-27-100:2012
ICS:
31.220.10 9WLþLLQYWLþQLFHNRQHNWRUML Plug-and-socket devices.
Connectors
SIST EN 60512-27-100:2012 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60512-27-100:2012

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SIST EN 60512-27-100:2012

EUROPEAN STANDARD
EN 60512-27-100

NORME EUROPÉENNE
February 2012
EUROPÄISCHE NORM

ICS 31.220.10


English version


Connectors for electronic equipment -
Tests and measurements -
Part 27-100: Signal integrity tests up to 500 MHz on IEC 60603-7 series
connectors -
Tests 27a to 27g
(IEC 60512-27-100:2011)


Connecteurs pour équipements Steckverbinder für elektronische
électroniques - Einrichtungen -
Essais et mesures - Mess- und Prüfverfahren -
Partie 27-100: Essais d'intégrité des Teil 27-100: Signalintegritätsprüfungen bis
signaux jusqu'à 500 MHz sur les 500 MHz an Steckverbindern der Reihe
connecteurs de la série CEI 60603-7 - IEC 60603-7 -
Essais 27a à 27g Prüfungen 27a bis 27g
(CEI 60512-27-100:2011) (IEC 60512-27-100:2011)



This European Standard was approved by CENELEC on 2012-01-11. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60512-27-100:2012 E

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SIST EN 60512-27-100:2012
EN 60512-27-100:2012 - 2 -
Foreword
The text of document 48B/2262/FDIS, future edition 1 of IEC 60512-27-100, prepared by SC 48B,
"Connectors", of IEC TC 48, "Electromechanical components and mechanical structures for electronic
equipment" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
EN 60512-27-100:2012.

The following dates are fixed:
(dop) 2012-10-11
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2015-01-11

standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 60512-27-100:2011 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60603-7-4 NOTE  Harmonized as EN 60603-7-4.
IEC 60603-7-5 NOTE  Harmonized as EN 60603-7-5.

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SIST EN 60512-27-100:2012
- 3 - EN 60512-27-100:2012
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60050-581 - International Electrotechnical Vocabulary - - -
Part 581: Electromechanical components for
electronic equipment


IEC 60512-1 - Connectors for electronic equipment - Tests EN 60512-1 -
and measurements -
Part 1: General


IEC 60512-1-100 - Connectors for electronic equipment - Tests EN 60512-1-100 -
and measurements -
Part 1-100: General - Applicable publications


IEC 60512-26-100 - Connectors for electronic equipment - Tests EN 60512-26-100 -
and measurements -
Part 26-100: Measurement setup, test and
reference arrangements and measurements
for connectors according to IEC 60603-7 -
Tests 26a to 26g


IEC 60603-7 Series Connectors for electronic equipment EN 60603-7 Series


IEC 60603-7 2008 Connectors for electronic equipment - EN 60603-7 2009
Part 7: Detail specification for 8-way,
unshielded, free and fixed connectors


IEC 61076-1 - Connectors for electronic equipment - Product EN 61076-1 -
requirements -
Part 1: Generic specification


IEC 61156 Series Multicore and symmetrical pair/quad cables - -
for digital communications -
Part 1: Generic specification


IEC 61169-16 - Radio-frequency connectors - EN 61169-16 -
Part 16: Sectional specification - RF coaxial
connectors with inner diameter of outer
conductor 7 mm (0,276 in) with screw
coupling - Characteristics impedance 50 ohms
(75 ohms) (type N)


IEC 62153-4-12 - Metallic communication cable test methods - - -
Part 4-12: Electromagnetic compatibility
(EMC) - Coupling attenuation or screening
attenuation of connecting hardware -
Absorbing clamp method

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SIST EN 60512-27-100:2012

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SIST EN 60512-27-100:2012

IEC 60512-27-100
®

Edition 1.0 2011-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Connectors for electronic equipment – Tests and measurements –
Part 27-100: Signal integrity tests up to 500 MHz on 60603-7 series connectors –
Tests 27a to 27g

Connecteurs pour équipements électroniques – Essais et mesures –
Partie 27-100: Essais d’intégrité des signaux jusqu’à 500 MHz sur les
connecteurs de la série CEI 60603-7 – Essais 27a à 27g

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XB
ICS 31.220.10 ISBN 978-2-88912-823-5

