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ASTM F508-77(2002)

(Practice)

Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

SCOPE
1.1 This practice covers the writing of specifications for thick-film pastes for electronics.  
1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.  
1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.
WITHDRAWN RATIONALE
Formerly under the jurisdiction of Committee F01 on Electronics, this practice was withdrawn in June 2008 in accordance with section 10.5.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

General Information

Status
Withdrawn
Publication Date
09-Dec-2002
Withdrawal Date
29-Jul-2008
ICS
31.260 - Optoelectronics. Laser equipment
Technical Committee
F01 - Electronics
Drafting Committee
F01.03 - Metallic Materials, Wire Bonding, and Flip Chip
Current Stage
Ref Project

Relations

Replaces
ASTM F508-77(1997)e1 - Standard Practice for Specifying Thick-Film Pastes
Effective Date
10-Dec-2002

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ASTM F508-77(2002) - Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)ASTM F508-77(2002) - Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
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ASTM F508-77(2002) - Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
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Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F 508–77(Reapproved 2002)
Standard Practice for
1
Specifying Thick-Film Pastes
This standard is issued under the fixed designation F 508; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 2.3.1.2 Drying and Leveling Characteristics—The specifi-
cationshouldstatetherangeofdryingtime,therangeofdrying
1.1 This practice covers the writing of specifications for
temperature, and the dried film (leveling) characteristics. The
thick-film pastes for electronics.
dried film characteristics may be specified by visual examina-
1.2 The practice provides a guide for the routine procedure
tion, for such defects as lifting or pinholes, and by a thickness
to be followed in specifying for procurement thick-film pastes
profile across the surface of the dried film.
for use in manufactured circuits. Specific requirements, in-
2.3.1.3 Firing Profile—The specification profile for each
tended applications, and test methods should be included or
specific style of paste.
identified in each paste specification. In addition, each speci-
2.3.1.4 Firing Atmosphere—For each style of paste and
fication should include basic information to facilitate procure-
firing profile, the specification should define the firing atmo-
ment, preparation, quality control, lot shipment identifications,
sphere.
and shipping of such pastes.
2.3.1.5 Test Substrate—The specification should specify
1.3 The practice covers the development of specifications
and identify the composition of the test substrate and the
for fireable, thick-film pastes, including resistor, conductor,
surface on which the paste is to be deposited.
dielectric, and overglaze pastes.
2.3.2 Test Pattern—Where applicable, the specification
2. Specification Form and Content shouldincludealayoutanddescriptionofasuitabletestpattern
forevaluatingprintedandfiredpastes.Thespecificationshould
2.1 Form—Each specification should be prepared in con-
2
also include a list and functions of other materials required to
formance with Form and Style for ASTM Standards.
perform the specified tests, that is, terminations, leads, etc.
2.2 Procurement Information—Information pertinent to
Consideration should be given to compatibility requirements
procurement should include the procuring organization’s
for all materials used.
name,location,address,telephonenumber,andthenameofthe
2.4 Quality Control—The specification should identify the
procurement agent, or anyone else involved in procurement or
quality control procedures to be employed. Such procedures
with the technical details of the specifications.
should include: a sampling plan, a sequence for each exami-
2.3 Technical Information—Each specification should cover
nation and test specified, and corresponding requirements for
the specific technical details, the performance requirements,
each method of examination or test.
and the precision or accuracy of measurements necessary for
2.5 Handling and Storing—Each specification should in-
the producer to supply the thick-film paste specified.
clude the method of handling and storing the pastes.
2.3.1 Processing Characteristics:
2.6 Performance Tests:
2.3.1.1 Screen Selection—The particular paste specifica-
2.6.1 Individual procurement specifications should include
tions should identify the required screen by the mesh count, the
requirements for each selected applicable test, inspection, and
wire size, and the emulsion thickness. Where metal masks are
examination listed in Table 1 and Table 2 for the given type of
to be used, the cavity thickness and the cavity-aperture
thick-film paste. The specification should include any other
tolerances should be specified. The specification should also
pertinent tests and inspections to cover special or specific
state the recommended nominal deposit thickness.
applications.
2.6.1.1 The test and inspection equipment specified should
1
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
be of sufficient accuracy and quality to permit the required tests
and is the direct responsibility of Subcommittee F01.03 on Metallic Materials.
and inspections to be carried out.
Current edition approved Dec. 10, 2002. Published May 2003. Originally
e1
approved in 1991. Last previous edition approved in 1997 as F 508 – 77 (1997) .
2
AvailablefromASTM,100BarrHarborDrive,WestConshohocken,Pa.19428.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
1

---------------------- Page: 1 ----------------------
F 508–77 (2002)
TABLE 1 Paste Characterization
A
Test Applies to
Test and Examination
Resistor Conductor Dielectric Overgl
...

