Standard Specification for Implantable Epoxy Electronic Encapsulants

ABSTRACT
This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological fluids. Chemical composition requirements may include additives, phthalate esters, amines, catalysts, and carbonates. The material shall be tested for the following physical properties: peak exotherm temperature, transparency, foreign particles, USP biological test plastic containers, USP pyrogen test, sterilant residues, cure shrinkage, embedment stress, tissue culture test, long-term immersion test, and accelerated immersion test. The material shall also be inspected with infrared spectroscopy, amine number, epoxide equivalent weight, spectrographic analysis, and total nitrogen.
SCOPE
1.1 This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts.  
1.2 The epoxy encapsulants covered by this specification are intended to provide a tissue-compatible protective covering for implantable medical devices such as pulse generators, telemetry devices, and RF receivers. The biocompatibility of epoxy plastics has not been established. Epoxy plastic is a generic term relating to the class of polymers formed from epoxy resins, certain curing agents or catalysts, and various additives. Since many compositions and formulations fall under this category, it is essential that the fabricator ensure safety of implantability of the specific composition or formulation for the intended use by current state-of-the-art test methods. This specification can be used as a basis for standardized evaluation of biocompatibility for such implantable encapsulants.  
1.3 The encapsulants covered by this specification are for use in devices intended as long-term implants.  
1.4 Limitations—This specification covers only the initial qualification of epoxy encapsulants for implantable electronic circuitry. Some of the requirements are not applicable to routine lot-to-lot quality control.  
1.5 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.7 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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Status
Published
Publication Date
31-Dec-2022
Current Stage
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ASTM F641-09(2023) - Standard Specification for Implantable Epoxy Electronic Encapsulants
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This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: F641 −09 (Reapproved 2023)
Standard Specification for
1
Implantable Epoxy Electronic Encapsulants
ThisstandardisissuedunderthefixeddesignationF641;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
1.1 This specification covers thermoset plastics based on
diglycidyl ethers of bisphenol A and amino functional curing
2. Referenced Documents
agents or amine catalysts.
2
2.1 ASTM Standards:
1.2 The epoxy encapsulants covered by this specification
D149Test Method for Dielectric Breakdown Voltage and
areintendedtoprovideatissue-compatibleprotectivecovering
DielectricStrengthofSolidElectricalInsulatingMaterials
for implantable medical devices such as pulse generators,
at Commercial Power Frequencies
telemetry devices, and RF receivers. The biocompatibility of
D150Test Methods forAC Loss Characteristics and Permit-
epoxy plastics has not been established. Epoxy plastic is a
tivity (Dielectric Constant) of Solid Electrical Insulation
generic term relating to the class of polymers formed from
D257Test Methods for DC Resistance or Conductance of
epoxy resins, certain curing agents or catalysts, and various
Insulating Materials
additives. Since many compositions and formulations fall
D570Test Method for Water Absorption of Plastics
under this category, it is essential that the fabricator ensure
D638Test Method for Tensile Properties of Plastics
safety of implantability of the specific composition or formu-
D790Test Methods for Flexural Properties of Unreinforced
lation for the intended use by current state-of-the-art test
and Reinforced Plastics and Electrical Insulating Materi-
methods. This specification can be used as a basis for stan-
als
dardized evaluation of biocompatibility for such implantable
D1042Test Method for Linear Dimensional Changes of
encapsulants.
Plastics Caused by Exposure to Heat and Moisture
1.3 The encapsulants covered by this specification are for
D1239Test Method for Resistance of Plastic Films to
use in devices intended as long-term implants.
Extraction by Chemicals
D1434TestMethodforDeterminingGasPermeabilityChar-
1.4 Limitations—This specification covers only the initial
acteristics of Plastic Film and Sheeting
qualification of epoxy encapsulants for implantable electronic
D2240TestMethodforRubberProperty—DurometerHard-
circuitry. Some of the requirements are not applicable to
ness
routine lot-to-lot quality control.
D2471PracticeforGelTimeandPeakExothermicTempera-
1.5 The values stated in SI units are to be regarded as
3
tureofReactingThermosettingResins(Withdrawn2008)
standard. No other units of measurement are included in this
D2562Practice for Classifying Visual Defects in Parts
standard.
Molded from Reinforced Thermosetting Plastics
1.6 This standard does not purport to address all of the
D2566Test Method for Linear Shrinkage of CuredThermo-
3
safety concerns, if any, associated with its use. It is the
setting Casting Resins During Cure (Withdrawn 1993)
responsibility of the user of this standard to establish appro-
D2734TestMethodsforVoidContentofReinforcedPlastics
priate safety, health, and environmental practices and deter-
D3137Test Method for Rubber Property—Hydrolytic Sta-
mine the applicability of regulatory limitations prior to use.
bility
1.7 This international standard was developed in accor-
F74Practice for Determining Hydrolytic Stability of Plastic
3
dance with internationally recognized principles on standard-
Encapsulants for Electronic Devices (Withdrawn 1994)
ization established in the Decision on Principles for the
F135TestMethodforEmbedmentStressCausedbyCasting
Development of International Standards, Guides and Recom-
1 2
This specification is under the jurisdiction of ASTM Committee F04 on For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Medical and Surgical Materials and Devices and is the direct responsibility of contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Subcommittee F04.11 on Polymeric Materials. Standards volume information, refer to the standard’s Document Summary page on
Current edition approved Jan. 1, 2023. Published January 2023. Originally the ASTM website.
3
approved in 1979. Last previous edition approved in 2014 as F641–09 (2014). The last approved version of this historical standard is referenced on
DOI: 10.1520/F0641-09R23. www.astm.org.
Copyright © ASTM Internat
...

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