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 60512-27-100:2012
– 2 – 60512-27-100 © IEC:2011
CONTENTS
FOREWORD . 6
1 Scope and object . 8
2 Normative references . 8
3 Terms, definitions, acronyms and symbols . 9
3.1 Terms and definitions . 9
3.1.1 Test Free Connector (TFC) . 9
3.2 Acronyms . 9
3.3 Symbols . 10
4 Overall test arrangement . 10
4.1 Test instrumentation . 10
4.2 Coaxial cables and interconnect for network analysers . 11
4.3 Measurement precautions . 11
4.4 Balun requirements . 11
4.5 Interfacing . 12
4.6 Reference components for calibration . 13
4.6.1 Reference loads for calibration . 13
4.6.2 Reference cables for calibration . 14
4.7 Termination loads for termination of conductor pairs . 14
4.7.1 General . 14
4.7.2 Resistor terminations . 14
4.7.3 Balun terminations . 15
4.7.4 Termination types . 15
4.8 Termination of screens . 15
4.9 Test specimen and reference planes . 15
4.9.1 General . 15
4.9.2 Interconnections between device under test (DUT) and the
calibration plane . 16
5 Connector measurement up to 500 MHz . 17
5.1 General . 17
5.2 Insertion loss, Test 27a . 17
5.2.1 Object . 17
5.2.2 Free connector for insertion loss. 17
5.2.3 Test method . 17
5.2.4 Test set-up . 17
5.2.5 Procedure . 18
5.2.6 Test report . 18
5.2.7 Accuracy . 19
5.3 Return loss, Test 27b . 19
5.3.1 Object . 19
5.3.2 Free connector for return loss . 19
5.3.3 Test method . 19
5.3.4 Test set-up . 19
5.3.5 Procedure . 19
5.3.6 Test report . 19
5.3.7 Accuracy . 19
5.4 Near-end crosstalk (NEXT), Test 27c . 20

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SIST EN 60512-27-100:2012
60512-27-100 © IEC:2011 – 3 –
5.4.1 Object . 20
5.4.2 Free connector for NEXT . 20
5.4.3 Test method . 20
5.4.4 Test set-up . 20
5.4.5 Procedure . 21
5.4.6 Test report . 24
5.4.7 Accuracy . 24
5.5 Far-end crosstalk (FEXT), Test 27d . 24
5.5.1 Object . 24
5.5.2 Free connector for FEXT . 24
5.5.3 Test method . 24
5.5.4 Test set-up . 24
5.5.5 Procedure . 25
5.5.6 Test report . 25
5.5.7 Accuracy . 26
5.6 Transfer impedance (Zt) . 26
5.7 Transverse conversion loss (TCL), Test 27f . 26
5.7.1 Object . 26
5.7.2 Free connector for TCL . 26
5.7.3 Test method . 26
5.7.4 Test set-up . 26
5.7.5 Procedure . 27
5.7.6 Test report . 30
5.7.7 Accuracy . 30
5.8 Transverse conversion transfer loss (TCTL), Test 27g . 30
5.8.1 Object . 30
5.8.2 Free connector for TCTL . 30
5.8.3 Test method . 30
5.8.4 Test set-up . 30
5.8.5 Procedure . 31
5.8.6 Test report . 32
5.8.7 Accuracy . 32
5.9 Coupling attenuation . 32
6 Construction and qualification of TFCs for NEXT, FEXT and return loss
measurements . 32
6.1 General . 32
6.1.1 Introductory remarks . 32
6.1.2 Delay measurements . 33
6.2 TFC near-end crosstalk (NEXT). 36
6.2.1 General . 36
6.2.2 Procedure for mating a TFC to the direct fixture . 36
6.2.3 TFC NEXT loss measurement . 37
6.2.4 TFC NEXT loss requirements . 38
6.3 TFC far-end crosstalk (FEXT) . 39
6.3.1 TFC FEXT loss measurement . 39
6.3.2 TFC FEXT loss requirements . 39
6.4 TFC return loss . 40
6.4.1 General . 40
6.4.2 TFC return loss reverse direction qualification procedure . 40

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SIST EN 60512-27-100:2012
– 4 – 60512-27-100 © IEC:2011
6.4.3 Test plug return loss forward direction qualification procedure . 40
6.4.4 TFC return loss requirements . 46
6.5 Test fixtures for TFC testing . 47
6.5.1 Requirements for TFC direct fixtures . 47
Annex A (informative) Impedance controlled measurement fixture . 49
Annex B (normative) Termination of balun . 63
Bibliography . 65

