F01 - Electronics
The development of test methods, specifications, practices, terminology, classifications, and guides; the promotion of knowledge, and the stimulation of research relating to electron devices and the materials, processes, process controls, and equipment used in their fabrication. Product areas include: (1) electron tubes; (2) semiconductor materials and devices of all kinds; (3) lasers and incoherent light sources and related sensing and transmitting devices; (4) nonmetallic thermoelectric materials and devices; (5) ferroelectric and nonmetallic magnetic materials and devices; (6) superconducting materials and devices used for signal processing or control; (7) passive parts and components that are processed by means of technology similar to that used to produce items included above; (8) interconnection networks, encapsulation materials and parts, and packages for the above; (9) assemblies and subassemblies of the above which become parts of components of larger circuits or systems; and (10) data storage devices. The Committee shall coordinate its efforts with other organizations and ASTM Committees working in this and related fields.
Electronics
The development of test methods, specifications, practices, terminology, classifications, and guides; the promotion of knowledge, and the stimulation of research relating to electron devices and the materials, processes, process controls, and equipment used in their fabrication. Product areas include: (1) electron tubes; (2) semiconductor materials and devices of all kinds; (3) lasers and incoherent light sources and related sensing and transmitting devices; (4) nonmetallic thermoelectric materials and devices; (5) ferroelectric and nonmetallic magnetic materials and devices; (6) superconducting materials and devices used for signal processing or control; (7) passive parts and components that are processed by means of technology similar to that used to produce items included above; (8) interconnection networks, encapsulation materials and parts, and packages for the above; (9) assemblies and subassemblies of the above which become parts of components of larger circuits or systems; and (10) data storage devices. The Committee shall coordinate its efforts with other organizations and ASTM Committees working in this and related fields.