Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.

Umgebungseinflüsse - Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten Anschlüssen

Essais d'environnement - Partie 2-20: Essais - Essai T: Méthodes d'essai de la brasabilité et de la résistance à la chaleur de brasage des dispositifs à broches

La CEI 60068-2-20:2008 décrit l'essai T qui s'applique aux dispositifs à broches. Les essais de brasage des composants pour montage en surface (CMS) sont décrits dans la CEI 60068-2-58. La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des dispositifs dans les applications utilisant des alliages de brasure, qui sont soit des brasures étain plomb (Pb) eutectique ou quasi eutectique, soit des alliages de brasure sans plomb. Les procédures de la présente norme incluent les méthodes dites de bain de brasage et de fer à braser. Le but de la présente norme est de s'assurer que les broches des composants ou la brasabilité de leurs extrémités est en mesure de satisfaire aux exigences applicables aux joints de brasures des CEI 61191-3 et 61191-4. De plus, des méthodes d'essai sont fournies pour s'assurer que le corps du composant peut résister à la charge calorifique à laquelle il est exposé pendant le brasage. Les principales modifications techniques par rapport à la quatrième édition sont les suivantes: - l'essai de gouttelette de brasure est supprimé; - des conditions et des exigences d'essai concernant les brasures sans plomb sont ajoutées.

Okoljski preskusi - 2-20. del: Preskusi - Preskus T: Preskusne metode za določanje spajkljivosti in odpornosti proti toploti spajkanja za komponente z izvodi (IEC 60068-2-20:2008)

General Information

Status
Published
Publication Date
24-Sep-2008
Withdrawal Date
31-Jul-2011
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available - Publishing
Start Date
25-Sep-2008
Completion Date
25-Sep-2008

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Umgebungseinflüsse -- Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten AnschlüssenEssais d'environnement -- Partie 2-20: Essais - Essai T: Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombésEnvironmental testing -- Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 60068-2-20:2008SIST EN 60068-2-20:2009en,de01-januar-2009SIST EN 60068-2-20:2009SLOVENSKI
STANDARDSIST HD 323.2.20 S3:20031DGRPHãþD



SIST EN 60068-2-20:2009



EUROPEAN STANDARD EN 60068-2-20 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-20:2008 E
ICS 19.040 Supersedes HD 323.2.20 S3:1988
English version
Environmental testing -
Part 2-20: Tests -
Test T: Test methods for solderability and resistance
to soldering heat of devices with leads (IEC 60068-2-20:2008)
Essais d'environnement -
Partie 2-20: Essais -
Essai T: Méthodes d'essai
pour la brasabilité et la résistance
à la chaleur de brasage
des dispositifs plombés (CEI 60068-2-20:2008)
Umgebungseinflüsse -
Teil 2-20: Prüfungen -
Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit
von Bauelementen mit herausgeführten Anschlüssen (IEC 60068-2-20:2008)
This European Standard was approved by CENELEC on 2008-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60068-2-20:2009



EN 60068-2-20:2008 – 2 – Foreword The text of document 91/764/FDIS, future edition 5 of IEC 60068-2-20, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60068-2-20 on 2008-08-01. This European Standard supersedes HD 323.2.20 S3:1988. The major technical changes with regard to HD 323.2.20 S3:1988 are the following: – the solder globule test is deleted; – test conditions and requirements for lead-free solders are added.
The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2009-05-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2011-08-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60068-2-20:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-54 NOTE
Harmonized as EN 60068-2-54:2006 (not modified). IEC 60068-2-58 NOTE
Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-69 NOTE
Harmonized as EN 60068-2-69:2007 (not modified). IEC 61190-1-3 NOTE
Harmonized as EN 61190-1-3:2007 (not modified). __________ SIST EN 60068-2-20:2009



– 3 – EN 60068-2-20:2008
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1 - 1) Environmental testing -
Part 1:
...

