Standard Specification for Epoxy Molding Compounds

SCOPE
1.1 This specification covers requirements for epoxy thermosetting molding compounds. It provides for their identification, quality control, and purchase in such a manner that the purchaser and the seller can agree on the substantial similarity of different commercial lots or shipments.
1.2 The compounds covered under this specification consist of mixtures or blends of epoxy resins and curing agents intimately combined, in an unreacted or partially reacted condition, with fillers, reinforcements, colorants, and other chemical agents.
Note 1-The properties included in this specification are those required to identify the kinds of molding compounds covered. There may be other requirements necessary to define particular characteristics. These will be added to the specification as their inclusion becomes generally desirable and the necessary test data and methods become available. Note 2-There is no similar or equivalent ISO standard.

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09-Nov-1999
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ASTM D3013-99 - Standard Specification for Epoxy Molding Compounds
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D 3013 – 99
Standard Specification for
Epoxy Molding Compounds
This standard is issued under the fixed designation D 3013; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope* Insulating Materials for Testing
D 638 Test Method for Tensile Properties of Plastics
1.1 This specification covers requirements for epoxy ther-
D 648 Test Method for Deflection Temperature of Plastics
mosetting molding compounds. It provides for their identifica-
Under Flexural Load
tion, quality control, and purchase in such a manner that the
D 790 TestMethodsforFlexuralPropertiesofUnreinforced
purchaser and the seller can agree on the substantial similarity
and Reinforced Plastics and Electrical Insulating Materials
of different commercial lots or shipments.
D 883 Terminology Relating to Plastics
1.2 The compounds covered under this specification consist
D 1896 Practice for Transfer Molding Specimens of Ther-
of mixtures or blends of epoxy resins and curing agents
mosetting Compounds
intimately combined, in an unreacted or partially reacted
D 2863 Test Method for Measuring the Minimum Oxygen
condition, with fillers, reinforcements, colorants, and other
Concentration to Support Candle-Like Combustion of
chemical agents.
Plastics (Oxygen Index)
1.3 The values stated in SI units are to be regarded as the
D 3892 Practice for Packaging/Packing of Plastics
standard.
2.2 Military Standard:
NOTE 1—The properties included in this specification are those re-
MIL-STD-105 Sampling Procedures and Tables for Inspec-
quired to identify the kinds of molding compounds covered.There may be
tion by Attributes
other requirements necessary to define particular characteristics. These
will be added to the specification as their inclusion becomes generally
3. Terminology
desirable and the necessary test data and methods become available.
3.1 Definitions—Definitions of terms used in this specifica-
NOTE 2—There is no similar or equivalent ISO standard.
tion are in accordance with Terminology D 883.
2. Referenced Documents
2 4. Classification
2.1 ASTM Standards:
4.1 Grades—This specification is subdivided into various
D 149 Test Method for Dielectric Breakdown Voltage and
Dielectric Strength of Solid Electrical Insulating Materials grades of epoxy molding compounds based on physical prop-
erties. This specification provides for a system of characteriza-
at Commercial Power Frequencies
D 150 Test Methods for A-C Loss Characteristics and tion and identification which enables coverage for all commer-
ciallyavailablegradeshavingpropertieswithintherangeofthe
Permittivity (Dielectric Constant) of Solid Electrical Insu-
lating Materials possible combinations as may be selected from Table 1. A
gradeisdesignatedbythecellnumbersforeachpropertyinthe
D 256 Test Method for Determining the Pendulum Impact
Resistance of Notched Specimens of Plastics orderinwhichtheyarelistedinTable1.Whenapropertyisnot
specified, a “0” is entered as the cell number.
D 495 Test Method for High-Voltage, Low-Current, Dry
Arc Resistance of Solid Electrical Insulation 4.2 Classes—Each of the grades of epoxy molding com-
pound may be further subdivided into classes according to
D 570 Test Method for Water Absorption of Plastics
D 618 Practice for Conditioning Plastics and Electrical special requirements. A class is designated by a capital letter
followedbycelldesignationcorrespondingtotherequirements
detailed in Table 2. Where no special requirements, in addition
to grade properties, are needed, no class designation is shown.
This specification is under the jurisdiction of ASTM Committee D-20 on
Plastics and is the direct responsibility of Subcommittee D20.16 on Thermosetting
NOTE 3—An example of this classification system would be grade
Materials.
12324-D-00200-F-3 an epoxy molding compound having the following
Current edition approved Nov. 10, 1999. Published February 2000. Originally
requirements (see Table 1 and Table 2):
published as D 3013 – 72. Last previous edition D 3013 – 94.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
the ASTM website. Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
*A Summary of Changes section appears at the end of this standard.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
D3013–99
TABLE 1 Detail Grade Requirements for Epoxy Molding Compounds
Desig-
Grades (Cell Limits)
nation
Property and Unit
Order
01 2 3 4 5
No.
1 Water absorption, % in 24 h unspecified <0.16 0.16 to 0.30 0.31 to 1.0 1.1 to 3.0 >3.0
2 Flexural strength, MPa unspecified <42 42 to 69 70 to 103 104 to 207 >207
3 Impact resistance, unspecified
J/m of notch <22 22 to 53 54 to 267 268 to 534 >534
4 Tensile strength, unspecified
MPa <35 35 to 55 56 to 103 104 to 138 >138
5 Deflection temperature unspecified
under load,
°C 70 to 100 101 to 150 151 to 200 201 to 250 >250
TABLE 2 Detail Class Requirements for Epoxy Molding Compounds
Designa-
Classes (Cell Limits)
Class
Class tion Order Property and Unit
Designation
01 2 3 4 5
No.
Dielectric D 1 permittivity unspecified <3.81 3.81 to 4.50 4.51 to 5.00 5.01 to 6.00 >6.00
2 dissipation factor unspecified <0.016 0.016 to 0.03 0.04 to 0.10 0.11 to 0.20 >0.20
dielectric strength, V/mil
(short-time):
3 dry unspecified <301 301 to 325 326 to 350 351 to 400 >400
4 wet unspecified min 80 % of dry value using same test
5 arc resistance, s unspecified <61 61 to 110 111 to 140 141 to 180 >180
Flame-retardant F 1 flammability unspecified <25 25 to 40 >40 . .
5. General Requirements
5.1 The molding compounds shall be of uniform composi-
tionandsoformulatedastoconformtotherequirementsofthis
specification.
5.2 The apparent density, bulk factor, flow, particle size, and
color of the compounds shall be as agreed upon between the
purchaser and the seller in the order or contract. Properties
other than those specified in this specification may also be
agree
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