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5.2.1.2 The quantum efficiency of the calibration source device (required as part of its calibration),
Note 1: See 10.10 of Test Method E1021 for the identity that converts spectral responsivity to quantum efficiency.
5.2.1.3 The spectral irradiance of the light source (measured with the spectral irradiance measurement equipment), and,
5.2.1.4 The reference spectral irradiance distribution to which the calibration source device was calibrated (see G173).  
5.2.2 Temperature Corrections—Test Method E973 provides means for temperature corrections to short-circuit current using the partial derivative of quantum efficiency with respect to temperature.  
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SCOPE
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1.2.1 The non-primary calibration will be with respect to the same reference spectral irradiance distribution as that of the calibration source device.  
1.2.2 The calibration source device may be a primary reference cell calibrated in accordance with Test Method E1125, or a non-primary reference cell calibrated in accordance with these test methods.  
1.2.3 For the special case in which the calibration source device is a primary reference cell, the resulting non-primary reference cell is also referred to as a secondary reference cell.  
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SIGNIFICANCE AND USE
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1.2 Setup, calibration, and test circuit evaluation procedures are also included in this test method.  
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1.4 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
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Standard Practice for Laser Technologies for Measurement of Cross-Sectional Shape of Pipeline and Conduit by Non-Rotating Laser Projector and CCTV Camera System

SIGNIFICANCE AND USE
4.1 Laser profiling assessment is a quality control tool for identifying and quantifying deformation, physical damage, and other pipe anomalies after installation, providing means and methods for determining the quality of workmanship and compliance with project specifications. Laser profiling can be used for:  
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4.2 A laser profile pre-acceptance and condition assessment survey provides significant information in a clear and concise manner, including but not limited to graphs and still frame digital images of pipe condition prior to acceptance, thereby providing objective data on the installed quality and percentage ovality, deformation, deflection or deviation, that is often not possible from an inspection by either a mandrel or CCTV only survey.
SCOPE
1.1 Laser profiling is a non-contact inspection method used to create a pipe wall profile and internal measurement using a standard CCTV pipe inspection system, 360 degree laser light projector, and special geometrical profiling software. This practice covers the procedure for the measurement to determine any deviation of the internal surface of installed pipe compared to the design. The measurements may be used to verify that the installation has met design requirements for acceptance or to collect data that will facilitate an assessment of the condition of pipe or conduit due to structural deviations or deterioration. This standard practice provides minimum requirements on means and methods for laser profiling to meet the needs of engineers, contractors, owners, regulatory agencies, and financing institutions.  
1.2 This practice applies to all types of pipe material, all types of construction, and pipe shapes.  
1.3 This practice applies to depressurized and gravity flow storm sewers, drains, sanitary sewers, and combined sewers with diameters from 6 to 72 in. (150 and 1800 mm).  
1.4 This standard does not include all aspects of pipe inspection, such as joint gaps, soil/water infiltration in joints, cracks, holes, surface damage, repairs, corrosion, and structural problems associated with these conditions.  
1.5 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.6 The profiling process may require physical access to lines, entry manholes, and operations along roadways that may include safety hazards.  
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. There are no safety hazards specifically, however, associated with the use of the laser ring profiler specified (listed and labeled as specified in 1.3).  
1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM F3095-17a(Practice)
Standard Practice for Laser Technologies for Direct Measurement of Cross Sectional Shape of Pipeline and Conduit by Rotating Laser Diodes and CCTV Camera System

SIGNIFICANCE AND USE
4.1 Laser profiling assessment is a quality control tool for identifying and quantifying deformation, physical damage, and other pipe anomalies after installation, providing means and methods for determining the quality of workmanship and compliance with project specifications. Laser profiling capabilities include:  
4.1.1 Measurement of the structural shape, cross sectional area and defects;  
4.1.2 Collection of data needed for pipe rehabilitation or replacement design; and  
4.1.3 Post rehabilitation, replacement or new construction workmanship verification.  
4.2 A laser profile pre-acceptance and condition assessment survey provides significant information in a clear and concise manner, including but not limited to graphs and still frame digital images of pipe condition prior to acceptance, thereby providing objective data on the installed quality and percentage ovality, or degree of deformation, deflection or deviation, that is often not possible from an inspection by either a mandrel or only CCTV.
SCOPE
1.1 This practice covers the procedure for the post installation verification and acceptance of buried pipe deformation using a visible rotating laser light diode(s), a pipeline and conduit inspection analog or digital CCTV camera system and image processing software. The combination CCTV pipe inspection system, with cable distance counter or onboard distance encoder, rotating laser light diode(s) and ovality measurement software shall be used to perform a pipe measurement and ovality confirmation survey, of new or existing pipelines and conduits as directed by the responsible contracting authority. This standard practice provides minimum requirements on means and methods for laser profiling to meet the needs of engineers, contractors, owners, regulatory agencies, and financing institutions.  
1.2 This practice applies to all types of material, all types of construction, or shape.  
1.3 This practice applies to gravity flow storm sewers, drains, sanitary sewers, and combined sewers with diameters from 6 to 72 in. (150 to 1800 mm).  
1.4 The Laser Light Diode(s) shall be tested, labeled and certified to conform to US requirements for CDRH Class 2 or below (not considered to be hazardous) laser products or certified to conform to EU requirements for Class 2M or below laser products as per IEC 60825-1, or both.  
1.5 The profiling process may require physical access to lines, entry manholes and operations along roadways that may include safety hazards.  
1.6 This practice includes inspection requirements for determining pipeline and conduit ovality only and does not include all the required components of a complete inspection. The user of this practice should consider additional items outside this practice for inspection such as joint gap measurement, soil/water infiltration, crack and hole measurement, surface damage evaluation, evaluation of any pipeline repairs, and corrosion evaluation.  
1.7 This standard practice does not address limitations in accuracy due to improper lighting, dust, humidity, fog, moisture on pipe walls or horizontal/vertical offsets. Care should be taken to limit environmental factors in the pipeline that affect accuracy of the inspection.  
1.8 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. There are no safety hazards specifically, however, associated with the use of the laser profiler specified (listed and labeled as specified in 1.3).  
1.10 This international standard was developed i...

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