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---------------------- Page: 1 ----------------------
91/640/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJET DE COMITÉ POUR VOTE (CDV)
Project number IEC 60068-2-20, Ed. 5
Numéro de projet
IEC/TC or SC:
Secretariat / Secrétariat
TC 91
CEI/CE ou SC:
Japan


Submitted for parallel voting in Date of circulation Closing date for voting (Voting
CENELEC Date de diffusion mandatory for P-members)
Date de clôture du vote (Vote

2006-10-27

obligatoire pour les membres (P))
Soumis au vote parallèle au
CENELEC 2007-03-30
Also of interest to the following committees Supersedes document
Intéresse également les comités suivants Remplace le document
IEC TC 40, 47, 47D, 93, 104 91/554/CD – 91/602A/CC
Functions concerned
Fonctions concernées
Safety EMC Environment Quality assurance
Sécurité
CEM Environnement Assurance qualité
CE DOCUMENT EST TOUJOURS À L'ÉTUDE ET SUSCEPTIBLE DE THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT
MODIFICATION. IL NE PEUT SERVIR DE RÉFÉRENCE. SHOULD NOT BE USED FOR REFERENCE PURPOSES.
LES RÉCIPIENDAIRES DU PRÉSENT DOCUMENT SONT INVITÉS À RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR
PRÉSENTER, AVEC LEURS OBSERVATIONS, LA NOTIFICATION DES COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF
DROITS DE PROPRIÉTÉ DONT ILS AURAIENT ÉVENTUELLEMENT WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING
CONNAISSANCE ET À FOURNIR UNE DOCUMENTATION EXPLICATIVE. DOCUMENTATION.



Title :
Titre :
IEC 60068-2-20, Ed. 5: Environmental

testing – Part 2-20: Tests – Test T: Test
methods for solderability and resistance
to soldering heat of leaded devices


Note d'introduction Introductory note
La version française sera diffusée au stade This CDV was prepared based on 91/554/CD
FDIS and the discussion results of 91/602A/CC




ATTENTION ATTENTION
VOTE PARALLÈLE IEC – CENELEC
CEI – CENELEC PARALLEL VOTING
L’attention des Comités nationaux de la CEI, membres du The attention of IEC National Committees, members of
CENELEC, est attirée sur le fait que ce projet de comité CENELEC, is drawn to the fact that this Committee Draft for
pour vote (CDV) de Norme internationale est soumis au Vote (CDV) for an International Standard is submitted for
vote parallèle. parallel voting.
Un bulletin de vote séparé pour le vote CENELEC leur sera A separate form for CENELEC voting will be sent to them by
envoyé par le Secrétariat Central du CENELEC. the CENELEC Central Secretariat.

Copyright © 2006 International Electrotechnical Commission, IEC. All rights reserved. It is
permitted to download this electronic file, to make a copy and to print out the content for the sole
purpose of preparing National Committee positions. You may not copy or "mirror" the file or
printed version of the document, or any part of it, for any other purpose without permission in
writing from IEC.
FORM CDV (IEC) 2005-09-23

---------------------- Page: 2 ----------------------
2
60068-2-20, Ed. 5/CDV © IEC:200X   91/640/CDV

BASIC ENVIRONMENTAL TESTING PROCEDURES

Part 2: Tests – Test T: Test methods for solderability and resistance to
soldering heat of devices with leads
1 Scope and object
This part of IEC 60068 outlines test T, applicable to devices with leads. Soldering tests for
surface mounting devices (SMD) are described in IEC 60068-2-58.
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures in this standard include the solder bath method and soldering iron method.
The objective of this standard is to ensure that component lead or termination solderability
meets the applicable solder joint requirements of IEC 61191-3. In addition, test methods are
provided to ensure that the component body can resist against the heat load to which it is
exposed during soldering.
Note: Information about wetting time and wetting force can be obtained by test methods using a wetting balance.
See IEC 60068-2-54 (Bath method) and IEC 60068-2-69 (Solder globule method).
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undate
...

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