Figure 1 – 180° hybrid used as a balun . 11
Figure 2 – Measurement configurations for test balun qualification . 13
Figure 3 – Calibration of reference loads . 14
Figure 4 – Resistor termination networks . 14
Figure 5 – Definition of reference planes. 16
Figure 6 – Measuring set-up . 18
Figure 7 – Example for NEXT measurements . 21
Figure 8 – Example for FEXT measurements for DM and CM terminations . 25
Figure 9 – Example of TCL measurement . 27
Figure 10 – Coaxial lead attenuation calibration. . 28
Figure 11 – Back-to-back balun insertion loss measurement . 28
Figure 12 – Configuration for balun CM insertion loss calibration . 29
Figure 13 – Schematic for balun CM insertion loss calibration . 29
Figure 14 – Example of TCTL measurement . 31
Figure 15 – Calibration and interface planes and port extensions . 33
Figure 16 – Examples of direct fixture short, open, load, and through artefacts . 35
Figure 17 – Modular free connector placed into the free connector clamp . 36
Figure 18 – Guiding the free connector into position . 37
Figure 19 – TFC direct fixture . 37
Figure 20 – illustration of TFC NEXT measurement in the forward direction . 38
Figure 21 – Example of suitable return loss de-embedding reference socket. 42
Figure 22 – Flow chart for determination of reference fixed connector S-parameters . 43
Figure 23 – Representation of a mated connection by two cascaded networks . 43
Figure 24 – Return loss de-embedding reference plug terminated with LOAD resistors . 44
Figure 25 – Return loss test plug calibration and interface planes . 44
Figure 26 – Flow chart of determination of return loss test plug properties . 46
Figure 27 – Direct fixture mating dimensions A . 47
Figure 28 – Direct fixture mating dimensions B . 48
Figure 29 – Direct fixture mating dimension C . 48
Figure A.1 – Test head assembly with baluns attached . 49
Figure A.2 – Test balun interface pattern . 50
Figure A.4 – Test head assembly showing shielding between baluns . 51
Figure A.5 – Balun test 2 fixture assembly . 52
Figure A.6 – Free connector direct fixture, DPMF-2 view 1 . 53
Figure A.7 – Free connector direct fixture, DPMF-2 view 2 . 53
Figure A.8 – Exploded assembly of the direct fixture . 54

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SIST EN 60512-27-100:2012
60512-27-100 © IEC:2011 – 5 –
Figure A.9 – PCB based free connector . 55
Figure A.10 – TP6A PCB based free connector assembly with adapter . 55
Figure A.11 – An example of a connecting hardware measurement configuration. 56
Figure A.12 – Test fixture interface . 57
Figure A.13 – Open calibration standard applied to test interface . 57
Figure A.14 – Short calibration standard applied to test interface . 58
Figure A.15 – Load calibration standard applied to test interface . 58
Figure A.16 – Back-to-back through standard applied to test interface . 59
Figure A.17 – TFC attached to the test interface . 59
Figure A.18 – Direct fixture mounted to the test head interface . 60
Figure A.19 – Calibration plane . 60
Figure A.20 – Through calibration . 61
Figure A.21 – Test setup for twisted-pair return 2 loss measurement . 61
Figure A.22 – Method to minimize distance between planes. 62
Figure B.1 – Balanced attenuator for balun centre tap grounded . 63
Figure B.2 – Balanced attenuator for balun centre tap open . 64

Table 1 – Test balun performance characteristics . 12
Table 2 – Interconnection return loss . 17
Table 3 – Uncertainty band of return loss measurement at frequencies below 100 MHz . 20
Table 4 – Uncertainty band of return loss measurement at frequencies above 100 MHz. 20
Table 5a – Free connector TFC NEXT loss limit vectors for connectors specified up to
100 MHz . 23
Table 5b – Free connector TFC NEXT loss limit vectors for connectors specified from
1-250 MHz and from 1 MHz to 500 MHz . 23
Table 6 – connecting hardware NEXT loss for Case 1 and Case 4 . 24
Table 7 – TFC NEXT loss ranges . 39
Table 8 – TFC FEXT loss ranges . 40
Table 9 – De-embedding return loss reference fixed connector assembly standard
vectors . 42
Table 10 – Return loss requirements for TFCs . 47
Table 11 – Direct fixture performance . 48

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SIST EN 60512-27-100:2012
– 6 – 60512-27-100 © IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________

CONNECTORS FOR ELECTRONIC EQUIPMENT –
TESTS AND MEASUREMENTS –

Part 27-100: Signal integrity tests up to 500 MHz
on 60603-7 series connectors –
Tests 27a to 27g

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense.
...